• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.332-335
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• 2004

Boron Phosphide films were deposited on(III) Si substrate at $650^{\circ}C$, by the reaction of $B_2H_6$ with $PH_3$ using CVD. $N_2$ was employed as carrier gas. The optimal gas rates were 20 ml/min for $B_2H_6$, 60 ml/min for $PH_3$ ml/min and $1{\ell}/min$ for $N_2$. The films were annealed for 1hour in $N_2$ ambient at $550^{\circ}C$ and measured. The measurement of AFM shows that the average surface roughness is each $10.108{\AA}$ and $29.626{\AA}$. So, we could know every commonplace thing. The measurement of XRD shows that the films have the preferred orientation of(1 0 1). From SEM images, we could see that Boron Phosphide is showed of a structure, which is grain size, which is grain boundary size. Also, the measurement of AES is shown the films have $B_{13}P_2$ Stoichiometry. From WDX See that ingredient is detected each Boron and Phosporus. So, we could see that deposited BP thin film. In this study, we obtained the BP thin film by deposited in atmosphere pressure, and known to applicate as microwave absorbtion material of BP thin film.

• 공업화학
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• 제10권2호
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• pp.225-230
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• 1999

Li(DPM)을 원료로 hot wall 수평 관형 반응기를 이용하여 질소-산소 및 아르곤-산소의 분위기에서 $Li_2O$ 고체박막을 LPMOCVD법으로 합성하였다. XRD와 ESCA 분석으로부터 질소-산소 분위기에서는 $Li_2CO_3$막이, 아르곤-산소의 분위기에서는 $Li_2O$막이 성장하였음을 알아냈다. 성막된 산화리튬과 리튬카보네이트는 기판의 실리콘 성분과 반응하여 실리케이트를 형성하였다. 마이크로 trench법과 Monte Carlo 시뮬레이션에 의해 기상반응 속도상수 및 표면반응 속도상수가 얻어졌으며 이를 이용한 성막속도 계산치와 실험치를 비교한 결과 실험조건범위 내에서 잘 일치하였다.

• 한국세라믹학회지
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• 제26권2호
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• pp.235-241
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• 1989

A study on the APCVD(atmospheric pressure chemical vapor deposition) Al2O3 was done by using the aluminum-tri-isopropoxide/N2 reaction system at 40$0^{\circ}C$. When the flow rate of the carrier gas(N2) was over 2SLPM, heterogeneous reaction was observed. However, when the flow rate of the carrier gas was below 2SLPM, a porously deposited film or powder formation was observed. The film formed by a heterogeneous reaction was optically dense. The dense film is thought to be a kind of a hydrated alumina. After a thermal treatment of the film in the range of temperature from $600^{\circ}C$ to 1, 20$0^{\circ}C$, properties of the film seems to be changed due to dehydration and densification process. In the case of the powder on heat treatment(600~1, 20$0^{\circ}C$), both a phase transformation and the change of OH peak was observed.

• 대한전자공학회논문지SD
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• 제43권2호
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• pp.13-17
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• 2006

Pentacene channel PTFT(organic thin film transistor)을 SiOC 절연박막 위에서 thermal evaporation 방법을 이용하여 성장시켰다. CVD 방법으로 증착시킨 SiOC 절연막은 조성비에 따라 특성이 달라지므로 절연막 위에서의 펜타센의 화학적 반응을 조사하기 위해서 inorganic-type인 $O_2/(BTMSM+O_2)=0.5$의 비율을 갖는 SiOC 박막을 사용하였다. 펜타센 분자의 말단에서 SiOC 표면에서 Diels-Alder 반응에 의한 이중결합이 깨어지면서 안정된 성장을 하지만 온도가 높아감에 따라 표면에서의 $SN_2(bimolecular nucleophilic substitution)$ 반응과 연쇄적인 화학반응에 의해 .펜타센의 성장을 방해하는 것으로 나타났다.

