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A Design of the New Three-Line Balun (새로운 3-라인 발룬 설계)

  • 이병화;박동석;박상수
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.14 no.7
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    • pp.750-755
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    • 2003
  • This paper proposes a new three-line balun. The equivalent circuit of the proposed three-line balun is presented, and impedance matrix[Z]of the equivalent circuit is derived from the relationship between the current and voltage at each port. The design equation for a given set of balun impedance at input and output ports is presented using[S]parameters, which is transferred fom impedance matrix,[Z]. To demonstrate the feasibility and validity of design equation, multi-layer ceramic(MLC) chip balun operated in the 2.4 GHz ISM band frequency is designed and fabricated by the use of the low temperature co-fired ceramic(LTCC) technology. By employing both the proposed new three-line balun equivalent circuit and multi-layer configuration provided by LTCC technology, the 2012 size MLC balun is realized. Measured results of the multi-layer LTCC three-line balun match well with the full-wave electromagnetic simulation results, and measured in band-phase and amplitude balances over a wide bandwidth are excellent. This proposed balun is very easily applicable to multi-layer structure using LTCC as shown in the paper, and also can be realized with microstrip lines on PCB. This distinctive performance is very favorable for wireless communication systems such as wireless LAN(Local Area Network) and Bluetooth applications.

Design and Implementation of 5G mmWave LTE-TDD HD Video Streaming System for USRP RIO SDR (USRP RIO SDR을 이용한 5G 밀리미터파 LTE-TDD HD 비디오 스트리밍 시스템 설계 및 구현)

  • Gwag, Gyoung-Hun;Shin, Bong-Deug;Park, Dong-Wook;Eo, Yun-Seong;Oh, Hyuk-Jun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.27 no.5
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    • pp.445-453
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    • 2016
  • This paper presents the implementation and design of the 1T-1R wireless HD video streaming systems over 28 GHz mmWave frequency using 3GPP LTE-TDD standard on NI USRP RIO SDR platform. The baseband of the system uses USRP RIO that are stored in Xilinx Kintex-7 chip to implement LTE-TDD transceiver modem, the signal that are transceived from USRP RIO up or down converts to 28 GHz by using self-designed 28 GHz RF transceiver modules and it is finally communicated HD video data through self-designed $4{\times}8$ sub array antennas. It is that communication method between USRP RIO and Host PC use PCI express ${\times}4$ to minimize delay of data to transmit and receive. The implemented system show high error vector magnitude performance above 25.85 dBc and to transceive HD video in experiment environment anywhere.

Design of the RF Front-end for L1/L2 Dual-Band GPS Receiver (L1/L2 이중-밴드 GPS 수신기용 RF 전단부 설계)

  • Kim, Hyeon-Deok;Oh, Tae-Soo;Jeon, Jae-Wan;Kim, Seong-Kyun;Kim, Byung-Sung
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.21 no.10
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    • pp.1169-1176
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    • 2010
  • The RF front-end for L1/L2 dual-band Global Positioning System(GPS) receiver is presented in this paper. The RF front-end(down-converter) using low IF architecture consists of a wideband low noise amplifier(LNA), a current mode logic(CML) frequency divider and a I/Q down-conversion mixer with a poly-phase filter for image rejection. The current bleeding technique is used in the LNA and mixer to obtain the high gain and solve the head-room problem. The common drain feedback is adopted for low noise amplifier to achieve the wideband input matching without inductors. The fabricated RF front-end using $0.18{\mu}m$ CMOS process shows a gain of 38 dB for L1 and 41 dB for L2 band. The measured IIP3 is -29 dBm in L1 band and -33 dBm in L2 band, The input return loss is less than -10 dB from 50 MHz to 3 GHz. The measured noise figure(NF) is 3.81 dB for L1 band and 3.71 dB for L2 band. The image rejection ratio is 36.5 dB. The chip size of RF front end is $1.2{\times}1.35mm^2$.

