• Bulletin of the Korean Chemical Society
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• v.32 no.7
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• pp.2227-2232
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• 2011

The new metrology, Advanced Poly-silicon Ultra-Trace Profiling (APUTP), was developed for measuring bulk Cu and Ni in heavily boron-doped silicon wafers. A Ni recovery yield of 98.8% and a Cu recovery yield of 96.0% were achieved by optimizing the vapor phase etching and the wafer surface scanning conditions, following capture of Cu and Ni by the poly-silicon layer. A lower limit of detection (LOD) than previous techniques could be achieved using the mixture vapor etching method. This method can be used to indicate the amount of Cu and Ni resulting from bulk contamination in heavily boron-doped silicon wafers during wafer manufacturing. It was found that a higher degree of bulk Ni contamination arose during alkaline etching of heavily boron-doped silicon wafers compared with lightly boron-doped silicon wafers. In addition, it was proven that bulk Cu contamination was easily introduced in the heavily boron-doped silicon wafer by polishing the wafer with a slurry containing Cu in the presence of amine additives.

• Journal of Electrochemical Science and Technology
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• v.2 no.3
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• pp.157-162
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• 2011

We report a simple route for synthesizing multi-dimensional structured silicon anode materials from commercially available bulk silicon powders via metal-assisted chemical etching process. In the first step, silver catalyst was deposited onto the surface of bulk silicon via a galvanic displacement reaction. Next, the silver-decorated silicon particles were chemically etched in a mixture of hydrofluoric acid and hydrogen peroxide to make multi-dimensional silicon consisting of one-dimensional silicon nanowires and micro-scale silicon cores. As-synthesized silicon particles were coated with a carbon via thermal decomposition of acetylene gas. The carbon-coated multi-dimensional silicon anodes exhibited excellent electrochemical properties, including a high specific capacity (1800 mAh/g), a stable cycling retention (cycling retention of 89% after 20 cycles), and a high rate capability (71% at 3 C rate, compared to 0.1 C rate). This process is a simple and mass-productive (yield of 40-50%), thus opens up an effective route to make a high-performance silicon anode materials for lithiumion batteries.

• Applied Science and Convergence Technology
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• v.23 no.3
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• pp.113-127
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• 2014

For more than five decades, silicon has dominated the semiconductor industry that supports memory devices, ICs, photovoltaic devices, etc. Photoluminescence (PL) is an attractive silicon characterization technique because it is contactless and provides information on bulk impurities, defects, surface states, optical properties, and doping concentration. It can provide high resolution spectra, generally with the sample at low temperature and room-temperature spectra. The photoluminescence properties of silicon at low temperature are reviewed and discussed in this study. In this paper, silicon bulk PL spectra are shown in multiple peak positions at low temperature. They correspond with various impurities such as In, Al, and Be, phonon interactions, for example, acoustical phonons and optical phonons, different exciton binding energies for boron and phosphorus, dislocation related PL emission peak lines, and oxygen related thermal donor PL emissions.

• Transactions of the Society of Information Storage Systems
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• v.1 no.2
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• pp.175-181
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• 2005

SiOB is an essential part of slim optical pickup, where the silicon mirror, LD stand, silicon PD are integrated and LD is flip chip bonded. SiOB is fabricated with bulk micromachining. Especially the fabrication of silicon wafer with stepped concave areas has many extraordinary difficulties. As a matter of fact, experiences and knowledges are rare in the fabrication of the highly stepped silicon wafer. The difficulties occurring in the integration of PD and SiOB, and highly stepped patterning, and silicon mirror roughness and how-to-solve will be discussed.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.56-60
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• 1996

This paper presents the initial results of development of a inertial navigation grade silicon pendulous accelerometer. This effort focused on developing a bulk-micromachined silicon pendulum and designing a PI-servo controller. Performance data presented in this paper includes threshold, bias short term stability and nonlinearity of scale factor. This accelerometer developed is demonstrated the feasibility of meeting one-nautical-mile-per-hour accuracy.

• Journal of the Korean Ceramic Society
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• v.20 no.3
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• pp.211-216
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• 1983

