• Title/Summary/Keyword: Bump simulation

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Elasto-Hydrodynamic Lubrication Characteristics of Bump Foil Bearings (범프포일베어링의 탄성유체윤활 특성)

  • Kim, Young-Cheol;Lee, Dong-Hyun;Kim, Kyung-Woong
    • 유체기계공업학회:학술대회논문집
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    • 2004.12a
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    • pp.98-103
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    • 2004
  • This paper presents modeling and simulation of the bump foil bearings with consideration of the elastic behavior of the foil and gas compressibility. Heshmat had originally introduced the simple compliance model to estimate the EHL(elasto-hydrodynamic lubrication) performance. But this approach can not consider the deflection of top foil at the edge of bearing, so model is insufficient to analyze in case that the eccentricity ratio is greater than I. So the top foil is considered as a simple beam model supported by linear spring elements, and the bump foil deflection can be simple compliance model. The EHL calculations are performed for convention rigid type, classical foil type, variable pitch type and double bump type toil bearings. This paper presents that 2nd or 3rd generation bearings have excellent performance in every speeds.

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Fabrication and Experimental Research of the Disk Bump to Improve the Unloading Performance (언로드 성능 형상을 위한 디스크 범퍼의 제작 및 실험 연구)

  • Lee, Yong-Eun;Lee, Yong-Hyun;Lee, Hyung-Jun;Park, No-Cheol;Park, Kyung-Su;Park, Young-Pil
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2007.11a
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    • pp.1276-1279
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    • 2007
  • The main objectives of the Load/Unload are no slider-disk contact and no media damage. But, it remains unsolved technical problems on the unloading process. While the slider climbs up the ramp at the outer edge of the disk, the possibility of the slider-disk contact by lift-off force and rebound of the slider increases. Keeping in mind of these points, to prevent the slider-disk contact, we apply the disk bump on disk outer edge proceeding unload. First, referring to the simulation results, we select the optimal bump shapes to improve unload performance by unload analysis. Second, the disk bump is mechanically manufactured by pressing disk surface using tungsten tips. The bumps are variously processed by changing pressing pressure of tungsten tips. After confirming bump shape by nano-scanner, the optimal bump shape is applied to experimental unload process. Through this experiment, it is conformed that the unload performance was improved by using the optimal disk bump to prevent the slider-disk contact.

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Interaction of turbulences with non-breaking divergent waves in an open channel

  • Hwang, Ayoung;Seok, Woochan;Lee, Sang Bong
    • International Journal of Naval Architecture and Ocean Engineering
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    • v.13 no.1
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    • pp.35-49
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    • 2021
  • This paper presents a direct numerical simulation of turbulent flows over a bump in an open channel to examine the turbulence characteristics near divergent waves emanating from the bump and to investigate the interaction of the turbulences with the divergent waves. To verify the reliability of the simulations, the mean velocity profile and root-mean-square of velocity fluctuations are compared with previous data. The anisotropic invariant maps show that the ratio of the streamwise to spanwise velocity fluctuations plays an important role in characterizing the anisotropic nature of the separated shear layer behind the bump in the vicinity of the free surface. The vortex identification discloses a large-scale streamwise vortical structure from the mean velocity field and a cluster of small coherent structures from the instantaneous velocity field, which are responsible for the anisotropic characteristics of the turbulence beneath the free surface.

A study of fabrication micro bump for TSP testing using maskless lithography system. (Maskless Lithography system을 이용한 TSP 검사 용 micro bump 제작에 관한 연구.)

  • Kim, Ki-Beom;Han, Bong-Seok;Yang, Ji-Kyung;Han, Yu-Jin;Kang, Dong-Seong;Lee, In-Cheol
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.5
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    • pp.674-680
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    • 2017
  • Touch Screen Panel (TSP) is a widely used personal handheld device and as a large display apparatus. This study examines micro bump fabrication technology for TSP test process. In the testing process, as TSP is changed, should make a new micro bump for probing and modify the testing program. In this paper we use a maskless lithography system to confirm the potential to fabricatemicro bump to reducecost and manufacturing time. The requiredmaskless lithography system does not use a mask so it can reduce the cost of fabrication and it flexible to cope with changes of micro bump probing. We conducted electro field simulation by pitches of micro bump and designed the lithography pattern image for the maskless lithography process. Then we conducted Photo Resist (PR) patterning process and electro-plating process that are involved in MEMS technology to fabricate micro bump.

Multi-flexible Body Dynamic Analysis of a Heavy Trailer Vehicle Passing a Bump (대형 트레일러 차량의 범프 통과 시 유연다물체 동역학 해석)

  • Kim, J.Y.;Kim, H.S.;Kim, J.G.
    • Journal of Power System Engineering
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    • v.13 no.5
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    • pp.40-45
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    • 2009
  • This article deals with the transient analysis using multi-flexible body dynamics of a trailer vehicle, which is passing a bump on the flat road. In order to investigate the transient dynamic behavior of the trailer, we developed an equivalent finite element model for the trailer and a vehicle dynamic model for the truck using multi-body dynamics. The driving condition considered here is set as the trailer vehicle passes a bump on the flat road in 7km/h. And we investigate the time histories of vertical load and deflections on connecting points between the trailer and truck during the vehicle passes a bump. Due to the dynamic load resulted from the driving condition, additional stress concentrations are found in the trailer and the suspension connecting points between the trailer and rear axles along with kingpin.

