• 대한전기학회논문지
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• 제43권2호
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• pp.312-317
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• 1994

We studied the fabrication and electrical characteristics of high voltage hydrogenerated amorphous silicon thin film transistor using plasma enchanced chemical vapor deposition(PECVD). The device shows 2500${\AA}$ SiOS12T, 400-1500${\AA}$ a-Si tickness, 350V output voltage and 9.55${\times}$10S04T average on/off current ratio. We found that the leakage current of high voltage TFT occurred 0-70V drain voltage. As the leakage current depend on the a-Si thickness, the leakage current of high voltage TFT decreased by reduction of the a-Si thickness.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.768-771
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• 2007

Carbon nanotubes (CNTs) were synthesized by inductively coupled plasma CVD at $450^{\circ}C$. CNTs were grown on the 1-nm-thick Fe-Ni-Co with $C_2H_2$ and $H_2$ at different pressures and plasma powers. CNTs were grown longer in height as the $H_{\alpha}/CH$ ratios became lower by decreasing plasma powers and increasing growth pressures.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 C
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• pp.1494-1496
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• 2000

We have studied the temperature dependence on the growth and structure of carbon nanotubes using thermal chemical vapor deposition. All the carbon nanotubes have bamboo shaped multi walled structure with closed tip. The growth rate and density of carbon nanotubes increase with increasing growth temperature. The numbers of graphite sheet at the wall increase with increasing growth temperature. The crystallinity of graphite sheets become enhanced at the high growth temperature.

• 전자통신동향분석
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• 제3권2호
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• pp.56-60
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• 1988

반도체 가스의 순도에 따라 반도체 박막의 특성이 좌우되기 때문에 현재의 고순도 가스에서 초고순도 가스로 사용하여야 한다. 최근 반도체 공정기술은 화학증착법으로 많은 특수 가스를 사용하는데 이런 가스들은 사전에 가스에 대한 전문 지식과 기술을 충분히 이해한 다음 사용하여야만 고성능화 공정기술이 가능하다. 반도체용 가스는 회로의 집적도가 높아짐에 따라 요구되는 가스의 품질이 점점 고순도화되고 있다. 따라서 현 반도체 공정에 사용되는 가스 순도를 초고순도화 시켜야만 초고집적 소자인 4M DRAM, 16M DRAM, 64M DRAM 제품 개발 및 제조가 가능하다. 다시말해서 공정에 따른 주변조건이 이루어져야 만 반도체 산업이 크게 신장 할 수 있다. 최근 반도체 공정 기술로는 플라즈마(Plasma), 드라이에칭(Dry etching), CVD(Chemical Vapor Deposition), MOCVD(Metal Organic Chemical Vapor Deposition), Ion Implantation, EPI 공정으로 거의 대부분 공정 가스가 가연성, 폭발성, 독성, 부식성 이기 때문에 한번 취급을 잘못하면 막대한 인명 및 재산 피해를 입히므로 취급상 특별한 주의를 요하고 사전에 가스의 전문 지식과 기술을 충분히 이해한 다음 사용하여야 한다.

• Journal of Electrical Engineering and Technology
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• 제7권6호
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• pp.983-989
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• 2012

The purpose of this paper is to decide the optimum synthesis conditions of polycrystalline diamond films according to the ratio of gas mixture. Diamond films were deposited with cyclo-hexane as a carbon precursor by the microwave plasma enhanced chemical vapor deposition process. The optimum oxygen ratio to cyclo-hexane was reached about 125 % under the fixed 0.3% c-hexane in hydrogen. Oxygen plays a role in etching the graphitic components of carbon sp2 bond effectively. By OES measurement, the best synthesis conditions found out about 12.5 % and 15.75 %, which is the emission intensity ratios of CH(B-X) and $H{\beta}$ on $H{\alpha}$, respectively. Also, the electron temperature was similar about 5,000 to 5,200 K in this work.

