• 한국세라믹학회지
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• 제31권2호
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• pp.206-212
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• 1994

Effects of the film deposition process parameters on the properties such as deposition rate, etch rate, refractive index, stress and step coverage of plasma enhanced chemical vapor deposited (PECVD) tetraethylorthosilicate glass (TEOS) SiO2 film were investigated and analysed using SEM, FTIR and SIMS techniques. Increasing TEOS flow or decreasing O2 flow increased the deposition rate and the compressive stress of the oxide film but produced a less denser film. The deposition rate decreased owing to the decrease in the sticking coefficient of the TEOS and the O2 molecules onto the substrate Si with increasing the substrate temperature. Increasing the substrate temperature produced a denser film with a lower etch rate and the higher refractive index by lowering SiOH and moisture contents. Increasing the rf power increases the ion bombardment energy. This increase in energy, in turn, increases the deposition rate and tends to make the film denser. No appreciable changes were found in the deposition rate but the refractive index and the stress of the film decreased with increasing the deposition pressure. The carbon content in the plasma TEOS CVD oxide film prepared under our standard deposition conditions were very low according to the SIMS analysis results.

• 멤브레인
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• 제15권4호
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• pp.330-337
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• 2005

[ $250^{\circ}C$의 고온에서 수증기 선택 투과 특성을 가지는 silica 막을 메탄을 탈수에 의한 dimethyl ether (DME) 합성 반응에 분리막 반응기로 적용하였다. Silica 전구체로서 tetraethoxysilane (TEOS)을 이용하여 초음파 분무 열분해 및 기상화학 증착법(CVD)법 등에 의해 다공성 스테인레스 스틸(SUS)에 silica 막을 합성하였다. CVD법에 의해 합성한 silica막의 수증기 투과도 및 메탄올에 대한 분리계수 상관관계 trade-off 선이 열분해 silica 막보다 높이 존재하였다. 수증기 투과도가 $1.2\times10^{-7}\;mol\;{\cdot}\;m^{-2}\;{\cdot}\;S^{-1}\;{\cdot}\;Pa^{-1}$ 이상이고, 메탄올에 대한 분리계수가 10 이상의 성능을 가지는 분리막 반응기에 대해서 기존 반응기 대비 $20\%$ 이상 메탄을 전환율이 향상되었다. 고온 수증기 선택성 silica 막이 메탄을 탈수 반응에 의해 생성되는 수증기를 제거함으로서 촉매 활성 저하를 억제하여 반응 전환율을 개선시키는 막 반응기로서의 효과를 확인할 수 있었다.

• 한국결정성장학회지
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• 제24권6호
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• pp.242-245
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• 2014

탄화규소의 화학기상증착 중에 두께 균일성을 향상시키기 위하여 평행하게 회전하는 3단 서셉터를 포함하는 CVD 장치에 대하여 전산유체역학(CFD) 시뮬레이션을 수행하였다. 실제 증착 실험에서는 단 간의 두께 균일성은 상당히 만족스러웠으나 같은 단 위에서는 위치에 따라 두께가 균일하지 못한 3C-SiC 상이 얻어지는 것을 확인하였다. 불균일의 원인으로는 서셉터의 회전 속도에 따른 영향으로 판단되었다. CFD 결과로부터 단 간의 균일성을 향상시키기 위해서는 120도 분기 노즐을 주입구에 설치하는 것이 바람직할 것으로 판단되었으며 단 내의 균일도 향상은 회전 속도를 줄임으로써 가능할 것으로 생각된다. 이렇게 제작된 탄화규소가 증착된 흑연 부품은 고경도, 내산화성 및 분진 억제 특성을 갖고 있어서 반도체용 부품으로 사용될 수 있다.

• 한국산업보건학회지
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• 제20권3호
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• pp.184-191
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• 2010

Although the usage of nanomaterials including carbon nanotubes (CNTs) has increased in various fields, scientific researches on workers' exposures and controls of these materials are very limited. The purpose of this study was to compare the airborne nanoparticles concentrations from two university laboratories conducting experiments of CNTs growth based on containment of thermal chemical vapor deposition (CVD). Airborne nanoparticle concentrations in three metrics (surface area concentration, particle number concentration, and mass concentrations) were measured by task using three direct reading instruments. In a laboratory where CVD was not contained, the surface area concentration, number concentration and mass(PM$_1$) concentration of airborne nanoparticles were 1.5 to 3.5 times higher than those in the other laboratory where CVD was confined. The ratio of PM$_1$ concentration to total suspended particles(TSP) in the laboratory where CVD was not confined was about 4 times higher than that in the other laboratory. This indicates that CVD is a major source of airbone nanoparticles in the CNTs growth laboratories. In conclusion, researchers performing CNTs growth experiments in these laboratories were exposed to airborne nanoparticles levels higher than background levels, and their exposures in a laboratory with the unconfined CVD were higher than those in the other laboratory with the confined CVD. It is recommended that in the CNTs growth laboratories adequate controls including containment of CVD be implemented for minimizing researchers' exposures to airborne nanoparticles.

