• Journal of Welding and Joining
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• v.31 no.3
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• Journal of the Korean Institute of Intelligent Systems
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• v.23 no.4
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• pp.286-291
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• 2013

In this paper, in-line type flip chip bump 3D inspection equipment, using white light interferometer with large F.O.V., which is aimed to be used in flip chip bump test process is developed. Results of flip chip bump height measurement in many substrates and repeatability test results for the bumps in fixed location of each substrate are shown. Test results from test bench and those from developed flip chip bump 3D inspection equipment are compared and as a result repeatability is improved by reducing the impact of system vibration. A valuation basis for the testing quality of flip chip bump 3D inspection equipment is proposed.

• Tribology and Lubricants
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• v.18 no.2
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• pp.153-159
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• 2002

This paper describes a durability characteristics of an air-lubricated bump foil journal bearing for high speed turbomachinerys at room temperature. At first, lift-off test and load capacity test were performed to understand the general characteristics of an air-lubricated bump foil Journal bearing. A 52 N weighted bump foil bearing sleeve was lilted off from a rotating Journal at about 3,000 rpm, and produced a load capacity of 500 N at an operating speed of 15,000 rpm. The next was 500 cycles lift-off test with an air-lubricated bump foil journal bearing that had a molybdenum disulfide(MoS$_2$) solid lubricant coated top foil. Data from measuring bearing torque and temperature and the observation of rubbing surfAce were included in results. Therefore the results of this work will aid in proving durability of air-lubricated bump foil journal bearings.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2001.11a
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• pp.212-219
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• 2001

This paper describes a durability characteristics of an air-lubricated bump foil journal bearing for high speed turbomachinerys at room temperature. At first, lift-off test and load capacity test were performed to understand the general characteristics of an air-lubricated bump foil journal bearing. A 52N weighted bump foil bearing sleeve was lifted off from a rotating journal at about 3,000rpm, and produced a load capacity of 500N at an operating speed of 15,000rpm. The next was 500 cycles lift-off test with an air-lubricated bump foil journal bearing that had a molybdenum disulfide(MoS$_2$) solid lubricant coated top foil. Data from measuring bearing torque and temperature and the observation of rubbing surface were included in results. Therefore the results of this work will aid in proving durability of air-lubricated bump foil journal bearings.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.477-478
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• 2012

• Journal of Mechanical Science and Technology
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• v.14 no.7
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• pp.744-751
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• 2000

To achieve lower flying height for high areal recording density, the laser zone texturing of the disk needs to be designed to reduce glide height. One problem of the laser bump design is that the regular laser bump pattern often produces glide resonance phenomenon, which leads to failure of the glide height test. However, it was found in this study that glide resonance is an intrinsic problem of the glide head used and resonance phenomenon depends on the type of the head slider, that is, the natural frequency of the slider body. Therefore, higher glide height or glide failure caused by glide resonance does not lead to head/media interface problem in the real drive operating conditions in which the data head is used. Pseudo-random bump pattern greatly reduces the glide resonance. Smaller bump pitch will also help to reduce the glide resonance. However, as bump spacing becomes smaller, glide height will be increased due to increased air pressure developed around the bumps. Lowering bump height is the most effect way to reduce glide avalanche.

• Korean Journal of Metals and Materials
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• v.46 no.5
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• pp.310-314
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• 2008

Electromigration test of flip chip solder bump is performed at $140^{\circ}C$ C and $4.6{\times}10^4A/cm^2$ conditions in order to compare electromigration with thermomigration behaviors by using electroplated Sn-3.5Ag solder bump with Cu under-bump-metallurgy. As a result of measuring resistance with stressing time, failure mechanism of solder bump was evaluated to have four steps by the fail time. Discrete steps of resistance change during electromigration test are directly compared with microstructural evolution of cross-sectioned solder bump at each step. Thermal gradient in solder bump is very high and the contribution of thermomigration to atomic flux is comparable with pure electromigration effect.

• Tribology and Lubricants
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• v.18 no.1
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• pp.42-48
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• 2002

Experiments were conducted to determine the structural dynamic characteristics of bump foil bearing. The housing of the bearing on the journal was driven by two shakers which were used to simulate dynamic forces acting on the bump foil strips. Three different bump foils(Cu-coated bump, silicon bump, viscoelastic bump) are tested and the dynamic coefficients of three bump foils compared, based on the experimental measurements for a wide range of operating conditions. From the test results, the high damping coefficients of viscoelastic bump are achieved and the possibility of the super-bending-critical operation is suggested.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2001.11a
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• pp.282-289
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• 2001

Experiments were conducted to determine the structural dynamic characteristics of bump foil bearing. The housing of the bearing on the journal was driven by two shakers which were used to simulate dynamic forces acting on the bump foil strips. Three different bump foils(Cu-coated bump, silicon bump, viscoelastic bump) are tested and the dynamic coefficients of three bump foils compared, based on the experimental measurements for a wide range of operating conditions. From the test results, the high damping coefficients of viscoelastic bump are achieved and the possibility of the super-bending-critical operation is suggested.

• Laser Solutions
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• v.2 no.1
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• pp.51-60
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• 1999

In this paper, weldability and formability of Tailored-Blank (TB) and the structural impact testing of bump beam were investigated to apply TB to automobile bumper beam. The optimal $CO_2$ laser welding condition for TB of SPFC and SPRC steel plates with different thicknesses was obtained. Before welding, the cross section of butt joint was prepared only by shearing without milling process. Real type bump beam was produced by two kind of forming processes such as roll-forming and press-forming, and the good formability of TB was obtained. Impact test results of bump by using pendulum and barrier were satisfied the impact regulation of bump. Finally. It may be confirmed that laser welded TB is well-balanced material in both weight reduction and production cost of automobile bump.