• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2017.05a
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• pp.697-699
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• 2017

A novel structure of phase locked loop (PLL) which has small size with D Flip-Flop and sub charge pump has been proposed. The area of loop filter usually occupying the larger portion of the chip is minimized using a single small capacitor. It has been simulated and proved by HSPICE in a CMOS $0.18{\mu}m$ 1.8V process.

• Proceedings of the KIEE Conference
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• 2000.07d
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• pp.3097-3099
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• 2000

In this paper, we design PLL for a low jitter and fast locking time that is used a new simple precharged CMOS phase frequency detector(PFD). The proposed PFD has a simple structure with using only 18 transistors. Futhermore, the PFD has a dead zone 25ps in the phase characteristic which is important in low jitter applications. The phase and frequency error detection range is not limited as the case of other precharge type PFDs. the simulation results base on a third order PLL are presented to verify the lock in process with the proposed PFD. the PLL using the new PED is designed using 0.25${\mu}m$ CMOS technology with 2.5V supply voltage.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.1
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• pp.131-137
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• 2014

A 120 GHz voltage controlled oscillator (VCO) with a divider chain including an injection locked frequency divider (ILFD) and six static frequency dividers is demonstrated using 65-nm CMOS technology. The VCO is designed based on the LC cross-coupled push-push structure and operates around 120 GHz. The 60 GHz ILFD at the first stage of the frequency divider chain is based on a similar topology as the core of the VCO to ensure the frequency alignment between the two circuit blocks. The static divider chain is composed of D-flip flops, providing a 64 division ratio. The entire circuit consumes a DC power of 68.5 mW with the chip size of $1385{\times}835{\mu}m^2$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.72-73
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• 2005

In this paper, the simulation of the n-p-n-p layer stacked color detector is presented. A color detector based on vertically integrated structures of silicon can overcome color moire or color aliasing effect. The color detector is designed to separate the fundamental chromatic components at each junction and exhibits maxima of the spectral sensitivity at red, green, and blue region, respectively. From this result, it is observed that the spectral response can be controlled by the doping concentration and structure of the devices.

• Journal of the Korean institute of surface engineering
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• v.33 no.4
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• pp.217-221
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• 2000

The gate oxide thickness is becoming thinner and thinner in order to speed up the semiconductor CMOS devices. We have investigated very thin$ SiO_2$ gate oxide layers and found anomaly between the thickness determined with capacitance measurement and these obtained with cross-sectional high resolution transmission electron microscopy. The thicknesses difference of the two becomes important for the thickness of the oxide below 5nm. We propose that the variation of dielectric constant in thin oxide films cause the anomaly. We modeled the behavior as (equation omitted) and determined $\varepsilon_{bulk}$=3.9 and $\varepsilon_{int}$=-4.0. We predict that optimum $SiO_2$ gate oxide thickness may be $20\AA$ due to negative contribution of the interface dielectric constant. These new results have very important implication for designing the CMOS devices.s.

• Electronics and Telecommunications Trends
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• v.38 no.6
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• pp.52-61
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• 2023

With semiconductor scaling approaching the physical limits, devices including CMOS (complementary metal-oxide-semiconductor) components have managed to overcome yet are currently struggling with several technical issues like short-channel effects. Evolving from the process node of 22 nm with FinFET (fin field effect transistor), state-of-the-art semiconductor technology has reached the 3 nm node with the GAA-FET (gate-all-around FET), which appropriately addresses the main issues of power, performance, and cost. Technical problems remain regarding the foundry of GAA-FET, and next-generation devices called post-GAA transistors have not yet been devised, except for the CFET (complementary FET). We introduce a CFET that spatially stacks p- and n-channel FETs on the same footprint and describe its structure and fabrication. Technical details like stacking of nanosheets, special spacers, hetero-epitaxy, and selective recess are more thoroughly reviewed than in similar articles on CFET fabrication.

• Journal of Sensor Science and Technology
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• v.33 no.3
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• pp.147-151
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• 2024

The importance of Wireless Sensor Networks is becoming more evident owing to their practical applications in various areas. However, the energy problem remains a critical barrier to the progress of WSNs. By reducing the energy consumed by the sensor nodes that constitute WSNs, the performance and lifespan of WSNs will be enhanced. In this study, we introduce an energy-efficient ternary modulator that employs multi-threshold CMOS for logic conversion. We optimized the design with a low-power ternary gate structure based on a pass transistor using the MTCMOS process. Our design uses 71.69% fewer transistors compared to the previous design. To demonstrate the improvements in our design, we conducted the HSPICE simulation using a CMOS 180 nm process with a 1.8V supply voltage. The simulation results show that the proposed ternary modulator is more energy-efficient than the previous modulator. Power-delay product, a benchmark for energy efficiency, is reduced by 97.19%. Furthermore, corner simulations demonstrate that our modulator is stable against PVT variations.

• Journal of Electrical Engineering and information Science
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• v.3 no.3
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• pp.391-395
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• 1998

The impact of LDD structure on the single-poly EEPROMs is investigated in this paper. The single-poly EEPROMs are fabricated using the 0.8$\mu\textrm{m}$ CMOS ASIC process. The single-poly EEPROMs with LDD structure have slower program and erase speeds, but the drain and gate stresses and the endurance characteristics of these devices are much better than those of the single-poly EEPROMs with single-drain structure. The single-poly EEPROMs with LDD structure do not require the process modifications and need no additional masks, hence can be used for microprocessors and logic circuits with low-density and low-cost embedded EEPROMs.

• Journal of Sensor Science and Technology
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• v.11 no.2
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• pp.84-92
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• 2002

A $32{\times}32$ pixels foveated (linear-polar) structure retina chip with the function of local-light adaptation for edge detection has been designed and fabricated using CMOS technology. Human retina can detect a wide range of light intensity. In this study, we use the biologically-inspired visual signal processing mechanism that consists of photoreceptors, horizontal cells, and bipolar cells in order to implement the function of edge detection in the retina chip. For a local-light adaptive function, the size of receptive field is changed locally according to the input light intensity. The spatial distribution of sensing pixels in the foveated retina chip has the advantages of selective reduction of image data and good resolution in central part to carry out the elaborate image processing with still enough resolution in the outer parts. The designed chip has been fabricated using standard $0.6\;{\mu}m$ double-poly triple-metal CMOS technology and optimized using HSPICE simulator.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.6
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• pp.1133-1138
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• 2007

DLLs(Delay Locked Loops) have widely been used in many systems in order to achieve the clock synchronization. A SMD (Synchronous Mirror Delay) structure is used both for skew reduction and for DCC (Duty Cycle Correction). In this paper, a SMD based DLL with DCC using Reduced Delay Lines is proposed in order to reduce the clock skew and correct the duty cycle. The merged structure allows the forward delay array to be shared between the DLL and the DCC, and yields a 25% saving in the number of the required delay cells. The designed chip was fabricated using a $0.25{\mu}m$ 1-poly, 4-metal CMOS process. Measurement results showed the 3% duty cycle error when the input signal ranges from 80% to 20% and the clock frequency ranges from 400MHz to 600MHz. The locking operation needs 3 clock and duty correction requires only 5 clock cycles as feature with SMD structure.