• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1241-1246
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• 2004

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.

• Journal of Energy Engineering
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• v.12 no.1
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• pp.17-22
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• 2003

The present study was conducted to obtain the fundamental knowledge on the manufacturing and operating characteristics of a small scale CPL (Capillary Pumped Loop) heat pipe. CPL heat pipes are able to transfer heat effectively at any orientation in a gravitational field over long distances. An experimental model with an evaporator of a circular plate shape was designed and manufactured and its operating performances were tested. A Bronze powder sintered metal plate of 3 mm thick and $\Psi$ 50 mm was used as wick and ethanol was used as working fluid. An experimental apparatus was set up to ascertain the operating conditions oi CPL at different heat load and an surrounding temperature at the condenser was maintained about 13$^{\circ}C$.