• 제목/요약/키워드: Bonding structure

검색결과 975건 처리시간 0.029초

최소 공정온도하에서 Mg-Ni의 열확산 접합에 관한 연구 (A Study on the Diffusion Bonding of Mg-Ni under Low Eutectic Temperature)

  • 진영준
    • 한국안전학회지
    • /
    • 제32권1호
    • /
    • pp.9-14
    • /
    • 2017
  • Diffusion bonding is a technique that has the ability to join materials with minimum change in joint micro-structure and deformation of the component. The quality of the joints produced was examined by metallurgical characterization and the joint micro-structure developed across the diffusion bonding was related to changes in mechanical properties as a function of the bonding time. An increase in bonding time also resulted in an increase in the micro-hardness of the joint interface from 55 VHN to 180 VHN, The increase in hardness was attributed to the formation of intermetallic compounds which increased in concentration as bonding time increased.

Electrothermal Analysis for Super-Junction TMOSFET with Temperature Sensor

  • Lho, Young Hwan;Yang, Yil-Suk
    • ETRI Journal
    • /
    • 제37권5호
    • /
    • pp.951-960
    • /
    • 2015
  • For a conventional power metal-oxide-semiconductor field-effect transistor (MOSFET), there is a trade-off between specific on-state resistance and breakdown voltage. To overcome this trade-off, a super-junction trench MOSFET (TMOSFET) structure is suggested; within this structure, the ability to sense the temperature distribution of the TMOSFET is very important since heat is generated in the junction area, thus affecting its reliability. Generally, there are two types of temperature-sensing structures-diode and resistive. In this paper, a diode-type temperature-sensing structure for a TMOSFET is designed for a brushless direct current motor with on-resistance of $96m{\Omega}{\cdot}mm^2$. The temperature distribution for an ultra-low on-resistance power MOSFET has been analyzed for various bonding schemes. The multi-bonding and stripe bonding cases show a maximum temperature that is lower than that for the single-bonding case. It is shown that the metal resistance at the source area is non-negligible and should therefore be considered depending on the application for current driving capability.

ECR-PECVD 방법으로 제조한 a-C:H 박막의 결합구조 (Atomic bonding structure in the a-C:H thin films prepared by ECR-PECVD)

  • 손영호;정우철;정재인;박노길;김인수;배인호
    • 한국진공학회지
    • /
    • 제9권4호
    • /
    • pp.382-388
    • /
    • 2000
  • ECR-PECVD 방법을 이용하여 ECR power, $CH_4/H2$ 가스 혼합비와 유량, 증착시간, negative DC self bias 전압 등을 변화 시켜가면서 수소가 함유된 비정질 탄소 박막을 제조하고, 증착조건에 따른 박막의 결합구조 변화를 FTIR로 분석하였다. a-C:H 박막에 대한 FTIR 스팩트럼의 흡수 peak들은 2800~3000 $\textrm{cm}^{-1}$ 영역에서 관측되었으며, 대부분 $sp^3$ 결합을 하고있고 일부 $sp^2$ 결합구조가 존재함을 알 수 있었다. $CH_4/H_2$ 가스 혼합비와 유량의 미소 변화는 a-C:H 박막의 탄소와 수소의 결합구조에 큰 영향을 미치지 않았으며, 증착 시간이 증가할수록 탄소와 수소 원자들의 결합구조가 $CH_3$ 구조로부터 $CH_2$ 나 CH 구조로 변하고 있음을 확인하였다. 또한, bias 전압을 증가시킬수록 플라즈마에 의한 이온충돌 현상이 두드러져 탄소와 결합하고 있던 수소원자들이 떨어져 나가는 탈수소화 현상도 확인할 수 있었으며, 증착조건에 따른 a-C:H 박막의 결합구조 분석을 토대로 산업에 응용할 수 있는 높은 경도와 밀착성을 갖는 박막을 ECR-PECVD 방법으로 제조할 수 있음을 확인하였다.

