• Journal of Welding and Joining
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• 제31권3호
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• 한국지능시스템학회논문지
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• 제23권4호
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• pp.286-291
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• 2013

대시야 백색광간섭계(WSI ; White Light Scanning Interferometer)를 이용하여, Flip Chip Bump 검사 공정에 적용하는 것을 목적으로 한 인라인 형태의 플립칩 범프 3차원 검사 장치를 개발한다. 여러 서브스트레이트에 있는 플립칩 범프 높이 측정 결과와 이에 의한 동일한 여러 범프에 대한 반복성 측정 실험 결과를 제시한다. 테스트 벤치에서의 실험 결과와 개발된 플립칩 범프 3차원 검사 장치에서의 실험 결과를 비교하였으며 진동의 영향이 감소되어 개선된 반복성 실험 결과를 얻을 수 있었다. 플립칩 범프 3차원 검사 장치의 검사성능을 평가할 수 있는 기준을 제시한다.

• Tribology and Lubricants
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• 제18권2호
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• pp.153-159
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• 2002

This paper describes a durability characteristics of an air-lubricated bump foil journal bearing for high speed turbomachinerys at room temperature. At first, lift-off test and load capacity test were performed to understand the general characteristics of an air-lubricated bump foil Journal bearing. A 52 N weighted bump foil bearing sleeve was lilted off from a rotating Journal at about 3,000 rpm, and produced a load capacity of 500 N at an operating speed of 15,000 rpm. The next was 500 cycles lift-off test with an air-lubricated bump foil journal bearing that had a molybdenum disulfide(MoS$_2$) solid lubricant coated top foil. Data from measuring bearing torque and temperature and the observation of rubbing surfAce were included in results. Therefore the results of this work will aid in proving durability of air-lubricated bump foil journal bearings.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2001년도 제34회 추계학술대회 개최
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• pp.212-219
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• 2001

This paper describes a durability characteristics of an air-lubricated bump foil journal bearing for high speed turbomachinerys at room temperature. At first, lift-off test and load capacity test were performed to understand the general characteristics of an air-lubricated bump foil journal bearing. A 52N weighted bump foil bearing sleeve was lifted off from a rotating journal at about 3,000rpm, and produced a load capacity of 500N at an operating speed of 15,000rpm. The next was 500 cycles lift-off test with an air-lubricated bump foil journal bearing that had a molybdenum disulfide(MoS$_2$) solid lubricant coated top foil. Data from measuring bearing torque and temperature and the observation of rubbing surface were included in results. Therefore the results of this work will aid in proving durability of air-lubricated bump foil journal bearings.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.477-478
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• 2012

• Journal of Mechanical Science and Technology
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• 제14권7호
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• pp.744-751
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• 2000

To achieve lower flying height for high areal recording density, the laser zone texturing of the disk needs to be designed to reduce glide height. One problem of the laser bump design is that the regular laser bump pattern often produces glide resonance phenomenon, which leads to failure of the glide height test. However, it was found in this study that glide resonance is an intrinsic problem of the glide head used and resonance phenomenon depends on the type of the head slider, that is, the natural frequency of the slider body. Therefore, higher glide height or glide failure caused by glide resonance does not lead to head/media interface problem in the real drive operating conditions in which the data head is used. Pseudo-random bump pattern greatly reduces the glide resonance. Smaller bump pitch will also help to reduce the glide resonance. However, as bump spacing becomes smaller, glide height will be increased due to increased air pressure developed around the bumps. Lowering bump height is the most effect way to reduce glide avalanche.

• 대한금속재료학회지
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• 제46권5호
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• pp.310-314
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• 2008

Electromigration test of flip chip solder bump is performed at $140^{\circ}C$ C and $4.6{\times}10^4A/cm^2$ conditions in order to compare electromigration with thermomigration behaviors by using electroplated Sn-3.5Ag solder bump with Cu under-bump-metallurgy. As a result of measuring resistance with stressing time, failure mechanism of solder bump was evaluated to have four steps by the fail time. Discrete steps of resistance change during electromigration test are directly compared with microstructural evolution of cross-sectioned solder bump at each step. Thermal gradient in solder bump is very high and the contribution of thermomigration to atomic flux is comparable with pure electromigration effect.

• Tribology and Lubricants
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• 제18권1호
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• pp.42-48
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• 2002

Experiments were conducted to determine the structural dynamic characteristics of bump foil bearing. The housing of the bearing on the journal was driven by two shakers which were used to simulate dynamic forces acting on the bump foil strips. Three different bump foils(Cu-coated bump, silicon bump, viscoelastic bump) are tested and the dynamic coefficients of three bump foils compared, based on the experimental measurements for a wide range of operating conditions. From the test results, the high damping coefficients of viscoelastic bump are achieved and the possibility of the super-bending-critical operation is suggested.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2001년도 제34회 추계학술대회 개최
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• pp.282-289
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• 2001

Experiments were conducted to determine the structural dynamic characteristics of bump foil bearing. The housing of the bearing on the journal was driven by two shakers which were used to simulate dynamic forces acting on the bump foil strips. Three different bump foils(Cu-coated bump, silicon bump, viscoelastic bump) are tested and the dynamic coefficients of three bump foils compared, based on the experimental measurements for a wide range of operating conditions. From the test results, the high damping coefficients of viscoelastic bump are achieved and the possibility of the super-bending-critical operation is suggested.

• 한국레이저가공학회지
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• 제2권1호
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• pp.51-60
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• 1999

In this paper, weldability and formability of Tailored-Blank (TB) and the structural impact testing of bump beam were investigated to apply TB to automobile bumper beam. The optimal $CO_2$ laser welding condition for TB of SPFC and SPRC steel plates with different thicknesses was obtained. Before welding, the cross section of butt joint was prepared only by shearing without milling process. Real type bump beam was produced by two kind of forming processes such as roll-forming and press-forming, and the good formability of TB was obtained. Impact test results of bump by using pendulum and barrier were satisfied the impact regulation of bump. Finally. It may be confirmed that laser welded TB is well-balanced material in both weight reduction and production cost of automobile bump.