• Journal of the Korean Society for Nondestructive Testing
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• v.34 no.1
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• pp.77-84
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• 2014

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.43 no.3 s.309
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• pp.41-50
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• 2006

This paper presents a novel ultrasonic sensor system to overcome limited distance detection range that can be measured only more than 30cm by single ultrasonic transducer. This is accomplished by separation of receiving capacitive ultrasonic transducer from transmitting capacitive ultrasonic transducer. And hardwares and software of the system are described in detail. The system makes very close range as well as long range detect by wireless precisely. Frequency of trigger pulse is 10Hz, but it is very low frequency for transmitting data in wireless module. Therefore, for triggering between receiver and transmitter, an algorithm for mixing and distinguishing trigger pulse from carrier pulse by software is proposed. The system is designed by common microprocessor 8051. The performance of the proposed method has been assessed through two types. The first, transmitting and receiving transducer are put on both sides. And then, distance of two point is measured as far as 0mm. Secondly, transmitting transducer send out ultrasonic pulse and measure the time of flight(TOF) until a first echo from an object detected by the detached receiving transducer. The distance between the detached transducers and a reflecting object is measured as far as 7cm. Images of measured ultrasonic waves and TOF for two methods presented to prove effectiveness of results.

• Journal of the Korean Society for Nondestructive Testing
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• v.25 no.6
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• pp.446-450
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• 2005

We have built a spherically focused, not using acoustic mirrors, capacitive micromachined air-coupled ultrasonic transducer. A flexible backplate of a copper/polyimide backplate is used, permitting it to conform to a spherically shaped substrate. The backplate is patterned with $40-{\mu}m$ depressions having $80-{\mu}m$ center-to-center spacing. A $6-{\mu}m$ thick aluminized Mylar film completing the transducer is deformed to allow it to conform to the spherical backplate. The device's frequency spectrum is centered at 805kHz with -6dB points at 440 and 1210kHz.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.3
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• pp.383-390
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• 2018

Piezoelectric micro-machined ultrasonic transducers for highly directional speaker need DC bias voltage. Most existing power amplifiers are not suitable for use in highly directional transducers because they are based on AC. In addition, since the piezoelectric micro-machined ultrasonic transducer has a large capacitive reactance, the power efficiency of the power amplifier is very low. Thus this paper proposes a new high efficiency power amplifier with DC bias voltage. In addition, by designing a matching circuit to compensate the capacitive reactance of the micro-machined ultrasonic transducer, the power efficiency of the power amplifier increases. The operating characteristics of the proposed power amplifier was verified by an experimental prototype. The proposed power amplifier is expected to be widely used in designing and implementing other related power amplifiers.

• The Journal of the Acoustical Society of Korea
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• v.20 no.3E
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• pp.31-37
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• 2001

Finite element model of a cMUT is constructed using the commercial code ANSYS to analyze the cross talk mechanism. Calculation results of the complex load impedance seen by single capacitor cells are presented, and then followed by a calculation of the plane wave real load impedance seen by a parallel combination of many cells that are used to make a transducer. Cross talk between 1-D array elements is found to be due to two main sources: coupling through a Stoneley wave propagating at the transducer-water interface and coupling through Lamb waves propagating in the substrate. To reduce the cross talk level, the effect of various structural variations of the substrate are investigated, which include a change of its thickness and etched trenches or polymer walls between array elements.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.385-386
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• 2010

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.6
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• pp.581-589
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• 2004

In this study, the capacitive micromachined ultrasonic transducer(cMUT) was developed based on the previous research results. The cross sectional image of the developed cMUT was characterized. To measure the membrane displacement of the cMUT, the Michelson phase modulation fiber interferometer was constructed. The measured membrane displacement was in good agreement with the result of the finite element analysis. To estimate the ultrasonic wave generated by the cMUT, an ultrasonic system including a pulser, receiver and charge amplifier was used. The cMUT developed in this study shows a good performance and hence will be widely used in the non-contact ultrasonic applications.

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.5
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• pp.487-493
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• 2004

This study was conducted to develope a capacitive micromachined ultrasonic transducer (cMUT) which enable to high efficient non-contact transmit and receive the ultrasonic wave in air. Theoretical analysis and finite element analysis of the behavior of membrane (such as resonance frequency, membrane deflection, collapse deflection and collapse voltage) of the cMUT were performed. The design parameters of the cMUT such as the dimension and thickness of membrane, thickness of sacrificial layer, thickness and size of electrode were estimated. The resonance frequency of the membrane increased as the thickness of the membrane increased but decreased as the diameter of the membrane increased. The deflection of the membrane increased as d-c bias voltage increased. The collapse voltage of the membrane was analyzed.

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.6
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• pp.573-580
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• 2004

The main goal of this study was to develop a micro-fabrication process for the capacitive micromachined ultrasonic transducer (cMUT). In order to achieve this goal, the former research results of the micro-electro-mechanical system (MEMS) process for the cMUT were analyzed. The membrane deposition, sacrificial layer deposition and etching were found to be a main process of fabricating the cMUT. The optimal conditions for those microfabrication were determined by the experiment. The thickness, uniformity, and residual stress of the $Si_3N_3$ deposition which forms the membrane of the cMUT were characterized after growing the $Si_3N_3$ on Si-wafer under various process conditions. As a sacrificial layer, the growth rate of the $SiO_2$ deposition was analyzed under several process conditions. The optimal etching conditions of the sacrificial layer were analyzed. The microfabrication process developed in this study will be used to fabricate the cMUT.