• 한국전산유체공학회:학술대회논문집
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• 2008.03a
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• pp.262-267
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• 2008

Numerical investigations were performed with an external-compression inlet with a three-dimensional bump at Mach 2 to scrutinize the geometrical effects of the bump in controlling the interaction of a shock wave with a boundary layer. The inlet was designed for two oblique shock waves and a terminal normal shock wave followed by a subsonic diffuser, with a circular cross-section throughout. The bump-type inlet that replaced the aft ramp of the conventional ramp-type inlet was optimized with respect to the inlet performance parameters as well as compared with the conventional ramp-type inlet. The current numerical simulations showed that a bump-type inlet can provide an improvement in the total pressure recovery downstream of the shock wave/boundary layer interaction over a conventional ramp-type inlet.

• 한국전산유체공학회:학술대회논문집
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• 2008.10a
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• pp.262-267
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• 2008

Numerical investigations were performed with an external-compression inlet with a three-dimensional bump at Mach 2 to scrutinize the geometrical effects of the bump in controlling the interaction of a shock wave with a boundary layer. The inlet was designed for two oblique shock waves and a terminal normal shock wave followed by a subsonic diffuser, with a circular cross-section throughout. The bump-type inlet that replaced the aft ramp of the conventional ramp-type inlet was optimized with respect to the inlet performance parameters as well as compared with the conventional ramp-type inlet. The current numerical simulations showed that a bump-type inlet can provide an improvement in the total pressure recovery downstream of the shock wave/boundary layer interaction over a conventional ramp-type inlet.

• Journal of Biosystems Engineering
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• v.30 no.6 s.113
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• pp.366-372
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• 2005

The objective of this study was to evaluate the bump crossing and loading stability of a proto-type mini-forwarder under development. The evaluation was performed by computer simulation using a multi-body dynamic analysis program, Recur- Dyn 5.21. The proto-type was modeled and its properties such as mass, mass center, and mass moment of inertia were determined using 3D CAD modeler, Solid Edge 8.0. The $\%$ errors of masses, mass center, mass moment of inertia, and vertical motion of the model were within less than $10\%$ and the model's behavior agreed relatively well with those of the proto-type when traversing over a rectangular bump. Using the validated model, bump crossing of the proto-type was simulated and the loading limit was determined. It was found that effects of the shapes of bump on the bump crossing performance was insignificant within the practical heights of bumps. Stability of bump crossing increased with loading. However, loading of longer logs than 2.7 m made the crossing unstable because the ends of logs contacted ground when traversing over the bump. The maximum loading capacity of the proto-type was estimated to be 7.8 kN of 2.7 m long logs.

• 유체기계공업학회:학술대회논문집
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• 2004.12a
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• pp.98-103
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• 2004

This paper presents modeling and simulation of the bump foil bearings with consideration of the elastic behavior of the foil and gas compressibility. Heshmat had originally introduced the simple compliance model to estimate the EHL(elasto-hydrodynamic lubrication) performance. But this approach can not consider the deflection of top foil at the edge of bearing, so model is insufficient to analyze in case that the eccentricity ratio is greater than I. So the top foil is considered as a simple beam model supported by linear spring elements, and the bump foil deflection can be simple compliance model. The EHL calculations are performed for convention rigid type, classical foil type, variable pitch type and double bump type toil bearings. This paper presents that 2nd or 3rd generation bearings have excellent performance in every speeds.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Journal of the Korean Institute of Intelligent Systems
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• v.23 no.4
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• pp.286-291
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• 2013

In this paper, in-line type flip chip bump 3D inspection equipment, using white light interferometer with large F.O.V., which is aimed to be used in flip chip bump test process is developed. Results of flip chip bump height measurement in many substrates and repeatability test results for the bumps in fixed location of each substrate are shown. Test results from test bench and those from developed flip chip bump 3D inspection equipment are compared and as a result repeatability is improved by reducing the impact of system vibration. A valuation basis for the testing quality of flip chip bump 3D inspection equipment is proposed.

• Journal of Mechanical Science and Technology
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• v.14 no.7
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• pp.744-751
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• 2000

To achieve lower flying height for high areal recording density, the laser zone texturing of the disk needs to be designed to reduce glide height. One problem of the laser bump design is that the regular laser bump pattern often produces glide resonance phenomenon, which leads to failure of the glide height test. However, it was found in this study that glide resonance is an intrinsic problem of the glide head used and resonance phenomenon depends on the type of the head slider, that is, the natural frequency of the slider body. Therefore, higher glide height or glide failure caused by glide resonance does not lead to head/media interface problem in the real drive operating conditions in which the data head is used. Pseudo-random bump pattern greatly reduces the glide resonance. Smaller bump pitch will also help to reduce the glide resonance. However, as bump spacing becomes smaller, glide height will be increased due to increased air pressure developed around the bumps. Lowering bump height is the most effect way to reduce glide avalanche.

• Laser Solutions
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• v.2 no.1
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• pp.51-60
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• 1999

In this paper, weldability and formability of Tailored-Blank (TB) and the structural impact testing of bump beam were investigated to apply TB to automobile bumper beam. The optimal $CO_2$ laser welding condition for TB of SPFC and SPRC steel plates with different thicknesses was obtained. Before welding, the cross section of butt joint was prepared only by shearing without milling process. Real type bump beam was produced by two kind of forming processes such as roll-forming and press-forming, and the good formability of TB was obtained. Impact test results of bump by using pendulum and barrier were satisfied the impact regulation of bump. Finally. It may be confirmed that laser welded TB is well-balanced material in both weight reduction and production cost of automobile bump.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.15 no.10 s.103
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• pp.1202-1210
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• 2005

This paper develops a computer model for estimating the bump characterisitcs of a cat)over type large-sized truck. The truck is composed of front and rear suspension systems, a frame, a cab, and ten tires. The computer model is developed using MSC.ADAMS. A shock absorber, a rubber bush, and a leaf spring affect a lot on the dynamic characteristic of the vehicle. Their stiffness and damping coefficient are measured and used as input data of the computer model. Leaf springs in the front and rear suspension systems are modeled by dividing them three links and joining them with joints. To improve the reliability of the developed computer model, the frame is considered as a flexible body. Thus, the frame is modeled by finite elements using MSC.PATRAN. A mode analysis is performed with the frame model using MSC.NASTRAN in order to link the frame model to the computer model. To verify the reliability of the developed computer model, a double wheel bump test is performed with an actual vehicle. In the double wheel bump, vortical displacement, velocity, acceleration are measured. Those test results are compared with the simulation results.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.3 no.3
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• pp.661-669
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• 1999

A probe card is one of the most important pan of test systems as testing IC(integrated circuit) chips. This work was related to bump-type silicon vertical probe card which enabled simultaneous tests for multiple semiconductor chips. The probe consists of silicon cantilever with bump tip. In order to obtain optimum size of the cantilever, the dimensions were determined by FEM(finite element method) analysis. The probe was fabricated by RIE(reactive ion etching), isotropic etching, and bulk-micromachining using SDB(silicon direct bonding) wafer. The optimum height of the bump of the probe detemimed by FEM simulation was 30um. The optimum thickness, width, and length of the cantilever were 20 $\mum$, 100 $\mum$,and 400 $\mum$,respectively. Contact resistance of the fabricated probe card measured at contact resistance testing was less than $2\Omega$. It was also confirmed that its life time was more than 20,000 contacts because there was no change of contact resistance after 20,000 contacts.