• Journal of IKEEE
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• v.2 no.1 s.2
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• pp.34-41
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• 1998

An integrated circuit for magnetic stripe storage system is implemented. All the analog and digital circuits are integrated in one chip. The analog block contains preamplifier, peak detecter, comparator and reference generater. And digital block includes reference window signal generater, up/down counter for F/2F signal measurement, bit-error detection logic, and control logic. Both the encoding and decoding functions for F/2F signal processing are provided. An AGC(automatic gain control) circuit which was included in conventional circuits is eliminated due to optimized circuit design. Misreading prevention circuits are also proposed by fixing up new reference bit when broken bits are detected. The prototype chip is implemented using $0.8{\mu}m$ N-well CMOS technology and operates from 3.3 V to 7.5 V of supply voltage. It occupies a die area of $3.04mm^2(1.6mm{\times}1.9mm)$ and dissipates 8 mW with a 5 V supply voltage.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.8
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• pp.62-71
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• 2001

This paper presents a design of the real-time digital image enhancement preprocessor for CMOS image sensor. CMOS image sensor offers various advantages while it provides lower-quality images than CCD does. In order to compensate for the physical limitation of CMOS sensor, the spatially adaptive contrast enhancement algorithm was incorporated into the preprocessor with color interpolation, gamma correction, and automatic exposure control. The efficient hardware architecture for the preprocessor is proposed and was simulated in VHDL. It is composed of about 19K logic gates, which is suitable for low-cost one-chip PC camera. The test system was implemented on Altera Flex EPF10KGC503-3 FPGA chip in real-time mode, and performed successfully.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.8
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• pp.22-29
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• 2007

A 2.5Gb/s 2:1 multiplexer(MUX) IC using $0.18{\mu}m$ CMOS was designed and fabricated. Inductive peaking technology was used to improve the performance. On-chip micro spiral inductor was designed to maximize the inductive peaking effect without increasing the chip area much. The designed 4.7 nH micro-spiral inductor was $20\times20{\mu}m2$ in size. 2:1 MUX with and without micro spiral inductors were compared. The rise and fall time was improved more than 23% and 3% respectively using the micro spiral inductors for 1.25Gb/s signal. For 2.5 Gb/s signal, fall and rise time was improved 5.3% and 3.5% respectively. It consumed 61mW and voltage output swing was 1$180mV_{p-p}$ at 2.5Gb/s.

• Journal of IKEEE
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• v.11 no.4
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• pp.129-136
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• 2007

In this paper, a simple but effective Dataline Redundancy Circuit (DRC) is proposed for a dual-port 1T-SRAM embedded in Display ICs. The DRC designed in the dual-port $320{\times}120{\times}18$-bit 1T-SRAM is verified in a 0.18-um CMOS 1T-SRAM process. In the DRC, because its control logic circuit can be implemented by a simple Shift Logic Circuit (SLC) with only an inverter and a NAND that is much simpler than the conventional, it can be placed in a pitch as narrow as a bit line pair. Moreover, an improved version of the SLC is also proposed to reduce its worst-case delay from 12.3ns to 5.9ns by 52%. By doing so, the timing overhead of the DRC can be hidden under the row cycle time because switching of the datalines can be done between the times of the word line setup and the sense amplifier setup. The area overhead of the DRC is estimated about 7.6% in this paper.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.53-60
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• 2009

Due to increased integration density and reduced threshold voltages, leakage current reduction becomes important in the semiconductor IC design for low power consumption. In a combinational logic circuit, the leakage current in the standby state depends on the values of the input. In this research, we developed a new input vector control method to minimize the leakage power. A new efficient algorithm is developed to find the minimal leakage vector. It can reduce the leakage current by 15.7% from the average leakage current and by 6.7% from the results of simulated evolution method during standby or idle states for a set of benchmark circuits. The minimal leakage input vector, with idle input signal, can also reduce the leakage current by 6.8% from the average leakage current and by 3.2% from the results of simulated evolution method for sequential circuits.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.7
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• pp.1227-1234
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• 2008

In this paper is designed a 256-bit synchronous OTP(one-time programmable) memory required in application fields such as automobile appliance power ICs, display ICs, and CMOS image sensors. A 256-bit synchronous memory cell consists of NMOS capacitor as antifuse and access transistor without a high-voltage blocking transistor. A gate bias voltage circuit for the additional blocking transistor is removed since logic supply voltage VDD(=1.5V) and external program voltage VPPE(=5.5V) are used instead of conventional three supply voltages. And loading current of cell to be programmed increases according to RON(on resistance) of the antifuse and process variation in case of the voltage driving without current constraint in programming. Therefore, there is a problem that program voltage can be increased relatively due to resistive voltage drop on supply voltage VPP. And so loading current can be made to flow constantly by using the current driving method instead of the voltage driving counterpart in programming. Therefore, program voltage VPP can be lowered from 5.9V to 5.5V when measurement is done on the manufactured wafer. And the sens amplifier circuit is simplified by using the sens amplifier of clocked inverter type instead of the conventional current sent amplifier. The synchronous OTP of 256 bits is designed with Magnachip $0.13{\mu}m$ CMOS process. The layout area if $298.4{\times}314{\mu}m2$.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.1
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• pp.129-140
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• 2017

In this paper, a $4{\times}32$-channel neural recording system capable of acquiring neural signals is introduced. Four 32-channel neural recording ICs, complex programmable logic devices (CPLDs), a micro controller unit (MCU) with USB interface, and a PC are used. Each neural recording IC, implemented in $0.18{\mu}m$ CMOS technology, includes 32 channels of analog front-ends (AFEs), a 32-to-1 analog multiplexer, and an analog-to-digital converter (ADC). The mid-band gain of the AFE is adjustable in four steps, and have a tunable bandwidth. The AFE has a mid-band gain of 54.5 dB to 65.7 dB and a bandwidth of 35.3 Hz to 5.8 kHz. The high-pass cutoff frequency of the AFE varies from 18.6 Hz to 154.7 Hz. The input-referred noise (IRN) of the AFE is $10.2{\mu}V_{rms}$. A high-resolution, low-power ADC with a high conversion speed achieves a signal-to-noise and distortion ratio (SNDR) of 50.63 dB and a spurious-free dynamic range (SFDR) of 63.88 dB, at a sampling-rate of 2.5 MS/s. The effectiveness of our neural recording system is validated in in-vivo recording of the primary somatosensory cortex of a rat.