• 한국재료학회지
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• 제3권1호
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• pp.12-18
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• 1993

단결정 실리콘위에 스퍼터법으로 증착된 티타니움막을 급속가열로에서 고상반응에 의해 형성시킨 면저항 1.2 ohm/sq. 내외의 TiS$i_2$ 박막에 있어서 열안정성을 상부절연막의 유무 및 종류에 따라 조사하였다. 상부절연막은 상압 CVD로 증착한 USG(Undoped Silicate Glass, Si$i_2$) 막과 플라즈마 CVD법으로 증착한 PE-SiN(S$i_3$$N_4$)막을 사용했다. 열안정성 평가는 90$0^{\circ}C$에서 시간을 달리하여 TiS$i_2$막, PE-SiN막, USG막의 스트레스는 각각 1.3${\times}{10^{9}}$, 1.25 ${\times}{10^{10}}$, 2.26 ${\times}{10^{10}}$ dyne/c$m^2$의 인장응력을 나타내었다. 응집현상은 TiS$i_2$의 응집현상은 Nabarro-Herring 마이크로 크리프에 의한 원자의 확산관점에서 검토되었다.

• Bulletin of the Korean Chemical Society
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• 제30권7호
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• pp.1573-1578
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• 2009

A computational study of the reactions between Zn-containing species, the products of the thermal decomposition of diethylzinc (DEZn) and water was investigated. The Zn-containing species – $C_2H_5)_2,\;HZnC_2H_5,\;and\;(ZnC_2H_5)_2$ – were assumed to react with water during ZnO metal organic chemical vapor deposition (MOCVD). Density functional theory (DFT) calculations at the level of B3LYP/6-311G(d) were employed for the geometry optimization and thermodynamic property evaluation. As a result dihydroxozinc, $Zn(OH)_2$, was the most probable reaction product common for all three Zn-containing species. A further clustering of $Zn(OH)_2$ was investigated to understand the initial stage of ZnO film deposition. In experiments, the reactions of DEZn and water were examined by in-situ Raman scattering in a specially designed MOCVD reactor. Although direct evidence of $Zn(OH)_2$ was not observed, some relevant reaction intermediates were successfully detected to support the validity of the gas phase reaction pathways proposed in the computational study.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2014년도 추계학술대회 논문집
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• pp.195-195
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• 2014

탄화규소(SiC)의 복합체는 고온강도, 내식성, 내마모성, 내화학 특성, 열충격성 및 기계적 특성이 우수하며 제조공정으로 CVD 공정은 많이 연구되어져 있으나 비교적 간단한 구조로 우수한 특성을 얻을 수 Si 증발입자 확산방법에 대한 체계적인 연구가 수행되고 있지 않다. 본 논문에서는 Si 증발입자가 탄소표면에서 확산 반응으로 형성되는 SiC 복합체에 대한 검토 및 연구 개발 동향을 기술한다.

• 한국재료학회지
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• 제12권11호
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• pp.850-855
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• 2002

Silica powders were prepared from $SiCl_4$-$H_2$O system by chemical vapor deposition process, and investigated on size control of the products with reaction conditions. The products were amorphous and nearly spherical particles with 130nm~50nm in size. The size distribution became narrow with the increase of [$H_2$O]/[SiCl$_4$] concentration ratio. The particle size decreased with the increase of reaction temperature, [$H_2$O]/[SiCl$_4$] concentration ratio and total flow rate. The specific surface area measured by BET method was about three times larger than that of electron microscope method.

• 산업기술연구
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• 제4권
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• pp.37-41
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• 1984

Deposits of SiC has been formed by a chemical vapor deposition technique involving the application of gaseous mixture of $CH_3SiCl_3$ (MTS) and $H_2$ onto graphite substrate. These are non-fluid bed deposits prepared in an induction-heated reactor. From the experimental results, the deposition reaction of SiC is controlled by surface reaction mechanism at the temperature range between $1,100^{\circ}C$ and $1,400^{\circ}C$. The morphology of the SiC deposits changes from amorphous type to coarse, faceted structure as temperature increase.

• 한국세라믹학회지
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• 제38권4호
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• pp.388-392
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• 2001

저압 화학증착법으로 등방성 흑연 기판 위에 탄화규소 증착층을 제조하였다. 반응관 내부의 전체 반응압력(이하 반응압력)을 1.5torr-100torr로 변화시켜 증착층의 미세구조에 미치는 영향을 조사하였다. 120$0^{\circ}C$ 이하에서는 전체 반응압력 변화에 상관없이 일정하게 낮은 증착속도를 보였으며, 미세구조는 round-top 구조를 나타내었다. 125$0^{\circ}C$, 10torr를 기준으로 증착온도와 반응압력이 증가함에 따라 미세구조가 round-top 구조에서 angular, faceted 구조로 변하였으며, 이는 반응압력이 증가함에 따라 증착기구가 표면반응에서 물질전달로 전이하였기 때문이다.