• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.51-57
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• 2019

To protect the Cu surface from oxidation in air, a two-step plasma process using Ar and $N_2$ gases was studied to form a copper nitride passivation as an anti-oxidant layer. The Ar plasma removes contaminants on the Cu surface and it activates the surface to facilitate the reaction of copper and nitrogen atoms in the next $N_2$ plasma process. This study investigated the effect of Ar plasma on the formation of copper nitride passivation on Cu surface during the two-step plasma process through the full factorial design of experiment (DOE) method. According to XPS analysis, when using low RF power and pressure in the Ar plasma process, the peak area of copper oxides decreased while the peak area of copper nitrides increased. The main effect of copper nitride formation in Ar plasma process was RF power, and there was little interaction between plasma process parameters.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.6
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• pp.100-107
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• 2021

As a significant technology in the smartization era promoted by the Fourth Industrial Revolution, the secondary battery industry has recently attracted significant attention. The demand for lithium-ion batteries (LIBs), which exhibit excellent performance, is considerably increasing in different industrial fields. During the manufacturing process of LIBs, it is necessary to join the cathode and anode sheets with thicknesses of several tens of micrometers to lead taps of the cathode and anode with thicknesses of several hundreds of micrometers. Ultrasonic welding exhibits excellent bonding when bonded with very thin plates, such as negative and positive electrodes of LIBs, and dissimilar and highly conductive materials. In addition, ultrasonic welding has a small heat-affected zone. In LIBs, Cu is mainly used as the negative electrode sheet, whereas Cu or Ni is used as the negative electrode tab. In this study, one or two electrode sheets (t0.025 mm Cu) were welded to one lead tab (t0.1 mm Cu). The welding energy and pressure were used as welding parameters to determine the welding strength of the interface between two or three welded materials. Finally, the effects of these welding parameters on the welding strength were investigated.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.73-79
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• 2022

In this study, a reaction study between Ga, which has recently been spotlighted as a low-temperature bonding material, and Cu, a representative electrode material, was conducted to investigate information necessary for low-temperature soldering applications. Interfacial reaction and intermetallic compound (IMC) growth were observed and analyzed by reacting Ga and Cu/Au substrates in the temperature range of 80-200℃. The main IMC growing at the reaction interface was CuGa₂ phase, and AuGa₂ IMC with small particle sizes was formed on the upper part and Cu₉Ga₄ IMC with a thin band shape on the lower part of the CuGa₂ layer. CuGa₂ particles showed a scallop shape, and the particle size increased without significant shape change as the reaction time increased, similar to the case of Cu₆Sn₅ growth. As a result of analyzing the CuGa₂ growth mechanism, the time exponent was calculated to be ~3.0 in the temperature range of 120-200℃, and the activation energy was measured to be 17.7 kJ/mol.

• Journal of the Korean Wood Science and Technology
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• v.50 no.2
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• pp.134-147
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• 2022

The objective of this study is to determine the effect of fiber direction arrangement and layer composition of hybrid bamboo laminate boards on the physical and mechanical properties. The raw material used was tali bamboo (Gigantochloa apus (J.A. & J.H. Schultes) Kurs) rope in the form of flat sheets (zephyr) and falcata veneer (Paraserianthes falcataria (L) Nielsen). Zephyr bamboo was arranged in three layers using water-based isocyanate polymer (WBPI) with a glue spread rate of 300 g/m². There were variations in the substitution of the core layer with falcata veneers (hybrid) as much as two layers and using a glue spread rate of 170 g/m². The laminated bamboo board was cold-pressed at a pressure of 22.2 kgf/cm² for 1 h, and the physical and mechanical properties were evaluated. The results showed that the arrangement of the fiber direction significantly affected the dimensional stability, modulus of rupture, modulus of elasticity, shear strength, and screw withdrawal strength. However, the composition of the layers had no significant effect on the physical and mechanical properties. The bonding quality of bamboo laminate boards with WBPI was considered to be quite good, as shown by the absence of delamination in all test samples. The bamboo hybrid laminate board can be an alternative based on the physical and mechanical properties that can meet laminated board standards.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.1-10
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• 2023

