• 마이크로전자및패키징학회지
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• 제29권4호
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• pp.41-47
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• 2022

Ag sintering technologies have received great attention as it was applied to the inverter of Tesla's electric vehicle Model III. Ag sinter bonding technology has advantages in heat dissipation design as well as high-temperature stability due to the intrinsic properties of the material, so it is useful for practical use of SiC and GaN devices. This study was carried out to understand the sinter joining temperature effect on the robust Ag sintered joints in air without pressure within 10 min. Electroplated Ag finished Cu dies (3 mm × 3 mm × 2 mm) and substrates (10 mm × 10 mm × 2 mm) were introduced, respectively, and nano Ag paste was applied as a bonding material. The sinter joining process was performed without pressure in air with the bonding temperature as a variable of 175 ℃, 200 ℃, 225 ℃, and 250 ℃. As results, the bonding temperature of 175 ℃ caused 13.21 MPa of die shear strength, and when the bonding temperature was raised to 200 ℃, the bonding strength increased by 157% to 33.99 MPa. When the bonding temperature was increased to 225 ℃, the bonding strength of 46.54 MPa increased by about 37% compared to that of 200 ℃, and even at a bonding temperature of 250 ℃, the bonding strength exceeded 50 MPa. The bonding strength of Ag sinter joints was directly influenced by changes in the necking thickness and interfacial connection ratio. In addition, developments in the morphologies of the joint interface and porous structure have a significant effect on displacement. This study is systematically discussed on the relationship between processing temperatures and bonding strength of Ag sinter joints.

• 한국결정학회:학술대회논문집
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• 한국결정학회 2004년도 학술대회지
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• pp.6-6
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• 2004

• Bulletin of the Korean Chemical Society
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• 제34권2호
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• pp.609-614
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• 2013

Extended H$\ddot{u}$ckel tight-binding band structure calculations are used to address the chemical bonding and elastic properties of $Zr_2AC$ (A=Al, Si, P, and S). Elastic properties are interpreted by analyzing the density of states and the crystal orbital overlap population for the respective phases. Our results show that the bulk modulus of these ternary compounds is determined by the strength of Zr-A bonds.

• Macromolecular Research
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• 제14권3호
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• pp.331-337
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• 2006

In the present study we investigated the relationship between the morphology and mechanical properties of electrospun polysulfone (PSF)/polyurethane (PU) blend nonwovens, by using the electrospinning process to prepare three types of electrospun nonwovens: PSF, PU and PSF/PU blends. The viscosity, conductivity and surface tension of the polymer solutions, were measured by rheometer, electrical conductivity meter and tensiometer, respectively. The electrospun PSF/PU blend nonwovens were characterized by scanning electron microscopy (SEM) and with a universal testing machine. The SEM results revealed that the electrospun PSF nonwoven had a structure consisting of cross-bonding between fibers, whereas the electrospun PU nonwoven showed a typical, point-bonding structure. In the electrospun PSF/PU blend nonwovens, the exact nature of the point-bonding structure depended on the PU contents. The mechanical properties of the electrospun PSF/PU blend nonwoven were affected by the structure or the morphology. With increasing PU content, the mechanical behaviors, such as Young's modulus, yield stress, tensile strength and strain, of the electrospun PSF/PU blend nonwovens were by up to 80%.

• 건축역사연구
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• 제31권1호
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• pp.51-60
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• 2022

In the 16~17th centuries, the construction of T-shaped pavilion in Gyeongsangbuk-do was centered on the families of the Goseong-Lee clan and Andong-Kwon clan, who had a lot of exchanges with each other near Andong. It can be presumed that the complex structure of the T-shaped pavilion was intended to represent the technology, economic power, and social influence of the clan. After the 18th century, construction areas spread and construction subjects were diversified, but the number of new constructions decreased. It can be seen that T-shaped pavilion was erected and used for public purposes rather than personal reasons in terms of layout or flat scale. The roof of the T-shaped pavilion is very diverse depending on the wooden structure, the height of the roof and the configuration of the apex. The T-shaped pavilion, which combines two parts, has been developed in a way that strengthens not only the appearance but also the structural bonding force. The bonding strength is strengthened through the process of "roof aligning", "roof bonding", "structure connection", and "structure integration", which shows a similar tendency to the age of actual cases.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 G
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• pp.3313-3315
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• 1999

Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera respectively. A bond characteristic on the interface was analyzed by using IT- IR. Si-F bonds on Si surface after HF pre-treatment are replaced by Si-OH during a DI water rinse. Consequently, hydrophobic wafer was bonded by hydrogen bonding of Si $OH{\cdots}(HOH{\cdots}HOH{\cdots}HOH){\cdots}OH-Si$. The bond strength depends on the HF pre-treatment condition before pre- bonding (Min:$2.4kgf/crn^2{\sim}Max:14.9kgf/crn^2$)

• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.55-60
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• 2020

최근 참단 반도체 패키징 기술은 고성능 SIP(system in packaging) 구조로 발전해 가고 있고, 이를 실현시키기 위해서 구리 대 구리 접합은 가장 핵심적인 기술로 대두되고 있다. 구리 대 구리 접합 기술은 아직 구리의 산화 특성과 고온 및 고압력 공정 조건, 등 해결해야 할 문제점들이 남아 있다. 본 연구에서는 아르곤과 질소를 이용한 2단계 플라즈마 공정을 이용한 저온 구리 접합 공정의 접합 계면 품질을 정량적 접합 강도 측정을 통하여 확인하였다. 2단계 플라즈마 공정은 구리 표면에 구리 질화막을 형성하여 저온 구리 접합을 가능하게 한다. 구리 접합 후 접합 강도 측정은 4점 굽힘 시험법과 전단 시험법으로 수행하였으며, 평균 접합 전단 강도는 30.40 MPa로 우수한 접합 강도를 보였다.

• Journal of the Korean Wood Science and Technology
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• 제47권5호
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• pp.655-662
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• 2019

This study evaluated the multi-bonding performances of timbers as well as those of reinforcement and timber to obtain data for preparing guidelines regarding the use of timbers as large structural members. For the multi-bonding performances of timbers, four types of bonding surfaces were prepared according to the pith position. For the bonding performances of FRP (fiber-reinforced plastic)/steel plate and timber, a total of 11 types of specimens were produced for the selection of the appropriate adhesive. The bonding performances of the produced specimens were evaluated through a water soaking delamination test, a water boiling delamination test, and a block shear strength test. The test results showed that the bonding strength of the bonding surface according to the pith position was highest in the specimen for which the two sections with the pith at the center of the cross-section on timber and between the bonding surfaces (the tangential and radial sections were mixed) were bonded. Furthermore, the specimens for which the section (radial section) with the pith on the bonding surface of the timber was bonded showed a high delamination percentage. The results of the block shear strength test showed that the bonding section did not have a significant effect on the shear strength, and that the measured wood failure percentage was higher than the KS standard value. The PVAc adhesive showed the highest bonding strength between larix timber and GFRP (glass FRP). Furthermore, the epoxy and polyurethane adhesives showed good bonding strength for CFRP (carbon FRP) and structure steel, respectively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.1004-1006
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• 1998

Mo-tip FED of 1 inch diagonal was vacuum sealed using sodalime-to-sodalime glass electrostatic bonding under $10^{-7}torr$. The bonding properties of the bonded sodalime-to sodalime structure were investigated and emission characteristic of packaged FED panel was measured.

• 소성∙가공
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• 제5권1호
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• pp.37-46
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• 1996

Superplastic forming/diffusion bonding (SPF/DB) processes were analyzed using a rigid visco-plastic finite element method. The optimum pressure-time relationship for a target strain rate and thickness distributions were predicted by two-node line elements based on the membrane approximation for plane strain. Material behavior during SPF/DB of the integral structures having complicated shapes was investigated. The tying condition is employed for the analysis of inter-sheet contact problems. A movement of rib structure is successfully predicted during the forming.