• 한국전기전자재료학회논문지
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• 제17권6호
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• pp.647-651
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• 2004

We fabricated the 1-inch diode type flat lamp using CNTs, which were grown directly on soda-lime glass substrate at 600 ∼ 650 $^{\circ}C$ by thermal chemical vapor deposition(CVD) of acetylene gas. Turn- on field was about 2.8 V/${\mu}{\textrm}{m}$. We observed that uniform and high brightness had been obtained. The brightness of CNT flat lamp was measured up to about 14 kcd/$m^2$ at 2000V in spacing of 500 ${\mu}{\textrm}{m}$. The results showed that the CNTs were very good emission source and suitable for application in the lamp.

• 멤브레인
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• 제14권3호
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• pp.201-206
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• 2004

열화학적 IS 공정에서 요오드화수소의 분해에 적용하기 위하여 화학증착법(CVD)으로 제조된 silica 막의 안정성을 HI-$H_2O$ 기상 혼합물에서 평가하였다. Si 원천으로 tetraethoxysilane을 사용하여 서로 다른 CVD 온도로 기공크기가 100 nm인 $\alpha$-alumina를 처리하였다. CVD온도는 $700^{\circ}C$, $650^{\circ}C$, $600^{\circ}C$이었다. $600^{\circ}C$에서 수행한 단일 성분의 투과 실험에서 측정한 막의 $H_2$/$N_2$ 선택도는 CVD 온도 $700^{\circ}C$의 M1 막은 43.2, $650^{\circ}C$의 M2 막은 12.6, $600^{\circ}C$의 M3 막은 8.7을 나타내었다. HI-$H_2O$ 기상 혼합물에서 안정성 실험은 $450^{\circ}C$에서 수행하였는데, CVD 온도 $650^{\circ}C$에서 처리된 막이 다른 온도에서 처리된 막보다 더 안정성이 더 좋은 결과를 얻었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.171-171
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• 2012

Neutral beam assisted chemical vapor deposition (NBa-CVD) process has been developed as a nove,l room temperature deposition process for the light-soaking free nano-crystalline silicon (nc-Si) thin films including intrinsic and n-type doped thin film. During formation of nc-Si thin films by the NBa-CVD process with silicon reflector at room temperature, the energetic particles enhance doping efficiency and crystalline phase in nc-Si thin films without additional heating at substrate. The effects of incident NB energy controlled by the reflector bias have been confirmed by Raman spectra analysis. Additionally, TEM images show uniform nc-Si grains which imbedded amorphous phase without incubation layer. The nc-Si films by the NBa-CVD are hardly degenerated by light soaking; the degradations of photoconductivity were just a few percents before and after light irradiation.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.386-388
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• 1996

Low dielectric constant fluorinated oxide (SiOF) films were deposited using SiF$_4$/O$_2$/SiH$_4$mixtures by electron cyclotron resonance chemical vapor deposition (ECR CVD). Chemical composition of SiOF films was investigated by Fourier transform infrared spectroscopy (FT-lR). The fluorine content in the SiOF film observed by X-ray photoelectron spectroscopy (XPS). The dielectric constant decreased with increasing of the SiF$_4$ flow rate about 8sccm. The SiOF film, deposited with SiF$_4$=8 sccm, exhibited a F content of 5 atomic % and a relative dielectric constant 3.45. For evaluating SiOF films stability, humidity tests were performed.

• 대한기계학회논문집A
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• 제32권3호
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• pp.209-216
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• 2008

The application of focused ion beam (FIB) depends on the optimal interaction of the operation parameters between operating parameters which control beam and samples on the stage during the FIB deposition process. This deposition process was investigated systematically in C precursor gas. Under the fine beam conditions (30kV, 40nm beam size, etc), the effect of considered process parameters - dwell time, beam overlap, incident beam angle to tilted surface, minimum frame time and pattern size were investigated from deposition results by the design of experiment. For the process analysis, influence of the parameters on FIB-CVD process was examined with respect to dimensions and constructed shapes of single and multi- patterns. Throughout the single patterning process, optimal conditions were selected. Multi-patterning deposition were presented to show the effect of on-stage parameters. The analysis have provided the sequent beam scan method and the aspect-ratio had the most significant influence for the multi-patterning deposition in the FIB processing. The bitmapped scan method was more efficient than the one-by-one scan type method for obtaining high aspect-ratio (Width/Height > 1) patterns.