• 제목/요약/키워드: Boron Nitride Nanotube

검색결과 24건 처리시간 0.021초

Growth and Dissolve of Defects in Boron Nitride Nanotube

  • Lee, Jun-Ha;Lee, Hoong-Joo
    • 반도체디스플레이기술학회지
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    • 제3권3호
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    • pp.23-25
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    • 2004
  • The defect formation energy of boron nitride (BN) nanotubes is investigated using molecular-dynamics simulation. Although the defect with tetragon-octagon pairs (4-88-4) is favored in the flat cap of BN nanotubes, BN clusters, and the growth of BN nanotubes, the formation energy of the 4-88-4 defect is significantly higher than that of the pentagon-heptagon pairs (5-77-5) defect in BN nanotubes. The 5-77-5 defect reduces the effect of the structural distortion caused by the 4-88-4 defect, in spite of homoelemental bonds.

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질화붕소 나노피포드에 기반한 나노분자 메모리 시스템에 관한 연구 (Molecular Shuttle Memory System Based on Boron-Nitride Nanopeapod)

  • 변기량;강정원;최원영;황호정
    • 한국진공학회지
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    • 제14권1호
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    • pp.40-48
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    • 2005
  • 분자 위치제어 메모리 시스템에 대하여 고전적인 분자동역학을 이용하여 결합에너지 및 다양한 외부전기장의 형태에 따른 셔틀 풀러렌 동작에 관하여 연구하였다. 단일 나노피포드 형(single-nanopeapod type)은 질화붕소 나노튜브(boron-nitride nanotube)속에 세 개의 엔도풀러렌(endo-fullerene)과 양쪽 끝에 구리 전극이 채워져 있는 구조를 갖고 있는 구조를 갖고 있다. 결론적으로, 분자동역학 시뮬레이션 결과로부터 이 나노메모리 시스템은 비휘발성임을 알 수 있었다. 안정적인 bit 변화를 위해서는 단일 나노피포드 형은 0.1 eV/Å 외부전기장이 필요로 함을 알 수 있었다.

Thermal buckling analysis of SWBNNT on Winkler foundation by non local FSDT

  • Semmah, Abdelwahed;Heireche, Houari;Bousahla, Abdelmoumen Anis;Tounsi, Abdelouahed
    • Advances in nano research
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    • 제7권2호
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    • pp.89-98
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    • 2019
  • In this work, the thermal buckling characteristics of zigzag single-walled boron nitride (SWBNNT) embedded in a one-parameter elastic medium modeled as Winkler-type foundation are investigated using a nonlocal first-order shear deformation theory (NFSDT). This model can take into account the small scale effect as well as the transverse shear deformation effects of nanotubes. A closed-form solution for nondimensional critical buckling temperature is obtained in this investigation. Further the effect of nonlocal parameter, Winkler elastic foundation modulus, the ratio of the length to the diameter, the transverse shear deformation and rotary inertia on the critical buckling temperature are being investigated and discussed. The results presented in this paper can provide useful guidance for the study and design of the next generation of nanodevices that make use of the thermal buckling properties of boron nitride nanotubes.

Hydro-thermo-mechanical biaxial buckling analysis of sandwich micro-plate with isotropic/orthotropic cores and piezoelectric/polymeric nanocomposite face sheets based on FSDT on elastic foundations

  • Rajabi, Javad;Mohammadimehr, Mehdi
    • Steel and Composite Structures
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    • 제33권4호
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    • pp.509-523
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    • 2019
  • In the present work, the buckling analysis of micro sandwich plate with an isotropic/orthotropic cores and piezoelectric/polymeric nanocomposite face sheets is studied. In this research, two cases for core of micro sandwich plate is considered that involve five isotropic Devineycell materials (H30, H45, H60, H100 and H200) and an orthotropic material also two cases for facesheets of micro sandwich plate is illustrated that include piezoelectric layers reinforced by carbon and boron-nitride nanotubes and polymeric matrix reinforced by carbon nanotubes under temperature-dependent and hydro material properties on the elastic foundations. The first order shear deformation theory (FSDT) is adopted to model micro sandwich plate and to apply size dependent effects from modified strain gradient theory. The governing equations are derived using the minimum total potential energy principle and then solved by analytical method. Also, the effects of different parameters such as size dependent, side ratio, volume fraction, various material properties for cores and facesheets and temperature and humidity changes on the dimensionless critical buckling load are investigated. It is shown from the results that the dimensionless critical buckling load for boron nitride nanotube is lower than that of for carbon nanotube. It is illustrated that the dimensionless critical buckling load for Devineycell H200 is highest and lowest for H30. Also, the obtained results for micro sandwich plate with piezoelectric facesheets reinforced by carbon nanotubes (case b) is higher than other states (cases a and c).The results of this research can be used in aircraft, automotive, shipbuilding industries and biomedicine.

