• Journal of Welding and Joining
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• v.13 no.3
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• pp.55-64
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• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

• Journal of Ocean Engineering and Technology
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• v.22 no.3
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• pp.71-75
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• 2008

This paper illustrates haw $Y_2O_3$ contributes to crack-healing strengths as a function of crack-healing temperature and the additive amount. In investigating mechanical properties, the indentation fracture method is very simple and useful, but careful attention must be paid to the statistical data processing because data may be scattered excessively, especially for brittle materials. To estimate accurate AE signal properties we applied the useful time-frequency method with a discrete wavelet analysis algorithm. In experiments, three kinds of specimens were prepared. After the specimens were indented by a Vickers indentor, they were heat-treated and crack-healed to evaluate bending strength and the AE signal. With higher amounts of the additive powder, as 1, 3, or 5% wt. of $Y_2O_3$, the concentrative tendency of dominant frequency trended toward lower frequency groups. The $Al_2O_3$ ceramic with 3% wt. of $Y_2O_3$ was judged most suitable because it demonstrated superior crack-healing ability and relative concentration on the highest frequency group.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.466-469
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• 2013

Currently, piezoelectric ceramics are being applied in various fields, such as ultrasonic sensors, vibration devices, sound filters, and various energy conversion devices. Flexible piezoelectric ceramics are widely studied in an effort to mitigate the disadvantages of their brittle and inductile properties. Structural damage to piezoelectric fibers is much less than that to thin films when piezoelectric fibers are twisted or bent. Therefore, stretchable devices can be fabricated if piezoelectric fibers are obtained using an elongated substrate. In this study, sintering processes of PZT ($Pb(Zr_{0.53}Ti_{0.47})O_3$) fibers prepared by electrospinning were optimized through the TGA and XRD analyses. The crystal structure and microstructure of the piezoelectric fibers were investigated by XRD, FE-SEM and TEM.

• Journal of the Semiconductor & Display Technology
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• v.18 no.3
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• pp.133-139
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• 2019

The utilizations of ceramics in the modern industries are increasing due to the desirable combinations of electrical, mechanical and physical properties found in ceramics. Ceramic materials are brittle, hard, strong in compression, weak in shearing and tension which is prone to affect the defects such as scratch, crack and breakage during the machining. Generally, the defects of the ceramic machining are generated from the structural vibrations of the machine. In this study, the dynamic characteristics of a machining center for ceramic machining were investigated to analyze the structural vibrations for the improved stability. Frequency response test and computer simulation have been conducted for the analysis and the design improvement. The improved design is suggested to suppress vibrations for the higher stability of the machine and further to reduce vibrations. And the result shows that simple design alterations without any change of major parts of the machine can reduce the vibration of the machine effectively.

• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.287-294
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• 2012

Ceramic Matrix Composites (CMCs) represent a class of non-brittle refractory materials for harsh and extreme environments in aerospace and other applications. The quasi-ductility of these structural materials depends on the quality of the interface between the matrix and the fiber surface. In this study, a manufacture route is described where in contrast to most other processes no additional fiber coating is used to adjust the fiber/matrix interfaces in order to obtain damage tolerance and fracture toughness. Adapted microstructures of uncoated carbon fiber preforms were developed to permit the rapid infiltration of molten alloys and the subsequent reaction with the carbon matrix. Furthermore, any direct reaction between the melt and fibers was minimized. Using pure silicon as the reactive melt, C/SiC composites were manufactured with an aim of employing the resulting composite for friction applications. This paper describes the formation of the microstructure inside the C/C preform and resulting C/C-SiC composite, in addition to the MAX phases.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.10
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• pp.1039-1045
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• 2007

Ultrasonic machining (USM) is suitable for machining hard, brittle and non-conductive materials such as silicon, glass and ceramics. Usually, when micro holes are machined on glass by USM, roundness of hole entrance is poor and cracks appear around the hole exit. In this paper the machining characteristics were studied for roundness improvement and exit crack prevention. From experiments, the tool bending and the shape of tool tip affect hole roundness. When the tool tip is hemispherical, good roundness of holes was obtained. The feedrate and the rotational speed of the tool affect the exit crack. With the machining conditions of 150 rpm in spindle speed and $0.5\;{\mu}m/s$ in feedrate, micro holes with less than $100\;{\mu}m$ in diameter were machined without an exit crack.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.363-366
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• 2003

In nanomachining processes, chemical effects are more dominant factor compared with physical deformation. For example, during the nanoscratch on a silicon surface in the atmosphere, micro protuberances are formed due to the mechanochemical reaction between the diamond tip and the surface. On the contrary, in case of chemically stable materials, such as ceramics or glasse, the surface protuberance are not formed. The purpose of this study is to understand effects of the mechanochemical reaction between tip and surfaces on deformation behaviors of hard-brittle materials. Nanometerscale elasoplastic deformation behavior of single crystal silicon (100) was characterized with the surface protuberance phenomena, and compared with that of borosilicate (Pyrex glass 7740).

• Journal of the Korean Ceramic Society
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• v.21 no.4
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• pp.361-365
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• 1984

This study has been carried out to sinter silicon nitride with additives and to show the effect of surface finishments on its strength and Weibull modulus which are two most important factors for its applications into structural ceramics. Silicon nitride was sintered with the additions of $Al_2O_3$ and $Y_2O_3$ under pressureless cond-ition. The optimum properties were obtained by sintering at 1, 75$0^{\circ}C$ for 3hrs under $N_2$ atmosphere and the strength showed 6, 500kg/$cm^2$ at room temperature and 3, 300kg/$cm^2$ at 120$0^{\circ}C$. The effects of surface treatment on the strength of sintered $Si_3N_4$ were studied and the results showed that fine surface treatment increased the strength by up to 50% The Weibull analysis showed that its modulus was increased with increasing fineness of surface finishments. It was concluded that the mechanical properties of sintered silicon nitride could be improved by fine surface grinding which implied the brittle-fracture nature of sintered silicon nitride.

• Korean Journal of Materials Research
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• v.16 no.3
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• pp.157-162
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• 2006

Pressable ceramics have many applications in the field of dental industry because of their excellent esthetic, compressive strength, chemical durability. Despite these attractive characteristics, they have not been widely used since they are very brittle and extremly sensitive to porcelain. In this study, the fabrication of pressable dental porcelain ($SiO_2-Al_2O_3-K_2O-Na_2O$) as a function of contents of $Al_2O_3,\;BaO\;and\;ZrO_2$ were investigated. And then compressive strength, Vickers hardness, density and thermal expansion coefficient (TEC) tests have been carried out to evaluate properties of pressable dental porcelain fabricated. The property of pressable dental porcelain fabricated by adding of 15%$Al_2O_3$ and 2%BaO contents was closely approximated to that of natural tooth.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.963-966
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• 2000

Abrasive jet machining(AJM) process is similar to the sand blasting, and effectively removes hard and brittle materials. AJM has applied to rough working such as deburring and rough finishing. As the needs for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro groove cutting of glass. Diameter of hole and width of line in this groove cutting is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro groove cutting in glass, but the size of machined groove was increased about 2~4${\mu}{\textrm}{m}$. therefore, this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD parts.