• Journal of the Computational Structural Engineering Institute of Korea
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• v.29 no.4
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• pp.335-345
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• 2016

It has problems to use the existing construction information classification system as the bridge breakdown structure due to lack of relationships between element classes. In this study, we proposed the bridge breakdown system for supplementation of above-mentioned classification system. The proposed system, for geometric information modeling, was based on international standards of methodology for structuring part families namely PLIB Part 42. In particular, the breakdown system, considering of the functional classification for the semantic information of the elements is included. In addition, we proposed a basic framework for actual modeling using bridge breakdown system and showed that it can be used in practice.

• Journal of Korean Institute of Fire Investigation
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• v.3 no.1
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• pp.12-15
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• 2003

The purpose of this study is to distinguish the causes of broken glass from doors or windows when it is found being originally kept among the remains on the floor in fire site - whether it was broken due to heating or by outer power through test and the properties of the broken plane including the pattern on the plane. Addition to it, the study tries to find characteristics for judging the point and direction of breakdown through the analysis of glass broken by outer power. With two causes assumed - a. breakdown due to heating and b. breakdown due to outer power - 3 pieces of glass plates $(30cm{\times}30cm{\times}5mm)$ for each case were tested, getting the results as following: 1. For the glass broken due to the change of temperature The broken plane is of slow curve and smooth without any pattern. 2. For the broken due to outer power With the impact point as the center, the shows breakdown of radial type and the side shows breakdown of near-perpendicular type. The far the broken piece is from the impact point, the bigger the size is. The broken piece at the impact point is of long triangle type and the two long planes of the triangle shows semi-arc with the center of breakdown point and the other plane shows opposite pattern 3. Change of the pattern and type of the glass due to outer power The pattern and type of the glass due to outer power shows change due to heatihg.

• Food Science and Biotechnology
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• v.17 no.1
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• pp.52-57
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• 2008

The effects of transglutaminase (TG) on the pasting and rheological properties of different wheat cultivars ('Sharpshooter', 'Russ', and 'AcAriss') blended with barley (40%) or soy (20%) flour were investigated. In the rapid visco-analyzer (RVA) pasting profile, the addition of barley or soy flour to wheat flour samples induced a decrease in peak, trough, final viscosity, breakdown and setback values. However, TG treatment of these blends significantly increased peak viscosity and breakdown (p<0.05). In particular, TG treatment greatly increased the breakdown of wheat flour blended with soy flour, indicating that the cross-linking of proteins through TG may somehow be related to an increase in starch granule rupturing in pastes. Storage (G') and loss (G") moduli of the sample pastes increased with an increase in frequency ($\omega$), while complex viscosity (${\eta}*$) decreased. In all wheat cultivars, G', G", and $\eta$ were decreased by the addition of barley or soy flour, or TG treatment. Results suggest that protein cross-linking by TG can produce unique and improved properties in wheat flours blended with barley or soy flour.

• Korean Journal of Food Science and Technology
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• v.37 no.2
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• pp.149-153
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• 2005

Composition and pasting properties of endosperms of one common buckwheat (CB) and two tartary buckwheats (TB) grown in China were investigated. No differences were observed in proximate composition and amino acid content between CB and TB. Content of rutin in TB was 22-fold higher than that of CB. Among minerals, iron, calcium, and magnesium contents were higher in TB than CB, whereas zinc, manganese, and phosphorus contents were similar, Pasting properties measured with Rapid visco Analyzer revealed TB-2 cultivar had highest peak viscosity, trough, and breakdown, followed by TB-1 and CB. Setback of TB was about 2.2-fold greater than that of CB. Significant differences in color were observed between CB and TB, and among TB cultivars.

• Transactions on Electrical and Electronic Materials
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• v.11 no.6
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• pp.261-265
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• 2010

In this paper, we attempt to improve the electrical characteristics of epoxy resin at high temperature (above $80^{\circ}C$) by adding magnesium oxide (MgO), which has high thermal conductivity. Scanning electron microscopy (SEM) of the dispersion of specimens with added MgO reveals that they are evenly dispersed without concentration. The dielectric breakdown characteristics of $SiO_2$ and MgO nanocomposites are tested by measurements at different temperatures to investigate the filler's effect on the dielectric breakdown characteristics. The dielectric breakdown strength of specimens with added $SiO_2$ decreases slowly below $80^{\circ}C$ (low temperature) but decreases rapidly above $80^{\circ}C$ (high temperature). However, the gradient of the dielectric breakdown strength of specimens with added MgO is slow at both low and high temperatures. The dielectric breakdown strength of specimens with 0.4 wt% $SiO_2$ is the best among the specimens with added $SiO_2$, and that of specimens with 3.0 wt% and 5.0 wt% MgO is the best among those with added MgO. Moreover, the dielectric strength of specimens with 3.0 wt% MgO at high temperatures is approximately 53.3% higher than that of specimens with added $SiO_2$ at $100^{\circ}C$, and that of specimens with 5.0 wt% of MgO is approximately 59.34% higher under the same conditions. The dielectric strength of MgO is believed to be superior to that of $SiO_2$ owing to enhanced thermal radiation because the thermal conductivity rate of MgO (approximately 42 $W/m{\cdot}K$) is approximately 32 times higher than that of $SiO_2$ (approximately 1.3 $W/m{\cdot}K$). We also confirmed that the allowable breakdown strength of specimens with added MgO at $100^{\circ}C$ is within the error range when the breakdown probability of all specimens is 40%. A breakdown probability of up to 40% represents a stable dielectric strength in machinery and apparatus design.

