• 제목/요약/키워드: Bubbling Phenomena

검색결과 4건 처리시간 0.02초

Gas 분산 기-액 반응조에서 기포운동이 열전달에 미치는 영향

  • 손병진;이현
    • 대한설비공학회지:설비저널
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    • 제8권1호
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    • pp.10-13
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    • 1979
  • The study for bubbling phenomena to influence heat transfer in gas - liquid contactors. The sparged contactor is gaining importance for gas-liquid chemical reactions. In this paper, correlations between Reynolds number and heat transfer coefficient were studied and experimental expressions were also obtained over broth of areas, namely, laminar area and turbulent area respectively.

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직접접촉식 액화천연가스 기화기의 특성에 관한 연구 (A Study on Characteristics of Direct Contact LNG Evaporator)

  • 한승탁;김종보
    • 대한기계학회논문집
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    • 제18권4호
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    • pp.903-911
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    • 1994
  • This study addresses the phenomena of bubbling, icing, eruption, component varieties of the evaporated natural gas, and volumetric heat transfer coefficients obtained during the operation of a proposed LNG evaporator between LNG and water in direct contact. In the present investigation, the explosive and eruption phenomena within the water column were not observed during the entire operation of the heat exchanger. Compared with the natural gas produced by conventional LNG evaporator, the analysis of the gas produced by the direct contact LNG evaporator shows that nitrogen, methane, and ethane components were reduced by 0.002~0.007mol%(4~14%), 1.6~1.92mol%(1.9~2.3%) and 0.17~1.28mol%(1.1~8.4%) respectively, while the moisture content was rather increased by 0.51~0.76mol%. The maximum volumetric heat transfer coefficient of the direct contact heat exchanger was found to be $21, 800kW/m^3\cdotK$.

SFB 공정시 Si-Si 집합 계면에 형성되는 산화막의 관찰 (Observation of Oxide Film Formed at Si-Si Bonding Interface in SFB Process)

  • 주병권;오명환;차균현
    • 전자공학회논문지A
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    • 제29A권1호
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    • pp.41-47
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    • 1992
  • In SFB Process, after 110$0^{\circ}C$ annealing in wet OS12T(95$^{\circ}C$ HS12TO bubbling) atmosphere, the existence of the interfacial oxide film in micro-gap at Si-Si bonding interface was identified. The angle lapping/staining and SEM morphologies of bonding interface showed that the growing behavior of interfacial oxide made a contribution to eliminate the micro-gaps having a width of 200-300$\AA$. In case of the diodes composed of p-n wafer pairs made by SFB processes, the annealed one in wet OS12T atmosphere exhibited a dielectric breakdown phenomena of interfacial oxide at 37-40 volts d.c.

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