Characterization for Viscoelasticity of Glass Fiber Reinforced Epoxy Composite and Application to Thermal Warpage Analysis in Printed Circuit Board (유리섬유강화 복합재의 점탄성 특성 규명 및 인쇄회로기판 열변형해석에의 적용)

  • Song, Woo-Jin;Ku, Tae-Wan;Kang, Beom-Soo;Kim, Jeong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.2
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    • pp.245-253
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    • 2010
  • The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

Optimization of wiring process in semiconductor with 6sigma & QFD (6시그마와 QFD를 활용한 반도체용 wire공법 최적화 연구)

  • Kim, Chang-Hee;Kim, Kwang-Soo
    • Asia-Pacific Journal of Business Venturing and Entrepreneurship
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    • v.7 no.3
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    • pp.17-25
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    • 2012
  • Wire bonding process in making semiconductor needs the most precise control and Critical To Quality(CTQ). Thus, it is regarded to be the most essential step in packaging process. In this process, pure gold wire is used to connect the chip and PCB(substrate or lead frame). However, the price of gold has been skyrocketing continuously for a long period of time and is expected to further increase in the near future. This phenomenon situates us in an unfavorable condition amidst the competitive environment. To avoid this situation, many semiconductor material making companies developed new types of wires: Au.Ag wire is one material followed by many others. This study is aimed to optimize the parameter in wire bonding with the use of 6sigma and QFD(Quality Function Deployment). 6sigma process is a good means to not only solve the problem, but to increase productivity. In order to find the key factor, we focused on VOB(Voice of Business) and VOC(Voice of Customer). The main factors from VOB, VOC are called CTQ. However, there were times when these main factors were far from offering us the correct answer, thus making the situation more difficult to handle. This study shows that QFD aids in deciding which of the accurate factors to undertake. Normally QFD is used in designing and developing products. 6sigma process is held more effective when it used with QFD.

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Analysis of Immunomodulating Gene Expression by cDNA Microarray in $\beta$-Glucan-treated Murine Macrophage

  • Sung, Su-Kyong;Kim, Ha-Won
    • Proceedings of the Korean Society of Applied Pharmacology
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    • 2003.11a
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    • pp.98-98
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    • 2003
  • ${\beta}$-(1,3)-D-Glucans have been known to exhibit antitumor and antimicrobial activities. The presence of dectin-1,${\alpha}$, ${\beta}$-glucan receptor of dendritic cell, on macrophage has been controvertial. RT-PCR analysis led to the detection of dectin-1${\alpha}$ and ${\beta}$ in murine macrophage Raw264.7 cell line. Among the various organs of mouse, dectin-1${\alpha}$ and ${\beta}$ were detected in the thymus, lung, spleen, stomach and intestine. To analyze gene expression modulated by ${\beta}$-glucan treated murine Raw264.7 macrophage, total mRNA was applied to cDNA microarray to interrogate the expression of 7,000 known genes. cDNA chip analysis showed that ${\beta}$-glucan of P. osteatus increased gene expressions of immunomodulating genes, membrane antigenic proteins, chemokine ligands, complements, cytokines, various kinases, lectin associated genes and oncogenes in Raw 264.7 cell line. When treated with ${\beta}$-glucan of P. osteatus and LPS, induction of gene expression of TNF-${\alpha}$ and IFN-R1 was confirmed by RT-PCR analysis. Induction of TNF-R type II expression was confirmed by FACS analysis. IL-6 expression was abolished by EDTA in ${\beta}$-glucan and LPS treated Raw264.7 cell line, indicating that ${\beta}$-glucan binds to dectin-l in a Ca$\^$++/ -dependent manner. To increase antitumor efficacy of ${\beta}$-glucan, ginsenoside Rh2 (GRh2) was co-treated with ${\beta}$-glucan in vivo and in vitro tests. IC$\sub$50/ values of GRh2 were 20 and 25 $\mu\textrm{g}$/$m\ell$ in SNU-1 and B16 melanoma F10 cell line, respectively. Co-treatment with ${\beta}$-glucan and GRh2 showed synergistic antitumor activity with cisplatin and mitomycin C both in vitro and in vivo. Single or co-treatment with ${\beta}$-glucan and GRh2 increased tumor bearing mouse life span. Co-treatment with ${\beta}$-glucan and GRh2 showed more increased life span with mitomycin C than that with cisplatin. Antitumor activities were 67% and 72 % by co-injection with ${\beta}$-glucan and GRh2 in the absence or presence of mitomycin C, respectively.

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Association of Adiponectin Polymorphisms with Type 2 Diabetes in Korean Population (한국인에서의 아디포넥틴의 유전자다형성과 제2형 당뇨병과의 연관성)

  • Yoo, Min;Kim, Su-Won
    • Journal of Life Science
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    • v.19 no.10
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    • pp.1495-1498
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    • 2009
  • Type 2-diabetes is a typical polygenic disease complex, for which several common risk alleles have been identified. Adiponectin, which modulates insulin resistance as well as glucose and lipid metabolism, has recently been associated with type 2-diabetes (T2DM). Therefore, we investigated the genotype for the T45G and G267T polymorphisms in adiponectin genes in the Korean population and compared genotypes of patients with those of a control group. 100 patients (63 male, 37 female), who previously underwent T2DM and 100 controls (36 male, 63 female) participated in this study. There was a strong association between T45G polymorphism in the adiponectin gene and T2DM. The present study shows that adiponectin T45G polymorphism may be associated with the pathogenesis of T2DM. Further studies with a larger population may be needed for the development of diagnostic methods at genetic levels such as DNA chip.

