• Geomechanics and Engineering
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• 제29권1호
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• pp.79-90
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• 2022

Soybean-urease induced carbonate precipitation (EICP), as an alternative to microbially induced carbonate precipitation (MICP), was employed for soil improvement. Meanwhile, soluble calcium produced from industrial waste carbide slag powder (CSP) via the acid dissolution method was used for the EICP process. The ratio of CSP to the acetic acid solution was optimized to obtain a desirable calcium concentration with an appropriate pH. The calcium solution was then used for the sand columns test, and the engineering properties of the EICP-treated sand, including unconfined compressive strength, permeability, and calcium carbonate content, were evaluated. Results showed that the properties of the biocemented sand using the CSP derived calcium solution were comparable to those using the reagent grade CaCl₂. Scanning electron microscopy (SEM) and X-ray diffraction (XRD) analyses revealed that spherical vaterite crystals were mainly formed when the CSP-derived calcium solution was used. In contrast, spherical calcite crystals were primarily formed as the reagent grade CaCl₂ was used. This study highlighted that it was effective and sustainable to use soluble calcium produced from CSP for the EICP process.

• Bulletin of the Korean Chemical Society
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• 제32권spc8호
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• pp.3017-3021
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• 2011

Two chiral stationary phases (CSPs) based on (3,3'-diphenyl-1,1'-binaphthyl)-20-crown-6 bonded covalently to silica gel were applied for the first time to the resolution of racemic vigabatrin and its analogue ${\gamma}$-amino acids and the resolution results were compared to those on the commercially available Crownpak CR(+) based on (3,3'-diphenyl-1,1'-binaphthyl)-20-crown-6 coated dynamically onto octadecylsilica gel. While vigabatrin was not resolved at all on Crownpak CR(+), it was resolved quite well on the two CSPs. Among four vigabatrin analogue ${\gamma}$-amino acids, only two were resolved on Crownpak CR(+), but three were resolved on the CSP (CSP 1) containing residual silanol groups and all of four were resolved on the CSP (CSP 2) containing residual silanol group-protecting n-octyl groups. The improved lipophilicity in CSP 2 was proposed to be responsible for its superiority to CSP 1 for the resolution of vigabatrin and analogue ${\gamma}$-amino acids. In addition, the composition of aqueous mobile phase was found to affect the chiral recognition behaviors for the resolution of vigabatrin and analogue ${\gamma}$-amino acids on CSP 2.

• KSBB Journal
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• 제19권1호
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• pp.78-82
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• 2004

곰팡이인 Mortierella alpina DSA-12를 이용한 arachidonic acid의 생산을 위한 유기질소원의 선정과 배양 조건의 결정에 연구를 수행하였다. Corn steep powder (CSP)를 원료의 가격과 arachidonic acid의 생산을 기준으로 유기질소원으로 선정하였다. 탄소원으로 glucose와 질소원으로 CSP를 사용한 경우에 최적의 C/N ratio는 15-17 범위이다. Arachidonic acid의 생산을 위한 최적의 배양조건은 $25^{\circ}C$에서 500 rpm의 교반과 0.5 vvm의 통기이며, 이 때 50 g/L의 glucose와 18 g/L의 CSP로부터 21.8 g/L의 균사체량에 10.2 g/L의 총 지질을 얻을 수 있었으며, arachidonic acid의 농도는 3.70 g/L이었다. 500 L의 발효조에서 0.5 vvm과 200 rpm의 교반으로 실험을 수행한 결과 19.8 g/L의 균사체량과 9.1 g/L의 총 지질 및 3.67 g/L의 arachidonic acid를 얻었다. 이러한 결과는 bench-scale의 발효조에서도 질소원으로 CSP를 이용하여 arachidonic acid의 생산이 가능함을 보여주었다.

