• Korean Journal of Materials Research
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• v.26 no.7
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• pp.388-392
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• 2016

A cold roll-bonding process was applied to fabricate an AA1050/AA6061/AA1050 laminate complex sheet. Two AA1050 and one AA6061 sheets of 2 mm thickness, 40 mm width and 300 mm length were stacked up after surface treatment that included degreasing and wire brushing; material was then reduced to a thickness of 3 mm by one-pass cold rolling. The laminate sheet bonded by the rolling was further reduced to 1.2 mm in thickness by conventional rolling. The rolling was performed at ambient temperature without lubricant using a 2-high mill with a roll diameter of 210 mm. The rolling speed was 5.0 m/sec. The AA1050/AA6061/AA1050 laminate complex sheet fabricated by roll bonding was then hardened by natural aging T4) and artificial aging (T6) treatments. The microstructures of the as-roll bonded and the age hardened Al complex sheets were revealed by optical microscope observation; the mechanical properties were investigated by tensile testing and hardness testing. The strength of the as-roll bonded complex sheet was found to increase by 2.9 times compared to that value of the starting material. In addition, the hardness of the complex sheets increased with cold rolling for AA1050 and age-hardening treatment for AA6061, respectively. After heat treatment, both AA1050 and AA6061 showed typical recrystallization structures in which the grains were equiaxed; however, the grain size was smaller in AA6061 than in AA1050.

• Korean Journal of Materials Research
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• v.26 no.3
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• pp.154-159
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• 2016

A roll-bonding process was applied to fabricate an AA1050/AZ91/AA1050 laminate complex sheet. Two AA1050 and one AZ91 magnesium sheets of 2 mm thickness, 30 mm width and 200 mm length were stacked up after surface treatment that included degreasing and wire brushing; material was then reduced to a thickness of 3 mm by one-pass cold rolling. The laminate sheet bonded by the rolling was further reduced to 2 mm in thickness by conventional rolling. The rolling was performed at 623K without lubricant using a 2-high mill with a roll diameter of 210 mm. The rolling speed was 15.9 m/min. The AA1050/AZ91/AA1050 laminate complex sheet fabricated by roll bonding was then annealed at 373~573K for 0.5h. The microstructure of the complex sheets was revealed by electron back scatter diffraction (EBSD) measurement; the mechanical properties were investigated by tensile testing and hardness testing. The strength of the complex sheet was found to increase by 11 % and the tensile elongation decreased by 7%, compared to those values of the starting material. In addition, the hardness of the AZ91 Mg region was slightly higher than those of the AA1050 regions. Both AA1050 and AZ91 showed a typical deformation structure in which the grains were elongated in the rolling direction; however, the mis-orientation distribution of grain boundaries varied greatly between the two materials.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.183-184
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• 2007

A 40 Gb/s transimpedance amplifier IC was designed and fabricated with a InP/InGaAs HBTs technology. In this study, we interconnect 40Gbps trans impedance amplifier IC to a duroid substrate by a flip chip bonding instead of conventional wire bonding for interconnection. For flip chip bonding, we developed fine pitch bump with the $70{\mu}m$ diameter and $150{\mu}m$ pitch using WLP process. To study the effect of WLP, electrical performance was measured and analyzed in wafer and package module using WLP. The Small signal gains in wafer and package module were 7.24 dB and 6.93dB respectively. The difference of small signal gain in wafer and package module was 0.3dB. This small difference of gain is due to the short interconnection length by bump. The characteristics of return loss was under -10dB in both wafer and module. So, WLP process can be used for millimeter wave GaAs MMIC with the fine pitch pad and duroid substrate can be used in flip chip bonding process.

• Journal of the Korea Institute of Building Construction
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• v.19 no.3
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• pp.201-207
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• 2019

In this study, the direct tensile properties of amorphous metallic fiber-reinforced cement based composites according to the strain was evaluated. A thin plate-shape amorphous metallic fiber with 15mm and 30mm in length was used. And fiber-reinforced cement based composites were prepared with contents of 1.0, 1.5, 2.0%. The direct tensile test was conducted under the conditions of $10^{-6}/s(static)$ and $10^1/s(dynamic)$ strain rate. As a results, amorphous metallic fiber with a length of 15mm was observed in pull-out behavior from the cement matrix because of the short fiber length and large portion of mixed fiber. On the other hand, amorphous metallic fiber with a length of 30mm were not pulled out from matrix because the bonding force between the fiber and matrix was large due to rough surface and large specific surface area. However, fracture occurred because thin plate shape fibers were vulnerable to shear force. Tensile strength, strain capacity and toughness were improved due to the increase in the fiber length. The dynamic increase factor of L15 was larger that of L30 because the bonding performance of the fiber-matrix interface is significantly affected by the strain rate.