• 한국전기전자재료학회논문지
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• 제33권5호
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• pp.344-349
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• 2020

Modern thin film deposition processes require high deposition rates, low costs, and high-quality films. Atmospheric pressure plasma-enhanced chemical vapor deposition (AP-PECVD) meets these requirements. AP-PECVD causes little damage on thin film deposition surfaces compared to conventional PECVD. Moreover, a higher deposition rate is expected due to the surface heating effect of atomic hydrogens in AP-PECVD. In this study, polycrystalline silicon thin film was deposited at a low temperature of 100℃ and then AP-PECVD experiments were performed with various plasma powers and hydrogen gas flow rates. A deposition rate of 15.2 nm/s was obtained at the VHF power of 400 W. In addition, a metal foam showerhead was employed for uniform gas supply, which provided a significant improvement in the thickness uniformity.

• The Korean Journal of Ceramics
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• 제1권1호
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• pp.21-28
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• 1995

Electrical conductivity of $TiO_2$ thin films, deposited on $Al_2O_3$ substrates by metal organic chemical vapor deposition (MOCVD), was measured by four-point probe method in a temperature range from $800^{\circ}C$ to $1025^{\circ}C$ and an oxygen partial pressure range from $2.7{\times}10^{-5}$ atm to 1 atm. In the low oxygen partial pressure region n-type conduction was dominant, but in the high oxygen partial pressure region p-type conduction behavior appeared due to substitution of Ti ions by Al ions, which were diffused from the substrate during post deposition annealing process. Electrical conductivity of the film decreases in the n-type region and increases in the p-type region as the oxygen partial pressure increases. The transition points, which show the minimum conductivity, shifted to the higher oxygen partial pressure region as the measuring temperature increased, but it shifted to lower oxygen partial pressure region with an increase in the post annealing temperature. The results were also discussed with the possible defect models.

• Transactions on Electrical and Electronic Materials
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• 제14권4호
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• pp.165-171
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• 2013

Nanostructured pure a-C and nitrogen doped a-C: N thin films with small particle size of, ~50 nm were obtained by Aerosol-assisted CVD method from the natural precursor camphor oil. Five samples were prepared for the a-C and a-C: N respectively, with the deposition temperatures ranging from $400^{\circ}C$ to $600^{\circ}C$. At high temperature, the AFM clarifies an even smoother image, due to the increase of the energetic carbon ion bombardment at the surface of the thin film. An ohmic contact was acquired from the current-voltage solar simulator characterization. The higher conductivity of a-C: N, of ${\sim}{\times}10^{-2}Scm^{-1}$ is due to the decrease in defects since the spin density gap decrease with the nitrogen addition. Pure a-C exhibit absorption coefficient, ${\alpha}$ of $10^4cm^{-1}$, whereas for a-C:N, ${\alpha}$ is of $10^5cm^{-1}$. The high ${\sigma}$ value of a-C:N is due to the presence of more graphitic component ($sp^2$ carbon bonding) in the carbon films.

• 한국응용과학기술학회지
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• 제30권3호
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• pp.423-430
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• 2013

Carbon coils could be synthesized using $C_2H_2/H_2$ as source gases and $SF_6$ as an incorporated additive gas under thermal chemical vapor deposition (CVD) system. Prior to the carbon coils deposition reaction, two kinds of samples having different combination of Ni catalyst and substrate were employed, namely, a commercially-made $Al_2O_3$ ceramic boat with Ni powders and a commercially-made $Al_2O_3$ substrate with Ni layer. By using a commercially-made $Al_2O_3$ ceramic boat, the synthesis of carbon coils could be enhanced as much as 10 times higher than that of $Al_2O_3$ substrate. Furthermore, the dominant formation of the microsized carbon coils could be obtained by using $Al_2O_3$ ceramic boat. The surface roughness of the supporting substrate of $Al_2O_3$ ceramic boat was understood to be associated with the large scale synthesis of carbon coils as well as the dominant formation of the larger-sized, namely the microsized carbon coils.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.495-498
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• 2006

The influence of various process parameters for the as-deposited poly silicon was investigated. The polycrystalline silicon films were successfully deposited on glass substrates at a low-temperature $(<200^{\circ}C)$ using the catalytic chemical vapor deposition (Cat-CVD). We achieved a low hydrogen content $({\sim}0.9%)$ and a high deposition rate $({\sim}35{\AA}/sec)$. The film is applicable to thin film transistors on plastic substrates.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.905-908
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• 2000

The growth properties of diamond grain were examined by Raman spectroscopy and microscope images. Diamond thin films were prepared on single crystal Si wafers by microwave Plasma chemical vapor deposition. Preparation conditions, substrate temperature, boron concentration and deposition time were controlled differently. Prepared diamond thin films have different surface morphology and grain size respectively Diamond grain size was gradually changed by substrate temperature. The biggest diamond grain size was observed in the substrate, which has highest temperature. The diamond grain size by boron concentration was slightly changed but morphology of diamond grain became amorphous according to increasing of boron concentration. Time was also needed to be a big diamond grain. However, time was not a main factor for being a big diamond grain. Raman spectra of diamond film, which was deposited at high substrate temperature, showed sharp peaks at 1334$cm^{-1}$ / and these were characteristics of crystalline diamond. A broad peak centered at 1550$cm^{-1}$ /, corresponding to non-diamond component (sp$^2$carbon), could be observed in the substrate, which has low temperature.