• 한국산학기술학회논문지
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• 제16권8호
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• pp.5260-5266
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• 2015

무기체계 개발 시 종합군수지원 측면에서 중요한 것 중 하나가 동시조달수리부속 산출이다. 동시조달수리부속은 무기체계 가용도 향상 측면에서 매우 중요한 것으로, 이에 대한 다양한 연구가 이루어지고 있다. 그러나 대부분의 연구는 하부 구성품의 고장이 무기체계의 다양한 기능에 미치는 세부 영향들을 고려하지 못하고 있다. 즉 하부 구성품의 고장이 무기체계의 특정 기능에 미치는 영향이 미비하면, 구성품 교환과 같은 정비가 필요 없다는 점을 고려하지 못한다. 그래서 본 연구에서는 고장-기능 간 관계도를 이용하여, 하부 구성품의 고장이 무기체계의 다양한 기능에 미치는 세부 영향을 고려한 동시조달수리부속 산출 방법을 기술하였다. 본 연구 절차는 다음과 같다. 첫째, 무기체계의 운용 및 정비 시스템을 분석한다. 둘째, 고장-기능 간 관계도를 개발한다. 셋째, 수집된 자료를 바탕으로 시뮬레이션 모델을 설계 한다. 마지막으로, 시뮬레이션과 메타 휴리스틱 모형인 진화 전략을 통해 동시조달수리부속 최적 수량을 선정한다. 해당 연구는 동시조달수리부속 산출 연구에 새로운 방향을 제시하였다.

• 한국컴퓨터정보학회논문지
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• 제12권3호
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• pp.251-258
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• 2007

웹서비스 기술의 활성화와 더불어, XML 문서에 대한 접근통제기술이 새롭게 개발되었다. 그 결과, 기존의 접근통제시스템에서와 마찬가지로, 중요정보 자원에 대한 접근통제문제에 대한 연구가 큰 각광을 받고 있다. 본 논문에서는 XML 문서에 대한 접근통제정책을 정형명세언어인 CSP로 변환하는 방법을 제시한다. 이를 위해, 첫째, XPath 경로지정 언어로 표현된 XML 문서의 계층적 접근을 CSP 프로세스 알제브라로 변환하는 방법을 소개한다. 둘째, XML 스키마 문서를 오토마타 형태의 정형모델로 표현하는 방법을 설명한다. 셋째, XML 접근통제정책에 사용되는 적용 규칙 및 충돌규칙의 의미론을 프로세스 알제브라 언어로 표현하는 방법을 제시한다. 마지막으로, 본 논문에서 제시한 방법론의 타당성을 보이기 위해, XML 스키마 문서 및 경로지정 표현에 대한 CSP 명세 예제를 보여준다.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2011년도 추계학술발표대회 논문집
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• pp.324-327
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• 2011

SolarPACES(Solar Power and Chemical Energy systems) is an international organization under the REWP(Renewable Energy Working Party)in the IEA(International Energy Agency) and focuses on the technology development and market expansion of CSP(Concentrating Solar Power). Seventeen countries including Rep. of Korea participate in the ExCo(Executive Committee) of SolarPACES. The ExCo meeting helds two times in a year and the second ExCo meeting opens in company with the five Task meetings. Rep. of Korea takes part in the Task-1officially. The 81th ExCo and Task meetings were held during September 18 and 19 in Spain with SolarPACES conference which also continued in succession to September 23 in this year. This paper introduces the activities which have been under progressed in the Task-1 and Task-3based on this time attendance of the meeting. In accordance with the expansion of CSP market and technology development, the needs for the standardization and project status underway in the world are increasing. Therefore, build an international project database and standard of the CSP technology are the main activities in the Task-1 and the standardization is also connected with the Task-3. In addition, to increase the reliability of the new technology of CSP and to reduce the concern of investors, the Task-1 is making guidelines for CSP performance prediction which can provide medium quality calculated performance data of PTC(Parabolic Trough Concentrator) type technology widely used and occupies over 90% CSP market.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.87-126
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• 1999

• Journal of Welding and Joining
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• 제19권1호
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• pp.21-23
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• 2001

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.418-421
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• 2005

The objective of this research work is to investigate the effects of process parameters, such as power of laser, travel speed of laser and material thickness, on kerfwidth and characteristics of the cut surface for the case of cutting of CSP 1N sheet using high power continuous wave Nd:YAG laser. In order to find relationship between the process parameters on the quality of the cut section, such as kerfwidth, surface roughness and the striation formation, several laser cutting experiments are carried out. From the results of experiments, an optimal cutting speed for each cutting condition has been obtained to improve the quality of the cut surface.

• 마이크로전자및패키징학회지
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• 제8권2호
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.