BNNT와 CNT의 강화효과에 대한 복합재 계면물성 관점의 고찰 (An Essay of the Reinforcing Effect of BNNT and CNT: A Perspective on Interfacial Properties)

  • 양승화
    • Composites Research
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    • 제37권3호
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    • pp.155-161
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    • 2024
  • 질화붕소나노튜브와 탄소나노튜브는 가장 대표적인 1차원 나노구조체로, 기존의 금속 및 세라믹재료에 비해 매우 뛰어난 물성을 가지고 있음이 알려지면서 다기능성 경량복합재의 강화재로 가장 큰 주목을 받아왔다. 각각 저 차원 무기나노소재와 유기나노소재를 대표하는 이들 나노구조는 우열을 가리기 어려울 정도로 뛰어난 기계적강성과 강도 그리고 열전도 특성을 가지고 있다. 따라서 구조용 복합소재 및 방열 복합재 분야에서 이 두 나노튜브의 강화효과는 고분자기지와 혼합되면서 형성되는 재료 간 계면 물성이 어떠한가에 의해 크게 영향을 받게 된다. 본 논문에서는 질화붕소나노튜브와 탄소나노튜브가 복합재 내 기지와 형성하는 계면 물성에 대한 비교 연구 사례를 통해 두 나노튜브의 강화효과에 대해 고찰한다. 기계적특성을 좌우할 수 있는 계면에서의 하중전달 특성을 튜브의 인발거동과 분자모델링을 통한 상호작용 에너지를 통해 분석한 결과와 더불어, 나노튜브에 결함이 존재하는 경우 두 나노튜브가 보이게 되는 상반되는 계면특성변화에 대해 점탄성 거동을 예시로 하여 소개한다.

Growth and Dissolve of Defects in Boron Nitride Nanotube

  • Jun Ha, Lee;Won Ha, Mun
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2004년도 춘계학술대회 발표 논문집
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    • pp.59-62
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    • 2004
  • The defect formation energy of boron nitride (BN) nanotubes is investigated using molecular-dynamics simulation. Although the defect with tetragon-octagon pairs (4-88-4) is favored in the flat cap of BN nanotubes, BN clusters, and the growth of BN nanotubes, the formation energy of the 4-88-4 defect is significantly higher than that of the pentagon-heptagon pairs (5-77-5) defect in BN nanotubes. The 5-77-5 defect reduces the effect of the structural distortion caused by the 4-88-4 defect, in spite of homoelemental bonds. The instability of the 4-88-4 defect generates the structural transformation into BNNTs with no defect at about 1500 K.

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인실리코 해석을 통한 단일벽 질화붕소 나노튜브의 크기 변화에 따른 압전탄성 거동 예측연구 (An In-silico Simulation Study on Size-dependent Electroelastic Properties of Hexagonal Boron Nitride Nanotubes)

  • 이재원;양승화
    • Composites Research
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    • 제37권2호
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    • pp.132-138
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    • 2024
  • 본 연구에서는 분자동역학 전산모사를 통해 육방정계 단일벽 질화붕소 나노튜브(BNNT)의 반경 변화에 따른 압전탄성 변화를 규명하였다. 질화붕소의 거동을 비교적 잘 모사하는 Tersoff 포텐셜과 기계적 하중인가에 따른 질소 및 붕소원자의 상대변위로 인한 분극의 정량화를 위해 강체 이온 근사를 채택하였다. 선형 압전탄성 구성방정식을 기반으로 각각의 질화붕소에 변형률을 인가하고 이에 따른 전기적 변위와 응력을 산출하여 압전상수와 영률을 각각 예측하였다. 그 결과, BNNT의 압전상수는 반경이 증가함에 따라 점진적으로 감소하는 양상을 보였다. 반면 탄성계수의 경우 불연속적 구조를 가지는 질화붕소를 등가의 연속체 구조로 등가시키는 방법에 따라 증가 또는 감소하는 경향을 보였다. BNNT의 곡률변화에 따른 물성변화를 가상실험에 기반한 경험적 모델로 근사하기 위해 BNNT의 튜브반경-압전탄성물성 간 상관관계식을 제안하였다. 또한 BNNT의 반경변화에 따른 물성을 곡률의 관점에서 설명하기 위해, BNNT와 질화붕소 나노시트(BNNS)의 결합에너지와 탄성변형에 따른 원자간 결합길이 변화가 각각의 구조의 변형에너지 증가에 기여하는 정도를 상호 비교하였다.

