• 마이크로전자및패키징학회지
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• 제16권1호
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• pp.27-31
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• 2009

본 논문에서는 웨이퍼 레벨 기술을 이용한 CIS용 폴리머 접합 기술을 연구하고 접합 후의 warpage 분석과 개별 패키지의 신뢰성 테스트를 수행하였다. 균일한 접합 높이를 유지하기 위하여 glass 웨이퍼 상에 dam을 형성하고 접합용 폴리머 층을 patterning하여 Si과 glass 웨이퍼의 접합 테스트를 수행하였다. Si 웨이퍼의 접합온도, 접합 압력 그리고 접합 층이 낮을수록 warpage 결과가 감소하였으며 접합시간과 승온 시간이 짧을수록 warpage 결과가 증가하는 것을 확인하였다. 접합 된 웨이퍼를 dicing 하여 각 개별 칩 단위로 TC, HTC, Humidity soak의 신뢰성 테스트를 수행하였으며 warpage 결과가 패키지의 신뢰성 결과에 미치는 영향은 미비한 것으로 확인되었다.

• 대한치과교정학회지
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• 제22권2호
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• pp.449-474
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• 1992

The purpose of this study was to evaluate the in vitro shear bond strengths to enamel and the failure sites of three ceramic brackets and one metal bracket in combination with light cured orthodontic adhesive. The brackets were divided into four groups. Each ceramic bracket group had different bonding mechanisms with adhesive. Group A; metal bracket with foil-mesh base (control group) Group B; ceramic bracket with micromechanical retention Group C; ceramic bracket with chemical bonding Group D; ceramic bracket with mechanical retention and chemical bonding. Forty extracted human lower first premolars were prepared for bonding and 10 brackets for each group were bonded to prepared enamel surfaces with $Transbond^{\circledR}$ light cured ortho dontic adhesive. Twenty four hours after bonding, the Instron universal testing machine was used to test the shear bond strength of brackets to enamel. After debonding, brackets and enamel surfaces were examined under stereoscopic microscope to determine the failure sites, Statistical analysis of the data was carried out with ANOVA test and $Scheff\acute{e}$ test using SPSS PC+. The results were as follows. 1 . There were statistically significant differences in mean shear bond strengths of three ceramic bracket groups (p < 0.05). Shear bond strengths of group C and D were significantly higher than that of group B and shear bond strength of group C was significantly higher than that of group D. 2. Group C and D both had significantly higher shear bond strengths than metal bracket (group A), but there were no significant differences in shear bond strengths between group A and B (p < 0.05). 3. The failure sites of four bracket groups were also different. Group C and D failed primarily at enamel-adhesive interface, but group A and B failed primarily at bracket base-adhesive interface. 4. Among all ceramic bracket groups, group B was very similar to metal bracket in the aspect of shear bond strength and failure site.

• 한국도로학회논문집
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• 제7권4호
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• pp.9-20
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• 2005

본 연구는 아스팔트 덧씌우기 포장에 나타나는 반사균열을 제어하기 위하여 노후된 시멘트 콘크리트 포장과 아스팔트 덧씌우기 포장 경계면에 보강재의 효과적인 부착 방법을 찾기 위하여 수행하였다. 이를 위한 부착재로는 RSC-4 유화아스팔트, 컴파운드, 불포화 폴리에스터 수지 (UPR) 등 3종류를 사용하였다. 또한 아스팔트 혼합물은 3종류의 밀입도 혼합물(AC 60-80, RLDPE 8%, PG 76-22)을 사용하였다. 보강 재료로서 유리섬유 그리드 하부에 직포가 부착된 것을 사용하였다. 복합모드 파괴(mode II)의 모사를 위한 촉진시험은 휠트랙킹 장비를 이용하여 수행하였다. 반사균열의 진전은 피로수명으로서 하중 사이클 수에 따라 측정하였고, 공시체의 변위는 각각 시험 공시체에 대하여 demec 게이지를 이용하여 측정하였다. 본 연구 결과, UPR 부착이 가장 효과적이었으며 다음은 RSC-4의 순이었다. 그러나 현장 적용성을 고려할 때 , RSC-4 유제가 보강 재료의 부착을 위해 적절한 선택으로 판단된다.

• 마이크로전자및패키징학회지
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• 제13권2호
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• pp.21-26
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• 2006

NCA의 물성이 미세피치 Chip on glass (COG) 접합부의 신뢰성에 미치는 영향을 연구하였다. Si 위에 Sn을, 유리기판 위에 In을 열증발 방법으로 증착하고 lift-off 방법을 이용하여 $30{\mu}m$ 피치를 가지는 솔더범프를 형성하였으며 열압착 방법으로 $120^{\circ}C$에서 In 범프와 Sn 범프를 접합하였다. 접합할 때 세 종류의 Non conductive adhesive (NCA)를 적용하였다. 신뢰성은 $0^{\circ}C$와 $100^{\circ}C$ 사이로 열충격시험을 2000회까지 실시하여 평가하였다. 4단자 저항측정법을 이용하여 접합부의 저항을 측정하였다. 필러의 양이 증가할수록 열충격시험 후 접합부의 저항이 가장 적게 증가하여 신뢰성이 우수하였다. 필러의 양이 증가할수록 NCA의 열팽창이 작아지기 때문이다.