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Study on the Effect of the Payload and Weight Position on the Handling and Ride Comfort of a Truck (트럭의 화물적재량과 적재위치가 조안성 및 승차감에 미치는 영향에 관한 연구)

  • Cha, Hyun-Kyung;Choi, Gyu-Suk;Sohn, Jeong-Hyun
    • Journal of Power System Engineering
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    • v.17 no.4
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    • pp.23-30
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    • 2013
  • In this paper, the payload condition is considered and computer simulation is carried out to analyze the dynamic behavior of the middle-sized truck under the condition with different weight and location. The computer model for the truck is established and ADAMS/Car is employed to simulate the truck vehicle. A single lane change and bump-pass simulation are performed to evaluate the performance according to the weight and the position of it. Effects of the location and weight of commercial vehicle are analyzed. According to the simulation results, the front deck is preferred as the load location.

Development of the Computer Model Considering Flexible Effect of a Large-sized Truck on the Bump Road (범프 로드에서 대형트럭 프레임의 탄성효과를 고려한 컴퓨터 모델 개발)

  • Moon, Il-Dong;Chi, Chang-Hun;Kim, Byoung-Sam
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.15 no.10 s.103
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    • pp.1202-1210
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    • 2005
  • This paper develops a computer model for estimating the bump characterisitcs of a cat)over type large-sized truck. The truck is composed of front and rear suspension systems, a frame, a cab, and ten tires. The computer model is developed using MSC.ADAMS. A shock absorber, a rubber bush, and a leaf spring affect a lot on the dynamic characteristic of the vehicle. Their stiffness and damping coefficient are measured and used as input data of the computer model. Leaf springs in the front and rear suspension systems are modeled by dividing them three links and joining them with joints. To improve the reliability of the developed computer model, the frame is considered as a flexible body. Thus, the frame is modeled by finite elements using MSC.PATRAN. A mode analysis is performed with the frame model using MSC.NASTRAN in order to link the frame model to the computer model. To verify the reliability of the developed computer model, a double wheel bump test is performed with an actual vehicle. In the double wheel bump, vortical displacement, velocity, acceleration are measured. Those test results are compared with the simulation results.

Simulation of Dynamic Characteristics of Agricultural Tractor (III) - Effect of Design Parameters on Seat Vibrations - (농용 트랙터의 동특성 시뮬레이션 (III) - 주요 설계 변수가 좌석 진동에 미치는 영향 -)

  • 박홍제;김경욱
    • Journal of Biosystems Engineering
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    • v.24 no.3
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    • pp.183-194
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    • 1999
  • Using the dynamic model and simulation program TDA developed in the previous paper, effects of design parameters of an agricultural tractor-trailer system on its vertical seat vibrations were investigated. The tractor-trailer system was excited by traversing over a half-sine bump. The excitation frequencies were determined by traveling velocity of the tractor and a half-sine bump selected appropriately. TDA predicted the autospectra of the vertical seat accelerations with different values of design parameters and compared them to analyze their effects. The design parameters included positions of engine, cab, and seat mountings as well as their dynamic properties. The results of this study suggested guidelines with which an improved structure of tractor may be developed in the early stage of design for a better ride quality.

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A Numerical Dynamic Simulation of the Slider in HDD (하드디스크 슬라이더의 동적수치해석)

  • 김도완;임윤철
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 1999.11a
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    • pp.146-153
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    • 1999
  • A numerical dynamic simulation is necessary to investigate the capacity of the HDD. The slider surface become more and more complicated to make the magnetized area smaller and readback signal stronger. So a numerical dynamic simulation must be preceded to develop a new slider in HDD. The dynamic simulations of air-lubricated slider bearing have been peformed using FIFD(Factored Implicit Finite Difference) method. The governing equation, Reynolds equation Is modified with Fukui and Kaneko model(FK model) which includes the first and the second-order slip. The equations of motion for the slider bearing are solved simultaneously with the modified Reynolds equation for the case of three degrees of freedom. The slider transient response for disk step bump and slider impulse force is given for various case and for iteration algorithm and new algorithm.

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Method of Solving Oxidation Problem in Copper Pillar Bump Packaging Technology of High Density IC (고집적 소자용 구리기둥범프 패키징에서 산화문제를 해결하기 위한 방법에 대한 연구)

  • Jung, One-Chul;Hong, Sang-Jeen;Soh, Dae-Wha;Hwang, Jae-Ryong;Cho, Il-Hwan
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.12
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    • pp.919-923
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    • 2010
  • Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.