• Title/Summary/Keyword: Bulk AlN

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A study on the thermal oxidation process of bulk AlN single crystal grown by PVT (PVT 법으로 성장 된 bulk AlN 단결정의 열 산화 공정에 관한 연구)

  • Kang, Hyo Sang;Kang, Seung Min
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.30 no.5
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    • pp.168-173
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    • 2020
  • To analyze and describe the behavior and mechanisms occurring in the thermal oxidation process of AlN, bulk AlN single crystals were thermally treated with different temperatures. As a result, it was confirmed that full-scale oxidation of bulk AlN and growth of Al-oxide occurred from the temperature of 800℃, which confirmed that the weight% of O elements tended to increase while the N elements decreased with increasing the temperature. In the case of thermal treatment at 900℃, the grown Al-oxides were merged with neighboring Al-oxides and began to form α-Al2O3 poly-crystals. During thermal treatment at the temperature of 1000℃, hexagonal pyramidal shaped poly-crystalline α-Al2O3 was clearly observed. Through the X-ray diffraction pattern analysis, the changes of surface crystal structure according to the temperature of bulk AlN were investigated in detail.

Investigation of Buffer Traps in AlGaN/GaN Heterostructure Field-Effect Transistors Using a Simple Test Structure

  • Jang, Seung Yup;Shin, Jong-Hoon;Hwang, Eu Jin;Choi, Hyo-Seung;Jeong, Hun;Song, Sang-Hun;Kwon, Hyuck-In
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.4
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    • pp.478-483
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    • 2014
  • We propose a new method which can extract the information about the electronic traps in the semi-insulating GaN buffer of AlGaN/GaN heterostructure field-effect transistors (HFETs) using a simple test structure. The proposed method has a merit in the easiness of fabricating the test structure. Moreover, the electric fields inside the test structure are very similar to those inside the actual transistor, so that we can extract the information of bulk traps which directly affect the current collapse behaviors of AlGaN/GaN HEFTs. By applying the proposed method to the GaN buffer structures with various unintentionally doped GaN channel thicknesses, we conclude that the incorporated carbon into the GaN back barrier layer is the dominant origin of the bulk trap which affects the current collapse behaviors of AlGaN/GaN HEFTs.

A study on the AlN crystal growth using its thin films grown on SiC substrate (SiC 기판상에 성장된 AlN 박막을 이용한 AlN 결정 성장에 관한 연구)

  • Yin, Gyong-Phil;Kang, Seung-Min
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.28 no.4
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    • pp.170-174
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    • 2018
  • AlN crystal is been developing in global site for many years and 1 inch diameter wafer was already developed but it is demanding the efforts for the better quality. On the other hand, also the 2-inch size is developing recently to reduce the unit cost for manufacturing and to use to fabrication of the UV LED chips. In this study, we tried to evaluate the possibility of bulk AlN crystals on his thin films by PVT method. The AlN thin film was grown on SiC single crystal 2" wafer by HVPE method. We successfully grew AlN bulk crystal of a thickness of 7 mm using its thin film of a thickness of $10{\mu}m$ as a seed crystal. The resultants of AlN crystals were identified by metallurgical microscope, optical stereographic microscope and DCXRD measurement.

Comparative Study on Ablation Characteristics of Ti-6Al-4V Alloy and Ti2AlN Bulks Irradiated by Femto-second Laser (펨토초 레이저에 의한 티타늄 합금과 티타늄질화알루미늄 소결체의 어블레이션특성 비교연구)

  • Hwang, Ki Ha;Wu, Hua Feng;Choi, Won Suk;Cho, Sung Hak;Kang, Myungchang
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.7
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    • pp.97-103
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    • 2019
  • Mn+1AXn (MAX) phases are a family of nano-laminated compounds that possess unique combination of typical ceramic properties and typical metallic properties. As a member of MAX-phase, $Ti_2AlN$ bulk materials are attractive for some high temperature applications. In this study, $Ti_2AlN$ bulk with high density were synthesized by spark plasma sintering method. X-ray diffraction, micro-hardness, electrical and thermal conductivity were measured to compare the effect of material properties both $Ti_2AlN$ bulk samples and a conventional Ti-6Al-4V alloy. A femto-second laser conditions were conducted at a repetition rate of 6 kHz and laser intensity of 50 %, 70% and 90 %, respectively, laser confocal microscope were used to evaluate the width and depth of ablation. Consequently, the laser ablation result of the $Ti_2AlN$ sample than that of the Ti-6Al-4V alloys show a considerably good ablation characteristics due to its higher thermal conductivity regardless of to high densification and high hardness.