• 한국전기전자재료학회논문지
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• 제32권1호
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• pp.6-12
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• 2019

Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

• 대한기계학회논문집A
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• 제36권4호
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• pp.395-403
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• 2012

오늘날 접합시 열에 의한 재료 손상과 접착제(ACA, NCA) 이용으로 부품간의 정렬이 문제가 되고있다. 따라서, 본 논문은 FPCB 와 HPCB 금속(Au) PAD를 직접 접합하였다. 이때 박막인 재료에 손상을 입히는 열, 부품간의 정렬에 문제가 되는 접착제(ACA, NCA)를 사용하지 않고 상온에서 접합을 하였다. 접합시 초음파 혼을 이용하여 접합을 하였으며, 초음파혼은 40kHz이다. 공정 조건은 접합압력 0.60MPa, 접합시간 0.5, 1.0, 1.5, 2.0sec이다. 또한, 산업에서 요구하는 접합강도는 필강도 테스트 결과값으로 0.60Kgf 이상이며, 본 실험에서는 접합강도가 0.80MPa 이상이 나왔다. 이로서, 열에 의한 재료 손상과, 접 착제(ACA, NCA)에 의한 정렬 문제를 해결하였다. 그리고 산업산업에서 바로 적용하고 생산할 수 있는 FPCB, HPCB 시료 제작을 하였다.

• The Journal of Advanced Prosthodontics
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• 제1권2호
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• pp.63-67
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• 2009

STATEMENT OF PROBLEM. Use of custom tray and tray adhesive is clinically recommended for elastomeric impression material. However there is not clear mention of drying time of tray adhesive in achieving appropriate bonding strength of tray material and impression material. PURPOSE. This study is to investigate an appropriate drying time of tray adhesives by evaluating tensile bonding strength between two types of polyvinylsiloxane impression materials and resin tray, according to various drying time intervals of tray adhesives, and with different manufacturing company combination of impression material and tray adhesive. MATERIAL AND METHODS. Adhesives used in this study were Silfix (Dentsply Caulk, Milford, Del, USA) and VPS Tray Adhesive (3M ESPE, Seefeld, Germany) and impression materials were Aquasil Ultra (monophase regular set, Dentsply Caulk, Milford, Del, USA) and Imprint II Garant (regular body, 3M ESPE, Seefeld, Germany). They were used combinations from the same manufacture and exchanged combinations of the two. The drying time was designed to air dry, 5 minutes, 10 minutes, 15 minutes, 20 minutes, and 25 minutes. Total 240 of test specimens were prepared by auto-polymerizing tray material(Instant Tray Mix, Lang, Wheeling, Il, USA) with 10 specimens in each group. The specimens were placed in the Universal Testing machine (Instron, model 3366, Instron Corp, University avenue, Nowood, MA, USA) to perform the tensile test (cross head speed 5 mm/min). The statistically efficient drying time was evaluated through ANOVA and Scheffe test. All the tests were performed at 95% confidence level. RESULTS. The results revealed that at least 10 minutes is needed for Silfix-Aquasil, and 15 minutes for VPS Tray Adhesive-Imprint II, to attain an appropriate tensile bonding strength. VPS Tray Adhesive-Imprint II had a superior tensile bonding strength when compared to Silfix-Aquasil over 15 minutes. Silfix-Aquasil had a superior bonding strength to VPS Tray Adhesive-Aquasil, and VPS Tray Adhesive-Imprint II had a superior tensile bonding strength to Silfix-Imprint II at all drying periods. CONCLUSION. Significant increase in tensile bonding strength with Silfix-Aquasil and VPS Tray adhesive-Imprint II combination until 10 and 15 minutes respectively. Tray adhesive-impression material combination from the same company presented higher tensile bonding strength at all drying time intervals than when using tray adhesive-impression material of different manufactures.

• Restorative Dentistry and Endodontics
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• 제23권1호
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• pp.401-412
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• 1998

The aim of this study was to measure the regional micro-shear bond strength of dentin bonding agents to dentin, and to investigate the relationship between the micro-shear bond strength and two dentinal characteristics ; Vickers hardness and remaining dentin thickness. Twenty-four freshly extracted, noncarious human molars were selected for this study. The materials tested in this study consisted of two commercially available dentin bonding agents (MAC-BOND, ONE-STEP) and two restorative light-cured composite resins (AELITEFIL, Z100). The occlusal or side surface of tooth crown was sectioned to expose dentin, and the exposed surface was finally polished with # 600 sandpaper. Four groups of application methods were used combining the filling materials and the dentin bonding agents. The composite resin-attached tooth specimens were embeded in a cold cure acrylic resin, and were cut with a low speed diamond saw to the dimension of 1mm $\times$ 1mm. Nine specimens were obtained from each tooth. The cut specimens were divided into three groups depending on the position of the dentin bonding surface. The micro-shear bond strength, remaining dentin thickness, and dentinal hardness were measured. Experimental results were then statistically analyzed with ANOVA. t-test, Scheffe test, and regression analysis. From this experiment, the following results were obtained : 1. In the case of occlusal surface bonding, the pooled micro-shear bond strength of ONST-AELIT group (16.62 MPa) was significantly higher than that of MACB-AELIT group (9.91 MPa) (p<0.05). However, there was no significant difference in the micro-shear bond strength depending on the dentin position (p>0.05). 2. In the case of side surface bonding of crown, the pooled micro-shear bond strength of four different bonding groups was not significantly different among each other (p>0.05). However, in three of the test groups (ONST-AELIT, MACB-Z100, ONST-Z100), the micro-shear bond strength to the lower 1/3(III) position was significantly lower than that to middle 1/3(II) position of surface (p<0.05). 3. In the ONST-AELIT bonding group, the pooled micro-shear bond strength to the occlusal surface was significantly lower than that to the side surface of crown (p<0.05). 4. There was no significant correlation between the micro-shear bond strength and dentin hardness / remaining dentin thickness (p>0.05).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.477-478
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.1359-1360
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• 2011