• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.4
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• pp.395-403
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• 2012

This is direct bonding many of the metal bumps between FPCB and HPCB substrate. By using an ultrasonic horn mounted on an ultrasonic bonding machine, it is possible to bond gold pads onto the FPCB and HPCB at room temperature without an adhesive like ACA or NCA and high heat and solder. This ultrasonic bonding technology minimizes damage to the material. The process conditions evaluated for obtaining a greater bonding strength than 0.6 kgf, which is commercially required, were 40 kHz of frequency; 0.6MPa of bonding pressure; and 0.5, 1.0, 1.5, and 2.0 s of bonding time. The peel off test was performed for evaluating bonding strength, which was found to be more than 0.80 kgf.

• Journal of Sensor Science and Technology
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• v.14 no.4
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• pp.237-243
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• 2005

Strain gauge type load cell is used widely as weight sensor. However, it has problems such as noise, power consumption, high cost and big size. Semiconductor type piezoresistive pressure sensor is practically used in recent for low hysteresis, good linearity, small size, light weight and strong on vibration. In this paper, we have fabricated the piezoresistive pressure sensor and packaged the miniature weight sensor. We packaged the miniature weight sensor by flip-chip bonding between die and PCB for durability, because the weight sensor is directly contacted on a physical solid distinct from air and oil pressure. We measured the characteristics of the weight sensor, which had the output of $10{\sim}80$ mV on the weight range of $0{\sim}2$ kg. In the result, we could fabricate the weight sensor with an accuracy of 3 %FSO linearity.

• Journal of Sensor Science and Technology
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• v.26 no.1
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• pp.24-27
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• 2017

In this study, I developed a simple and low cost process-printing a silver, carbon, dielectric, adhesive layer on PET films using screen printing technology and bonding the two films face-to-face-to fabricate a low price capacitive pressure-mapping sensor. Both electrodes forming the pressure measuring capacitor are arranged between the two PET films similar to a sandwich. Therefore, the sensor has the advantage of minimizing the influence of external noise. In this study, a $10{\times}10$ capacitance-type pressure-mapping sensor was fabricated and its characteristics were analyzed.

• Current Photovoltaic Research
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• v.3 no.1
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• pp.1-4
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• 2015

In this study, we analyzed the correlation between mechanical and electrical properties of low-temperature conductive film (LT-CF) bonded silicon solar cells by a quadrant analysis (horizontal axis (peeling strength), vertical axis (power loss)). We found that a series of points with various bonding parameters such as bonding temperature, pressure and time were distributed in the different three regimes; weak regime (Q2: weak bonding strength and high power loss), moderate regime (Q4 : strong bonding strength and low power loss) and hard regime (Q3 : weak bonding strength and low power loss). Using this analogous technique, it was possible to fabricate the LT-CF bonded silicon solar cells with the various conditions displayed in Q3 of the quadrant plots, possessing the peeling strength of ~ 1N/mm and power loss of 2~3%.

• Journal of Sensor Science and Technology
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• v.9 no.2
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• pp.134-140
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• 2000

Si wafer direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electronic devices and MEMS applications. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration and applied pressure. The bonding strength was evaluated by tensile strength method. A bond characteristic on the interface was analyzed by using FT-IR, and surface roughness according to HF concentration was analyzed by AFM. Si-F bonds on Si surface after HF pre-treatment are replaced by Si-OH during a DI water rinse. Consequently, hydrophobic wafer was bonded by hydrogen bonding of Si-OH$\cdots$(HOH$\cdots$HOH$\cdots$HOH)$\cdots$OH-Si. The pre-bonding strength depends on the HF pre-treatment condition before pre-bonding. (Min : $2.4kgf/cm^2{\sim}$Max : $14.9kgf/cm^2$)

• Journal of Dental Rehabilitation and Applied Science
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• v.30 no.2
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• pp.102-111
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• 2014

Purpose: Surface damage and bonding strength difference after micromechanical treatment of zirconia surface are to be studied yet. The aim of this study was to evaluate the difference of fracture resistance and bonding strength between more surface-damaged group from higher air-blasting particle size and pressure, and less damaged group. Materials and Methods: Disk shape zirconia ($LAVA^{TM}$) was sintered and air-blasted with $30{\mu}m$ particle size (Cojet), under 2.8 bar for 15 seconds, $110{\mu}m$ particle size (Rocatec), under 2.8 bar for 15 seconds, and $110{\mu}m$ particle size (Rocatec), under 3.8 bar for 30 seconds respectively. Biaxial flexure test and bonding failure load test were performed serially (n = 10 per group). For bonding test, specimens were bonded on the base material having similar modulus of elasticity of dentin with $200{\mu}m$-thick resin cement for tension of surface damage. Failure load of bonding was detected with acoustic emission (AE) sensor. Results: There were no significant differences both in the biaxial flexure test and bonding failure load test between groups (P > 0.05). Sub-surface cracks were all radial cracks except for two specimens. Conclusion: Within the limitations of no aging under monotonic load test, surface damage from higher air-blasting particle size and pressure was not significant. Evaluations of failure load with bonded zirconia disks was clinically relevant modality for surface damage and bonding strength, simultaneously.