Optically Pumped Stimulated Emission from Column-III Nitride Semiconductors. (III족 질화물반도체의 광여기 유도방출)

  • 김선태;문동찬
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1994.11a
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    • pp.50-53
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    • 1994
  • In this study. we report the properties of optically pumped stimulated emission at room temperature (RT) from column-III nitride semiconductors of GaN, GaInN, AlGaN/GaN double hetero-structure (DH) and AlGaN/GaInN DH which grown by low pressure metal-organic vapor phase epitaxy on sapphire substrate using an AIN buffer-layer. The peak wavelength of the stimulated emission at RT from AlGaN/GaN DH is 370nm and the threshold of excitation pumping power density (P$\_$th/) is about 89㎾/$\textrm{cm}^2$, and they from AlGaN/GaInN DH are 403nm and 130㎾/$\textrm{cm}^2$, respectively. The P$\_$th/ of AlGaN/GaN and AlGaN/GaInN DHs are lower than the bulk materials due to optical confinement within the active layers of GaN and GaInN. The optical gain and the polarization of stimulated emission characteristics are presented in this article.

AlN-Si Thin Film Bulk Acoustic Over-moded Resonator (AlN 압전 박막과 Si을 이용한 체적탄성파 Over-moded 공진기)

  • 이시형;이전국;김상희;김종헌;윤기현
    • Journal of the Korean Ceramic Society
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    • v.37 no.12
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    • pp.1198-1203
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    • 2000
  • AlN와 Si을 이용하여 체적 탄성파 over-moded 공진기를 형성하였다. 높은 c-축 배향성을 갖는 AlN 압전박막은 sputtering에 의해 저온에서 증착하였다. AlN 박막의 c-축 배향성은 기판과 타겥의 거리가 가까울수록, 증착 압력이 낮을수록 (002) 면으로의 성장이 촉진되었다. Si 기판을 이용한 over-moded 공진기로부터 TFR의 임피던스를 산출한 결과 공진영역의 면적에 가장 의존하였다. Al/AlN/Al로 이루어진 TFR의 입력 임피던스는 공진 영역이 크기가 200㎛×200㎛인 경우 가장 50Ω에 근접하였다. Over-moded 공진 특성은 Si 기판의 낮은 Q로 인해 mode 수 294인 2.60976 GHz에서 0.109%의 유효 전기기계결합계수(K/sub eff/²)와 0.3의 K/sub eff/²·Q값을 보였다.

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A study on growing of bulk AlN single crystals grown having a (011) growth face of by PVT method (PVT법을 이용한 (011)면으로 성장된 AlN 단결정 성장에 관한 연구)

  • Kang, Seung-Min
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.25 no.1
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    • pp.32-34
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    • 2015
  • AlN Single Crystal were grown by PVT (Physical vapor transport) method on bulk seed. It was performed by high-frequency induction-heating coil. AlN source powder was loaded at bottom side of the carbon crucible and the crystal seed was loaded at the upper side of the crucible. The temperature conditions of the growth was varied $2000{\sim}2100^{\circ}C$ and the surrounding pressure was $1{\times}10^{-1}{\sim}200$ Torr. And the hot-zone of the heating position was controlled elaborately according to growth. The 17 mm-diameter, 7 mm-thickness AlN single crystal is obtained for about 600 hours growing. It was recognized that the growth direction of as grown crystal was R[011] by the Laue X-Ray camera measurement.

A study on the growth of 3 inch grade AlN crystal (직경 3인치의 AlN 단결정 성장에 관한 연구)

  • Kang, Seung-Min
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.29 no.3
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    • pp.140-142
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    • 2019
  • AlN (Aluminum Nitride) crystal which could be used to substrates for UV LEDs was grown by PVT ((Physical Vapor Transport) method. 3 inch AlN single crystal with a thickenss of 4 mm was grown using Polycrystalline seed for 120 hours. In this report, a result of 3 inch polycrystalline bulk AlN growth behavior using large size crucible and growth condition were reported.

Characteristics of Material Properties and Machining Surface in Electrical Discharge Machining of Ti2AlN and Ti2AlC Materials (Ti2AlN과 Ti2AlC 소결체의 마이크로 방전가공에서 재료물성에 따른 가공표면 특성)

  • Choi, Eui-Song;Lee, Chang-Hoon;Baek, Gyung-Rae;Kim, KwangHo;Kang, Myung Chang
    • Journal of Powder Materials
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    • v.22 no.3
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    • pp.163-168
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    • 2015
  • Ti alloys are extensively used in high-technology application because of their strength, oxidation resistance at high temperature. However, Ti alloys tend to be classified very difficult to cut material. In this paper, The powder synthesis, spark plasma sintering (SPS), bulk material properties such as electrical conductivity and thermal conductivity are systematically examined on $Ti_2AlN$ and $Ti_2AlC$ materials having most light-weight and oxidation resistance among the MAX phases. The bulk samples mainly consisted of $Ti_2AlN$ and $Ti_2AlC$ materials with density close to theoretical value were synthesized by a SPS method. Machining characteristics such as machining time, surface quality are analyzed with measurement of voltage and current waveform according to machining condition of micro-electrical discharge machining with micro-channel shape.