• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 G
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• pp.2504-2508
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• 1998

In this paper, we propose the new detecting method for three dimensional piezoresistive silicon accelerometer. Furthermore the accelerometer is formed to have endurance for high temperature by perfect isolation of the piezoresistors using Silicon On Insulator(SOI) wafer. Sensor size are optimized with analytical formulae and extended with FEM simulation for the more detailed results. The accelerometer was fabricated by bulk micromachining techonology. We measured the temperature characteristics and the output characteristics, and the both characteristics were compared with the simulated results

• 한국전기전자재료학회논문지
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• 제16권12호
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• pp.1077-1079
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• 2003

This paper describes the development of bulk acoustic wave (BAW) resonators using a PolyVinyliDene Fluoride (PVDF). The resonators have an air gap between a substrate for acoustic isolation without surface micromachining. We measured the resonance frequency and the input reflection coefficient (S$\sub$11/) of resonators using vector network analyzer. The fundamental resonance in this experimental result was measured at 1.4 ㎓ with a return loss of -23.2 ㏈. We can confirm a possibility of resonator application as using a PVDF because it can fabricate the resonator without etching process.

• 한국레이저가공학회지
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• 제10권1호
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• pp.19-27
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• 2007

Previous studies demonstrated that laser ablation under transparent liquid can result in ablation enhancement and particle removal from the surface. Although the ablation enhancement by liquid is already known for semiconductor and metal, the phenomena of polymer ablation have not been studied. In this work, tile liquid-assisted excimer laser ablation process is examined for polymer materials, such as polyethylene terephthalate (PET), polymethyl methacrylate (PMMA) with emphasis on ablation enhancement and surface topography. In the case of PET and PMMA, the effect of liquid is analyzed both for thin water film and bulk water. The results show that application of liquid increases the ablation rate of PMMA while that of PET remains unchanged even in the liquid-assisted process. However, the surface roughness is generally deteriorated in the liquid-assisted process. The surface topography is found to be strongly dependent on the method of liquid application, i.e., thin film or bulk liquid.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1985-1987
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• 2002

Silicon bulk micromachined micromirrors are designed and fabricated for out-of-plane right angle reflection. The micromirror is comprised of a minor plate, springs, magnetic bars and electrodes. Single crystalline silicon is used for a flatness improvement of a mirror plate. Out-of-plane right angle reflection requires a 45 degree operation of the micromirror. The micromirrors are operated by applying a magnetic field, which is generated by a coil located below a substrate. For an individual mirror operation, each mirror is clamped using an electrostatic force against the electromagnetic force. Angular deflections are measured and compared with theoretical data. The micro mirror operates up to 45 degree when magnetic field is 4 kA/m which is generated by a 115 mA coil current Simple addressing is tested, and it is shown that a clamping voltage is less than 5V.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 춘계학술발표대회 논문집
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• pp.60-65
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• 2006

Previous studies demonstrated that laser ablation under transparent liquid can result in ablation enhacement and particle removal from the surface. In this work, the liquid-assisted excimer laser ablation process is examined fer polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), Si, and alumina with emphasis on ablation enhacement, surface topography, and debris formation. In the case of PET and PMMA, the effect of liquid is analyzed both fer thin water film and bulk water. As the ablation enhanement by liquid is already known for Si and alumina, the analysis focuses on surface topography and debris formation resulting from the liquid-assisted laser ablation process. The results show that application of liquid increases the ablation rate of PMMA while that of PET remains unchanged even in the liquid-assisted process. It is also revealed that the liquid can significantly improve the surface quality by reducing the debris deposition. However, the surface roughness is generally deteriorated in the liquid-assisted process. The surface toporaphy is found to be strongly dependent on the method of liquid application, i.e., thin film or bulk liquid.

• 한국전기전자재료학회논문지
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• 제15권12호
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• pp.1039-1044
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• 2002

Film Bulk Acoustic Resonator (FBAR) using thin piezoelectric films can be made as monolithic integrated devices with compatibility to semiconductor process, leading to small size, low cost and high Q RF circuit elements with wide applications in communications area. This paper presents an MMIC compatible suspended FBAR using SOI micromachining. It is possible to make a single crystal silicon membrane using a SOI wafer In fabricating active devices, SOI wafer offers advantage which removes the substrate loss. FBAR was made on the 12㎛ silicon membrane. Electrode and Piezoelectric materials were deposited by RF magnetron sputter. The maximum resonance frequency of FBAR was shown at 2.5GHz range. The reflection loss, K$^2$$\_$eff/, Q$\_$serise/ and Q$\_$parallel/ in that frequency were 1.5dB, 2.29%, 220 and 160, respectively.