• Journal of the korean academy of Pediatric Dentistry
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• v.26 no.4
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• pp.595-607
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• 1999

The purpose of this in vitro study was to evaluate the efficacy of self-etching primer which was developed to simplify the bonding procedures by measuring the shear bond strength and observing the interfacial morphology. 90 flat dentinal surfaces were prepared by grinding the buccal and lingual areas of caries-free human deciduous molars. After bonding of composite resin to sample surfaces according to the manufacturer's direction and thermocycling, shear bond strengths were measured using Universal testing machine(Instron). Another groups of specimens were treated by hydrochloric acid to secure the resin only and those tags were evaluated under SEM for their length and forms and the morphology of the bonding sites were also observed. The result as follows. 1. Group III showed higher shear bond strength than group I and II but no statistically significant difference was founded between group I and II(p>.05). 2. Adhesive failure was predominant in group II whereas dentin detachment was the main failure pattern in group I and III. 3. Relating long resin tags of $100-200{\mu}m$ were observed in samples of all groups under SEM. In group I, homogeneously long resin tags were arranged rather tight whereas rather loosely arranged resin tags of various length were found in group II. Lateral branching of resin tags was the characteristic finding observed in group III.

• Proceedings of the Korea Concrete Institute Conference
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• 2005.05a
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• pp.331-334
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• 2005

The nature of bond of untensioned prestressed strand in concrete differs from that of plain or deformed reinforcing bar as well as tensioned prestressed strand. There is a very limited amount of published research information regarding bonding of this type reinforcing. In order to use and design untensioned strand as reinforcing, relationships defining the load transfer characteristics of the strand are necessary. A program based upon pullout tests was designed to develop data relating the critical parameters for determining load transfer behavior of the untensioned strand. The purpose of this study is to investigate the characteristics of bond and development length between untensioned strand and concrete. The test variables include diameter of strands (9.3mm, 12.7mm) and development lengths. The maximum bond stress at the 9.3mm and 12.7mm strands decreases with the increase of the rate of development length. The untensioned prestressed strands displayed bond performance when secure development length more than 80$\%$ according to the development of deformed bars equation.

• Proceedings of the Korean Vacuum Society Conference
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• 2009.08a
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• pp.336-336
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• 2009

• Bulletin of the Korean Chemical Society
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• v.34 no.3
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• pp.892-898
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• 2013

A field emission projection microscope was constructed to investigate the atomic and chemical-bonding structure of molecules using electron in-line holography. Fringes of carbon nanotube images were found to be interferograms equivalent to those created by the electron biprism in conventional electron microscopy. By exploiting carbon nanotubes as the filament of the electron biprism, we measured the transverse coherence length of the electron beam from tungsten field emitters. The measurements revealed that a partially coherent electron-beam was emitted from a finite area.

• Design & Manufacturing
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• v.13 no.4
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• The Journal of Engineering Geology
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• v.17 no.1 s.50
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• pp.65-73
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• 2007

Recently, large-scale underground cavern such as underground hydraulic-power plant tend to be constructed very largely, so long-length rock bolt are generally used to support the huge plastic zone. However, problems fur bend-ing shape of the long-length steel bar and the bonding effects of anchoring systems are caused during the construction of the long-length rock bolt. In this study, field pull-out test for long-length rock bolt are carried out to estimate the most efficient anchoring system among the saw-toothed shape, grooved shape and smoothed shape with each 6 shells for 5.0m, 7.5m, 10.0m, 15.0m length. The axial load and axial displacement are measured with each load stage and than test results are analyzed to evaluate the behavior characteristics for each anchoring systems of long-length rock bolt. Also, the improvements of anchoring systems are proposed and discussed in this paper.