  • PDF

State detection of explosive welding structure by dual-tree complex wavelet transform based permutation entropy

  • Si, Yue;Zhang, ZhouSuo;Cheng, Wei;Yuan, FeiChen
    • Steel and Composite Structures
    • /
    • 제19권3호
    • /
    • pp.569-583
    • /
    • 2015
  • Recent years, explosive welding structures have been widely used in many engineering fields. The bonding state detection of explosive welding structures is significant to prevent unscheduled failures and even catastrophic accidents. However, this task still faces challenges due to the complexity of the bonding interface. In this paper, a new method called dual-tree complex wavelet transform based permutation entropy (DTCWT-PE) is proposed to detect bonding state of such structures. Benefiting from the complex analytical wavelet function, the dual-tree complex wavelet transform (DTCWT) has better shift invariance and reduced spectral aliasing compared with the traditional wavelet transform. All those characters are good for characterizing the vibration response signals. Furthermore, as a statistical measure, permutation entropy (PE) quantifies the complexity of non-stationary signals through phase space reconstruction, and thus it can be used as a viable tool to detect the change of bonding state. In order to more accurate identification and detection of bonding state, PE values derived from DTCWT coefficients are proposed to extract the state information from the vibration response signal of explosive welding structure, and then the extracted PE values serve as input vectors of support vector machine (SVM) to identify the bonding state of the structure. The experiments on bonding state detection of explosive welding pipes are presented to illustrate the feasibility and effectiveness of the proposed method.

Influence of loose bonding, initial stress and reinforcement on Love-type wave propagating in a functionally graded piezoelectric composite structure

  • Singh, Abhishek K.;Parween, Zeenat;Chaki, Mriganka S.;Mahto, Shruti
    • Smart Structures and Systems
    • /
    • 제22권3호
    • /
    • pp.341-358
    • /
    • 2018
  • This present study investigates Love-type wave propagation in composite structure consists of a loosely bonded functionally graded piezoelectric material (FGPM) stratum lying over a functionally graded initially-stressed fibre-reinforced material (FGIFM) substrate. The closed-form expressions of the dispersion relation have been obtained analytically for both the cases of electrically open and electrically short conditions. Some special cases of the problem have also been studied and the obtained results are found in well-agreement with the classical Love wave equation. The emphatic influence of wave number, bonding parameter associated with bonding of stratum with substrate of the composite structure, piezoelectric coefficient as well as dielectric constant of the piezoelectric stratum, horizontal initial stresses, and functional gradedness of the composite structure on the phase velocity of Love-type wave has been reported and illustrated through numerical computation along with graphical demonstration in both the cases of electrically open and electrically short condition for the reinforced and reinforced-free composite structure. Comparative study has been carried out to analyze the distinct cases associated with functional gradedness of the composite structure and also various cases which reveals the influence of piezoelectricity, reinforcement and horizontal initial stress acting in the composite structure, and bonding of the stratum and substrate of the composite structure in context of the present problem which serves as one of the major highlights of the study.

Ti-3Al-2.5V 튜브의 초소성 하이드로포밍과 확산접합으로 제조된 T형 구조물의 접합 특성 분석 (Analysis of Bonding Characteristics of a T-shape Structure Fabricated by Superplastic Hydroforming and Diffusion Bonding using two Ti-3Al-2.5V tubes)

  • 유영훈;이상용
    • 열처리공학회지
    • /
    • 제31권2호
    • /
    • pp.49-55
    • /
    • 2018
  • A T-shape structure was manufactured by the superplastic forming and diffusion bonding process using two Ti-3Al-2.5V alloy tubes. A Ti-3Al-2.5V tube was prepared for the hydroforming in the superplastic condition until it reaches a surface area such as a roof welded in the hole of another Ti-3Al-2.5V tube. Afterward, the superplastic forming process and the diffusion bonding process were carried out simultaneously until the appropriate bonding along the interface area of two Ti-3Al-2.5V tubes was obtained. The bonding qualities were different at each location of the entire interface according to the applied process conditions such as strain, pressure, temperature, holding time, geometries, etc. The microstructures of bonding interface have been observed to understand the characteristics of the applied processes in this study.