• 한국정보통신학회논문지
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• 제3권3호
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• pp.661-669
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• 1999

프로브 카드는 IC(integrated circuit) 칩을 테스트할 때, 테스트 시스템의 가장 중요한 부분의 하나이다. 본 연구는 다수의 반도체 칩을 동시에 테스트 할 수 있는 범프(bump)형 수직형 프로브 카드에 관한 것이다. 프로브는 범프 팁을 가지는 실리콘 캔틸레버로 구성되어 있다. 캔틸레버의 최적 크기를 결정하기 위하여 캔틸레버의 크기는 유한요소해석에 의하여 결정되었다. 프로브는 SDB웨이퍼를 사용하여 RIE, 등방성 에칭, 그리고 벌크 마이크로머시닝에 의하여 제조되었다. FEM에 의해 결정된 최적 크기로 제작된 프로브 카드는 범프의 높이가 30$\mum$, 캔틸레버의 두께가 $\mum$, 빔의 폭이 100 $\mum$, 길이가 400 $\mum$, 이었다. 제조된 프로브 카드의 접촉 테스트에서 측정된 접촉 저항은 $2 \Omega$ 미만이고, 2만회의 접촉동안 접촉 저항의 변화가 거의 없는 특성을 보였다. 따라서 20,000회 이상의 수명을 가질 수 있음을 알 수 있었다.

• 전기전자학회논문지
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• 제1권1호
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• pp.1-10
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• 1997

It is well-known that rectangular bulk-Si sensors prepared by etch or epi etch-stop micromachining technology are already in practical use today, but the conventional bulk-Si sensor shows some drawbacks such as large chip size and limited applications as silicon sensor device is to be miniaturized. We consider a circular-shape SOI(Silicon-On-Insulator) micro-cavity technology to facilitate multiple sensors on very small chip, to make device easier to package than conventional sensor like pressure sensor and to provide very high over-pressure capability. This paper demonstrates the cross-functional results for stress analyses(targeting $5{\mu}m$ deflection and 100MPa stress as maximum at various applicable pressure ranges), for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from two-type SOI structures where the double SOI structure shows the most feasible deflection and small stress at various ambient pressures. Those results can be compared with the ones of circular-shape bulk-Si based sensor$^{[17]}. The SOI micro-cavity formed the sensors is promising to integrate with calibration, gain stage and controller unit plus high current/high voltage CMOS drivers onto monolithic chip.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1617-1620
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• 2007

This paper presents a magnetostrictive transpositioner and its fabrication process. To get a transposition movement without shifting or twisting, it is designed as an array type. To fabricate the suggested design, micromachining and selective DC magnetron sputtering processes are combined. TbDyFe film is sputter-deposited on the back side of the bulk micromachined transpositioner, with the condition as: Ar gas pressure below $1.2{\times}10^{-9}$ torr, DC input power of 180W and heating temperature of up to $250^{\circ}C$ for the wireless control of each array component. After the sputter process, magnetization and magnetostriction of each sample are measured. X-ray diffraction studies are also carried out to determine the film structure and thickness of the sputtered film. For the operation, each component of the actuator has same length and out-of-plane motion. Each component is actuated by externally applied magnetic fields up to 0.5T and motion of the device made upward movement. As a result, deflections of the device due to the movement for the external magnetic fields are observed.

• 센서학회지
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• 제14권6호
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• pp.374-380
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• 2005

Vibration sensors have a wide scope of applications in the field of monitoring systems that needs to perceive an undesirable physical vibration before a critical failure occurs in a system, and then costly unplanned repairs can be avoided. The conventional vibration sensors developed so far have many disadvantages, such as complex manufacturing process, bulkiness, high cost, less reliability and so on. This paper reports a simple-structured vibration sensor, which has been developed using a commercialized conductive ball and silicon bulk-micromachining technology. The sensor consists of a conductive ball placed in $600{\mu}m$-deep micromachined silicon groove, in which Au thin film has been patterned using a shadow mask technique. Prior to the formation of the Au thin film, the sharp convex corner was rounded for smooth meatl deposition on the non-planar surface at the edge of the groove. The measurement results of the fabricated vibration sensor demonstrate a stable response characteristic to low-frequency vibration range ($1{\sim}30{\;}Hz$).