• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.12
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• pp.924-927
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• 2013

In this study, we proposed CMP-PLAs to replace the Al heat sinks as heat sink materials, and investigated heat dissipation characteristics of the LED lighting devices using them. The crystallinity of the proposed CMP-PLA heat sinks decreased with increasing carbon nanotube contents in CMP-PLA. However, the thermal conductivity was improved with the increase of the carbon nanotube contents. The heat dissipation characteristics of the LED lighting devices using CMP-PLA heat sinks was improved with increasing carbon nanotube contents in CMP-PLA. For the LED lighting devices using CMP-PLA heat sinks with 40% carbon nanotube contents, the initial temperature measured at the heat sink plate was $27^{\circ}C$, which increased as time, and it was saturated around $56^{\circ}C$ after an hour. The LED lighting devices using CMP-PLA heat sinks are expected to be functional materials that can reduce their weight and improve their electric properties, compared to those using existing Al heat sinks.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.12
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• pp.920-923
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• 2013

In this paper, the characteristics of a carbon nanotube composite heat sink proposed to replace the advanced Al heat sinks for LED lighting devices were studied. Proposed CMP-PLA heat sink was made by mixing 20~70 wt% carbon nanotube, 20~70 wt% bio-degradable polymer of melt-blended PLA (poly lactic acid) and PBS (poly butylene succinate) and PLA nucleating agents composed of the mixture of soybean oil and biotites, at $150{\sim}220^{\circ}C$ with 1,000~1,500 rpm. Optical and electric characteristics of 7.5 W LED lighting devices using heat sinks with such prepared CMP-PLA were investigated. And, the properties of the heat, which was not released from the CMP-PLA type heat sinks, was also investigated. The color temperature of LED lighting devices using the CMP-PLA heat sinks was 5,956 K, which is x= 0.32 and y= 0.34 in the XY chromaticity, and the color rendering index was 75. The luminous flux and the luminous efficiency of LED lighting devices using the CMP-PLA heat sinks was 540.6 lm and 72.68 lm/W respectively. Measured initial temperature of the heat sinks was $27^{\circ}C$, and their temperature increased as time to be saturated at $52^{\circ}C$ after an hour.

• Polymer(Korea)
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• v.33 no.2
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• pp.164-168
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• 2009

The effects of chemically modified thermoplastic starch (CMPS) on the morphology, thermal and mechanical properties of the blends of poly (lactic acid)(PLA) and poly(butylene adipate-co-terephthalate)(PBAT) were studied. Blends of PLA/PBAT with the CMPS contents of 10, 20 and 30 wt% on the basis of PLA/PBAT weight were prepared by a twin screw extruder. The morphology, thermal and mechanical properties of the blends were examined by using scanning electron microscope (SEM), differential scanning calorimeter (DSC) and a tensile tester. The DSC study revealed that PLA/PBAT blends are thermodynamically immiscible, while the compatibility was much improved by addition of the CMPS.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.99-105
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• 2017

This paper confirms the similarity of temperature tendency through numerical analysis and comparison with test, and it also confirms that temperature prediction of LED lightings is possible by numerical analysis. We confirmed that the temperature difference is about $10{\sim}20^{\circ}C$ except for some measurement points and shows similar tendency with the interpretation through manufacturing and performance analysis of AL heat sink applied Circular LED street lights and manufacturing and performance analysis of CMP-PLA heat sink applied Circular LED street lights. The simulations use Octree technique in SC/Tetra to set the grid size df the surface.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.79-85
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• 2016

For long life time and high efficiency, not necessary in improvement of LED chip structure, but also improve heat radiation for decrease heat in LED chip. In this study, efficiency decline factor has been investigated in LED lamp as study heat characteristic, luminance flux and heat resistance. When LED lamp temperature was increased, about 7% loss of luminance flux. In consequence of temperature analysis, width of fin was the most important factor of heat radiation. As a result, secure the enough heat path is very important factor of LED lamp design.