• Korean Journal of Materials Research
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• v.22 no.4
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• pp.211-214
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• 2012

Optimal conditions for HA plasma spray-coating on Ti6Al4V alloy were investigated in order to obtain enhanced bone-bonding ability with Ti6Al4V alloy. The properties of plasma spray coated film were analyzed by SEM, XRD, surface roughness measurement, and adhesion strength test because the film's transformed phase and crystallinity were known to be influential to bone-bonding ability withTi6Al4V alloy. The films were formed by a plasma spray coating technique with various combinations of plasma power, spray distance, and auxiliary He gas pressure. The film properties were analyzed in order to determine the optimal spray coating parameters with which we will able to achieve enhanced bone-bonding ability with Ti6Al4V alloy. The most influential coating parameter was found to be the plasma spray distance to the specimen from the spray gun nozzle. Additionally, it was observed that a relatively higher film crystallinity can be obtained with lower auxiliary gas pressure. Moderate adhesion strength can be achievable at minimal plasma power. That is, adhesion strength is minimally dependent on the plasma power. The combination of shorter spray distance, lower auxiliary gas pressure, and moderate spray power can be recommended as the optimal spray conditions. In this study, optimal plasma spray coated films were formed with spray distance of 70 mm, plasma current of 800 A, and auxiliary gas pressure of 60 psi.

• Journal of Sensor Science and Technology
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• v.3 no.3
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• pp.45-53
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• 1994

A new type of Si diaphragm was fabricated using Si-wafer direct bonding and two-step electrochemical etch-stopping methods. Using the new diaphragm structure in mechanical sensors, more precise control of cavity depth and diaphragm thickness was achievable. Also, the propagation of the stress, which was generated near the bonding interface, to the surface can be avoided. Finally, a piezoresistive-type Si pressure sensor was fabricated utilizing the diaphragm and a digital pressure gauge, which can display units of pressure, was realized.

• Composites Research
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• v.23 no.6
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• pp.32-38
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• 2010

The effect of the atmospheric pressure plasma(APP) treatments is experimentally investigated to ascertain the optimum condition to yield the best adhesive properties between a polyamide woven fabric and acrylonitrile butadiene rubber(NBR). For the atmospheric pressure flame plasma(APFP) treatment, the optimum number of treatment at given conditions is 2 times. The thermal deformation of the fabric is more serious with increasing the number of APFP treatment. The adhesive strength of the case with APFP treated fabric is increased about 35% when compare to the case with non-APFP treated one for the interface(bonding agent one or two coatings). When the surface is coated twice with the bonding agent, the adhesive energy with APFP treated fabric is increased about 4 times. It was found that the surface modification of polyamide woven fabric by APFP treatment is a fast, economic and applicable method to improve the adhesive properties between woven fabric and rubber when compared to other APP treatments.

• Progress in Superconductivity and Cryogenics
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• v.1 no.2
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• pp.1-7
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• 1999

we evaluated the effects of joining process such as contact method. shape of joined area and pressure on the electrical and mechanical properties of Bi-2223 superconducting tape, Specifically. the current capacity of the jointed tape was measured as a function of uniaxial pressure. and the thermal shock, bonding strength and the thermal of the tape were evaluated and correlated to the microstructural evolution. It was observed that the current capacity was significanrly dependent on the uniaxial pressure The jointed tape, fabricated with a pressure of 1,000-1,600 Mpa. showed the highest value of current capacity results from improvements in core density, contacting area and grain alignment, ect. In addition, the strength of jointed tape was measured to be 86 Mpa, which is about 88% of the unjoined ape's strength. The irreversible strain($\varepsilon$irrev) for the jointed tape was measured to be 0.1%, smaller than that of unjoined tape ($\varepsilon$irrev= 0.3%). The decrease in the strength and irreversible strain for jointed tape is believed to be due to the irregular geometry/morphology of the transition area of the tape.