A Strong Dependence of the P-P Bond Length on the Transition Metal Component in ThCr2Si2-Type Phosphides CaM2P2 (M = Fe, Ni): The Influence of d Band Position and σp* Mixing

  • Kang, Dae-Bok
    • Bulletin of the Korean Chemical Society
    • /
    • 제24권8호
    • /
    • pp.1215-1218
    • /
    • 2003
  • An analysis of the bonding situation in CaM₂P₂ (M=Fe, Ni) with ThCr₂Si₂ structure is made in terms of DOS and COOP plots. The main contributions to covalent bonding are due to M-P and P-P interactions in both compounds. Particularly, the interlayer P-P bonding by variation in the transition metal is examined in more detail. It turns out that the shorter P-P bonds in CaNi₂P₂ form as a result of the decreasing electron delocalization into ${{\sigma}_p}^*$ of P₂ due to the weaker bonding interaction between the metal d and ${{\sigma}_p}^*$ as the metal d band is falling from Fe to Ni.

Novel Brazing법에 의한 Al의 공정접합에 관한 연구 (A Study of Eutectic Bonding for Aluminium using Novel Brazing Process)

  • 정병호;김무길;이성열
    • Journal of Advanced Marine Engineering and Technology
    • /
    • 제24권1호
    • /
    • pp.59-66
    • /
    • 2000
  • To investigate the optimum brazing condition, variation of bonded structure and mechanical properties of novel brazed pure Al with bonding condition (brazing temperature, time and Si/flux ratio) was studied. A basic study of the bonding mechanism was also examined. The optimum brazing condition was obtained at $590^{\circ}$ for 2 minutes and the bonded structure showed that it is composed of almost entirely eutectic Al-Si with near eutectic composition. At higher brazing temperature $630^{\circ}$, hypoeutectic Al-Si structure was observed in the bonded area and resulted in erosion of base metal. The thickness of eutectic layer formed in optimum brazing temperature increased linearly with the square root of time, showing a general diffusion controlled process. The ultimate tensile strength of bonded joint brazed at an optimum brazing condition was about 60% of base metal and its fracture surface showed a brittle mode.

  • PDF

RE-PECVD법에 의해 증착된 DLC박막의 결합 특성 (Bonding structure of the DLC films deposited by RE-PECVD)

  • 최봉근;신재혁;안종일;심광보
    • 한국결정성장학회지
    • /
    • 제14권1호
    • /
    • pp.27-32
    • /
    • 2004
  • RF-PECVD 방법을 이용하여 DLC(diamond-like carbon)박막을 메탄-수소 가스 혼합비 및 바이어스 전압에 따라 실리콘 웨이퍼 위에 증착하였다. DLC 박막의 결합구조적 특성 및 기계적 성질은 FT-IR, Raman, 그리고 nano-indenter를 이용하여 평가하였다. 혼합가스내 메탄의 유량과 바이어스 전압이 증가함에 따라 증착속도가 증가하였다. 박막내 탄소의 $sp^3/sp^2$ 결합비와 경도는 반응가스내 수소의 유량 및 바이어스 전압이 증가함에 따라 증가하였다.

Comparison of Coverage-Dependent Adsorption Structures of Alanine and Leucine on Ge(100): Bonding Configuration and Adsorption Stability

  • 박영찬;양세나;김정원;이한길
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
    • /
    • pp.215-215
    • /
    • 2011
  • The bonding configuration and adsorption stability of alanine and leucine adsorbed on Ge(100)-2${\times}$1 surface were investigated and compared using core-level photoemission spectroscopy (CLPES) and density functional theory (DFT) calculations. The bonding configuration, stability, and adsorption energies were evaluated for two different coverage levels. In both cases, the C 1s, N 1s, and O 1s core-level spectra at a low coverage (0.30 ML) indicated that the carboxyl and amine groups participated in bonding with the Ge(100) surface in an "O-H dissociated-N dative bonded structure". At high coverage levels (0.60 ML), both this structure and an "O-H dissociation bonded structure" were present. As a result, we found that alanine adsorbs more easily (lower adsorption energy) than leucine on Ge(100) surfaces due to less steric hindrance of side chain.

  • PDF