• Korean Journal of Human Ecology
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• v.3 no.1
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• pp.88-99
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• 2000

This study was perfomed to search for how properties of the starch viscosity appear in different qualities, when acetic acid is added. For this study, corn starch which belongs to A-type. Potato starch to B-type. and sweet potato starch to C-type were chosen as an experimental material. which was added to acetic acid controlled as pH 4.0, 4.5, and 5.0 at the time of before and after heating. After that, the viscosity properties of each starch was analyzed using Amylogram and Brookfield viscometer. As a result. the viscosity was shown high in an order of potato. sweet potato, and corn starch. According to addition of acetic acid. tile viscosity appeared to be low. The viscosity differences of before and after heating when the acid is added were shown as follows : Amylogram shows that the lower the pH is. the lower the viscosity is when the acid is added before-heating. In case the acid is added before-heating, gelatinization temperature, consistency and setback was increased. but breakdown decreased. In case the acid is added after-heating, the viscosity goes down at soon as it is added meanwhile consistency and setback was decreased. but breakdown increased. Such properties of the viscosity show a conspicuous variation in an order of potato. sweet Potato. and corn starch. Brookrield viscometer shows that the lower the apparent viscosity is. the lower pH is at the time of before-heating when the acid is added. In case of after-heating, when the acid is added. the apparent viscosity shows a higher inclination than that of before-heating in corn starch and sweet potato starch.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1617-1620
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• 1999

In this work, the effect of blend on physical and electrical properties investigated. The two kinds of low-density polyethylene (LDPE) whose densities are evaluated at $0.9179[g/cm^3]$ and $0.9192[g/cm^3]$, respectively, were used and blended according to the different blend ratio. The LDPE with the blend ratio of 50[wt%] represented the lowest impulse breakdown strength, $F_{BImp}$ at $30[^{\circ}C]$, but the highest $F_{BImp}$ at $90[^{\circ}C]$. DC breakdown strength, $F_{BDC}$. decreased with the increase of blend ratio at $30[^{\circ}C$, but increased at $60[^{\circ}C]$. The current density decreased with a blend ratio up to 75 [wt%] at $90[^{\circ}C]$. By analyzing the diffraction patterns of XRD, we found that the LDPE with the blend ratio of 50 [wt%] represented the largest crystal size of (020) plane. We investigated the relationship between the effect of blend and electrical properties and these results are discussed.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1645-1647
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• 1999

Epoxy compound has been used as insulation material in electrical equipment because of its properties 1) Nowadays, becoming higher voltage system, the properties of interface between epoxy and its metal insert become more important. In this paper, we suggest two types semiconducting paste. One is epoxy type and the other is olephine type. After sprayed the semiconducting paste on metal insert sanded, we procedure the test one is the adhesion strength test, the other is electrical breakdown strength test. So we knew that the epoxy type paste became more higher adhesion strength than olephine type paste because of its homogeneity at the interfaces. And at the breakdown strength test, olephine type paste became less higher than epoxy type paste because of its volatility. So in this study, we suggest the optimum interface condition by adjusting the semiconducting paste and surface roughness.

• Transactions on Electrical and Electronic Materials
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• v.15 no.5
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• pp.284-289
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• 2014

The effects of additives (Nb, Bi and Cr) on the microstructure, varistor properties, and aging behavior of V/Mn/Co/ La/Dy co-doped zinc oxide ceramics were systematically investigated. An analysis of the microstructure showed that all of the ceramics that were modified with various additives were composed of zinc oxide grain as the main phase, and secondary phases such as $Zn_3(VO_4)_2$, $ZnV_2O_4$, and $DyVO_4$. The $Bi_2O_3$-modified samples exhibited the lowest density, the $Nb_2O_5$-modified sample exhibited the largest average grain size, and the $Cr_2O_3$-modified samples exhibited the highest breakdown field. All additives improved the non-ohmic coefficient (${\alpha}$) by either a small or a large margin, and in particular an $Nb_2O_5$ additive noticeably increased the non-ohmic coefficient to be as large as 36. The $Bi_2O_3$-modified samples exhibited the highest stability with variation rates for the breakdown field and for the non-ohmic coefficient (${\alpha}$) of -1.2% and -26.3%, respectively, after application of a DC accelerated aging stress of 0.85 EB/$85^{\circ}C$/24 h.

• Transactions on Electrical and Electronic Materials
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• v.16 no.2
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• pp.82-85
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• 2015

Mechanical and electrical properties of epoxy/silica microcomposites were investigated. The cycloaliphatic- type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and the curing agent was of an anhydride type. To measure the glass transition temperature (Tg), dynamic differential scanning calorimetry (DSC) analysis was carried out, and tensile and flexural tests were performed using a universal testing machine (UTM). Electrical breakdown strength, the most important property for electrical insulation materials, and insulation breakdown strength were also tested. The microcomposite with 60 wt% microsilica showed maximum values in mechanical and electrical properties.