A Micro Solar Energy Harvesting Circuit with MPPT Control (MPPT 제어기능을 갖는 마이크로 빛에너지 하베스팅 회로)

  • Yoon, Eun-Jung;Park, Jong-Tae;Yu, Chong-Gun
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.6
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    • pp.105-113
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    • 2013
  • In this paper a micro solar energy harvesting system with MPPT(Maximum Power Point Tracking) control using a miniature PV(photovoltaic) cell of which the output is less than 0.5V is proposed. The MPPT control is implemented using linear relationship between the open-circuit voltage of a PV cell and its MPP(Maximum Power Point) voltage such that a pilot PV cell can track the MPP of the main PV cell in real time. The proposed circuit is designed in 0.18um CMOS process. The designed chip area is $900um{\times}1370um$ including a load charge pump and pads. Measured results show that the designed system can track the MPP voltage changes with variations of light intensity. The designed circuit with MPPT control delivers MPP voltages to load even though the load is heavy such that it can supply more power when the MPPT control is applied. The proposed circuit does not require any precharged battery resulting in more suitability for miniaturized self-powered systems compared to the existing works.

Optical Current Sensors with Improved Reliability using an Integrated-Optic Reflective Interferometer (반사형 간섭계를 이용하여 신뢰성을 향상시킨 광전류센서)

  • Kim, Sung-Moon;Chu, Woo-Sung;Oh, Min-Cheol
    • Journal of the Institute of Electronics and Information Engineers
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    • v.54 no.5
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    • pp.17-23
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    • 2017
  • Optical current sensors are suitable for operation in high voltage and high current environments such as power plants due to they are not affected by electromagnetic interference and have excellent insulation characteristics. However, as they operate in a harsh environment such as large temperature fluctuation and mechanical vibration, high reliability of the sensor is required. Therefore, many groups have been working on enhancing the reliability. In this work, an integrated optical current sensor incorporating polarization-rotated reflection interferometer is proposed. By integrating various optical components on a single chip, the sensor exhibits enhanced stability as well as the solution for low-cost optical sensors. Using this, we performed the characterization for the actual field application. By using a large power source, the current of 0.3 kA~36 kA was applied to the photosensor and the linear operation characteristics were observed. The error of the sensor was within $0{\pm}.5%$. Even when operating for a long time, the error range of the sensor was kept within $0{\pm}.5%$. In addition, the measurement of the frequency response over the range of 60 Hz to 10 kHz has confirmed that the 3-dB frequency band of the proposed OCT is well over 10 kHz.

Design of Low Power 4th order ΣΔ Modulator with Single Reconfigurable Amplifier (재구성가능 연산증폭기를 사용한 저전력 4차 델타-시그마 변조기 설계)

  • Sung, Jae-Hyeon;Lee, Dong-Hyun;Yoon, Kwang Sub
    • Journal of the Institute of Electronics and Information Engineers
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    • v.54 no.5
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    • pp.24-32
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    • 2017
  • In this paper, a low power 4th order delta-sigma modulator was designed with a high resolution of 12 bits or more for the biological signal processing. Using time-interleaving technique, 4th order delta-sigma modulator was designed with one operational amplifier. So power consumption can be reduced to 1/4 than a conventional structure. To operate stably in the big difference between the two capacitor for kT/C noise and chip size, the variable-stage amplifier was designed. In the first phase and second phase, the operational amplifier is operating in a 2-stage. In the third and fourth phase, the operational amplifier is operating in a 1-stage. This was significantly improved the stability of the modulator because the phase margin exists within 60~90deg. The proposed delta-sigma modulator is designed in a standard $0.18{\mu}m$ CMOS n-well 1 poly 6 Metal technology and dissipates the power of $354{\mu}W$ with supply voltage of 1.8V. The ENOB of 11.8bit and SNDR of 72.8dB at 250Hz input frequency and 256kHz sampling frequency. From measurement results FOM1 is calculated to 49.6pJ/step and FOM2 is calculated to 154.5dB.