탄소 나노튜브 위에 붕소 및 탄소 질화 박막이 코팅된 이종접합 구조 미세팁의 전자방출 특성 (Electron Emission Properties of Hetero-Junction Structured Carbon Nanotube Microtips Coated With BN And CN Thin Films)

  • 노영록;김종필;박진석
    • 전기학회논문지
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    • 제59권4호
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    • pp.743-748
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    • 2010
  • Boron nitride (BN) and carbon nitride (CN) films, which have relatively low work functions and commonly exhibit negative electron affinity behaviors, were coated on carbon nanotubes (CNTs) by magnetron sputtering. The CNTs were directly grown on metal-tip (tungsten, approximately 500nm in diameter at the summit part) substrates by inductively coupled plasma-chemical vapor deposition (ICP-CVD). The variations in the morphology and microstructure of CNTs due to coating of the BN and CN films were analyzed by field-emission scanning electron microscopy (FE-SEM). The energy dispersive x-ray (EDX) spectroscopy and Raman spectroscopy were used to identify the existence of the coated layers (CN and BN) on CNTs. The electron-emission properties of the BN-coated and CN-coated CNT-emitters were characterized using a high-vacuum field emission measurement system, in terms of their maximum emission currents ($I_{max}$) at 1kV and turn-on voltage ($V_{on}$) for approaching $1{\mu}A$. The results showed that the $I_{max}$ current was significantly increased and the $V_{on}$ voltage were remarkably reduced by the coating of CN or BN films. The measured values of $I_{max}-V_{on}$ were as follows; $176{\mu}A$-500V for the 5nm CN-coated emitter and $289{\mu}A$-540V for the 2nm BN-coated emitter, respectively, while the $I_{max}-V_{on}$ of the as-grown (i.e., uncoated) emitter was $134{\mu}A$-620V. In addition, the CNT emitters coated with thin CN or BN films also showed much better long-term (up to 25h) stability behaviors in electron emission, as compared with the conventional CNT emitter.

탄소 나노튜브 혼합액으로 봉공처리된 텅스텐 카바이드 용사층의 아연 내부식성에 대한 연구 (A study on Zn corrosion resistance of WC spray coating sealed with carbon nanotube suspensions)

  • 김봉훈;이보영
    • Journal of Welding and Joining
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    • 제33권1호
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    • pp.49-53
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    • 2015
  • An experimental study was conducted to investigate the effect of carbon nanotubes on the zinc corrosion resistance of sealing layer formed on the Tungsten Carbide spray coating. Using the nanotubes, a sealing agent in the form of solid-liquid suspensions was made and applied to the surface of spray coating. A series of experiments, consisted of three stages such as preparation of test piece, molten-pot immersion test, and evaluation of micro structure, were undertaken to demonstrate complicated interaction existing between zinc ions and sealing layer containing the nanotubes. Experimental results showed newly developed sealing layer were less susceptible to corrosion and thus coated layer was well protected even in the case of 10 days exposure. Comparison of the micro structure after molten pot test also indicated that carbon nanotubes still remained in the matrix and organized more reliable frame work constituted with boron nitride and chromium compound. It was revealed that carbon nanotubes in the sealing layer played positive role to enhance zinc corrosion resistance in the perspective of both fibrous structure and inherent chemical stability.

Nanocomposites for microelectronic packaging

  • 이상현
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.99.1-99.1
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    • 2016
  • The materials for an electronic packaging provide diverse important functions including electrical contact to transfer signals from devices, isolation to protect from the environment and a path for heat conduction away from the devices. The packaging materials composed of metals, ceramics, polymers or combinations are crucial to the device operating properly and reliably. The demand of effective charge and heat transfer continuous to be challenge for the high-speed and high-power devices. Nanomaterials including graphene, carbon nanotube and boron nitride, have been designed for the purpose of exploiting the high thermal, electrical and mechanical properties by combining in the matrix of metal or polymer. In addition, considering the inherent electrical and surface properties of graphene, it is expected that graphene would be a good candidate for the surface layer of a template in the electroforming process. In this talk, I will present recent our on-going works in nanomaterials for microelectronic packaging: 1) porous graphene/Cu for heat dissipations, 2) carbon-metal composites for interconnects and 3) nanomaterials-epoxy composites as a thermal interface materials for electronic packaging.

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