This work aims at characterizing silicon grains and its compacts. In order to remove iron silicon grains were washed with 5N hydrochloride at 60-7$0^{\circ}C$ for 170 hrs, and then followed the chemical analysis by atomic absorption spectrophotometer X-ray diffraction analysis SEM observation and specific surface area determination by B. E. T. Mixtures of graded silicon particles with two or three different sizes were made into packings by mechanical vibration. The mixtures were used to make compacts with 10 mm in diameter and 70mm in length by isostatically pressing at 1, 208 kg/$cm^2$ (20 kpsi) and 4, 255kg/$cm^2$ (60 kpsi) respectively. Bulk densities of packings and compacts were measured. A slip made of magnesium nitrate solution and fine silicon particles was spray-dried and then decomposed at 30$0^{\circ}C$ for the purpose of coating the uniform layer of magnesium oxide on the surface of particles. The results obtained are as follows: (1) About two thirds of iron content could be removed from silicon by washing silicon powders with hydrochloride. (2) Uniform layer of magnesium oxide on the surface of silicon could be prepared by spray-drying suspension and by decomposing it. (3) B. E. T. specific surface area of fine silicon particles was 2, 826.753$m^3$/kg. (4) In the binary system with two sizes of 40-53$\mu\textrm{m}$ particles and <10$\mu\textrm{m}$ particles the maximum bulk density of packing was 55% of theoretical value and that of compacts made at the pressure of 4, 255 kg./$cm^2$ (60 kpsi) was 73% of theoretical value. (5) In the ternary system with three sizes the maximum bulk density of packing was 1.43 g/$cm^3$and that of compacts was 1.80g/$cm^3$which is equivalent to 77.6% of theoretical value. The composition of the closest compact was consisted of 50% of 40-53$\mu\textrm{m}$ particles 20% of 10-30$\mu\textrm{m}$ particles and 30% of <10$\mu\textrm{m}$ parti-cles.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.257.2-257.2
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• 2015

In this paper, we report on the 10.33% efficient thin film/bulk tandem solar cells with the top cell made of amorphous silicon thin film and p-type bulk crystalline silicon bottom cell. The tunneling junction layers were used the doped nanocrystalline Si layers. It has to allow an ohmic and low resistive connection. For player and n-layer, crystalline volume fraction is ~86%, ~88% and dark conductivity is $3.28{\times}10-2S/cm$, $3.03{\times}10-1S/cm$, respectively. Optimization of the tunneling junction results in fill factor of 66.16 % and open circuit voltage of 1.39 V. The open circuit voltage was closed to the sum of those of the sub-cells. This tandem structure could enable the effective development of a new concept of high-efficiency and low cost cells.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.3
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• pp.121-125
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• 2016

The effect of temperature and pressure in the nitrogen ambient furnace on bulk micro defect (BMD) and denuded zone (Dz) is experimentally investigated. It is found that as pressure increases, Dz depth increases with a small decrease of BMD density in the range of temperature, $100{\sim}300^{\circ}C$. BMD density with hot isostatic pressure treatment (HIP) at temperature of $850^{\circ}C$ is higher than that without HIP while Dz depth is lower due to much higher BMD density. As the pressure increases, BMD density is increased and saturated to a critical value, and Dz depth increases even if BMD density is saturated. The concentration of nitrogen increases near the surface with increasing pressure, and the peak of the concentration moves closer to the surface. The nitrogen is gathered near the surface, and does not become in-diffusion to the bulk of the wafer. The silicon nitride layer near the surface prevents to inject the additional nitrogen into the bulk of the wafer across the layer. The nitrogen does not affect the formation of BMD. On the other hand, the oxygen is moved into the bulk of the wafer by increasing pressure. Dz depth from the surface is extended into the bulk because the nuclei of BMD move into the bulk of the wafer.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.43.2-43.2
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• 2011

Minority Carrier recombination should be suppressed for high efficiency solar cells. However, impurities in the silicon bulk region deteriorate the minority carrier lifetimes, causes conversion efficiency drop. In this study, we introduced phosphorus external gettering for silicon heterojunction solar cell substrates. Gettering was undergone at 750, 800, 850 and $900^{\circ}C$ in furnace for 30 minutes. Bulk lifetimes and calculated diffusion length were improved. We applied phosphorus gettering to silicon heterojunction solar cells. Gettered group and ungettered group were used as substrate of silicon heterojunction solar cells. After fabrication, characteristics of solar cells were analyzed. The results were observed to see the enhancement of substrate quality which directly connects with solar cell properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.08a
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• pp.93-93
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• 2003

Photoluminescence(PL) properties of Silicon nanocrystals (nc-Si) as a function of temperature is reported to consider the mechanism of PL. Nc-Si has been made by $Si^+$ ion-implantation into thermal $SiO_2$ and subsequent annealing. And after gold had been diffused at the same samples above, the resultant PL spectra has been compared to the PL spectra from the non-gold doped nc-Si. PL peak energy variation from nc-Si is same with the variation of energy bandgap of bulk silicon as temperature changes from 6 K to room temperature. This result may mean nc-Si is still indirect transition material like bulk silicon. Gold doped nc-Si reveals short peak wavelength of PL spectrum than gold undoped one. PL peak shift through gold doing process shows clearly the PL mechanism is not from defect or interface states. PL intensity increases from 6K to a certain temperature and then decrease to room temperature. This characteristic with temperature shows that phonon have a role for the luminescence as theory explains that electron and hole can be recombined radiatively by phonon's assist in nc-Si, which is almost impossible in bulk silicon. Therefore luminescence is observed in nc-Si constructed less than a few of unit cell and the peak energy of luminescence can be higher than the bulk bandgap energy by the bandgap widening effect occurs in nanostructure.