Recently, as the demand for high-performance computers and mobile products increases, semiconductor packages are becoming high-integration and high-density. Therefore, in order to transmit a large amount of data at once, micro bumps such as flip-chip and Cu pillar that can reduce bump size and pitch and increase I/O density are used. However, when the size of the bumps is smaller than 70 ㎛, the brittleness increases and electrical properties decrease due to the rapid increase of the IMC volume fraction in the solder joint, which deteriorates the reliability of the solder joint. Therefore, in order to improve these issues, a layer that serves to prevent diffusion is inserted between the UBM (Under Bump Metallization) or pillar and the solder cap. In this review paper, various studies to improve bonding properties by suppressing excessive IMC growth of micro-bumps through additional layer insertion were compared and analyzed.

• Current Photovoltaic Research
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• v.12 no.2
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• pp.37-40
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• 2024

One of the current innovation trends in the solar industry is the increase in the size of silicon wafers. As the wafer size increases, the series resistance of the module rises, highlighting the need for research on methods for cutting and bonding solar cells. Among these, the Infrared (IR) laser scribing technique has been extensively researched. However, there is still insufficient optimization research regarding the thermal damage caused by lasers on the Transparent Conductive Oxide (TCO) layer of Heterojunction (HJT) solar cells. Therefore, in this study, we systematically varied conditions such as IR laser scribing speed, frequency, power, and the number of scribes to investigate their impact on the performance of cut cells under each condition. Additionally, we conducted a comparative analysis of thermal damage effects on the TCO layer based on varying scribing depths.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.1
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• pp.17-22
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• 2016

Flexible organic light-emitting diode (OLED) devices consist of multi-stacked thin films or layers comprising organic and inorganic materials. Due to thermal coefficient mismatch of the multi-layer films, warpage of the flexible OLED is generated during high temperature process of each layer. This warpage will create the critical issues for next production process, consequently lowering the production yield and reliability of the flexible OLED. In this study, we investigate the warpage behavior of the flexible OLED for each bonding process step of the multi-layer films using the experimental and numerical analysis. It is found that the polarizer film and barrier film show significant impact on warpage of flexible OLED, while the impact of the OCA film on warpage is negligible. The material that has the most dominant impact on the warpage is a plastic cover. In order to minimize the warpage of the flexible OLED, we estimate the optimal material properties of the plastic cover using design of experiment. It is found that the warpage of the flexible OLED is reduced to less than 1 mm using a cover plastic of optimized properties which are the elastic modulus of 4.2 GPa and thermal expansion coefficient of $20ppm/^{\circ}C$.

• Journal of the Korean Vacuum Society
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• v.20 no.1
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• pp.22-29
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• 2011

An infrared thermographic imaging module of [$320{\times}256$] focal-plane array (FPA) based on [InAs/GaSb] strained-layer superlattice (SLS) was fabricated, and its images were demonstrated. The p-i-n device consisted of an active layer (i) of 300-period [13/7]-ML [InAs/GaSb]-SLS and a pair of p/n-electrodes of (60/115)-period [InAs:(Be/Si)/GaSb]-SLS. FTIR photoresponse spectra taken from a test device revealed that the peak wavelength (${\lambda}_p$) and the cutoff wavelength (${\lambda}_{co}$) were approximately $3.1/2.7{\mu}m$ and $3.8{\mu}m$, respectively, and it was confirmed that the device was operated up to a temperature of 180 K. The $30/24-{\mu}m$ design rule was applied to single pixel pitch/mesa, and a standard photolithography was introduced for [$320{\times}256$]-FPA fabrication. An FPA-ROIC thermographic module was accomplished by using a $18/10-{\mu}m$ In-bump/UBM process and a flip-chip bonding technique, and the thermographic image was demonstrated by utilizing a mid-infrared camera and an image processor.

• Restorative Dentistry and Endodontics
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• v.32 no.5
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• pp.445-458
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• 2007

The purpose of this study was to evaluate the bond strength of a new Single step system with different curing mode composites, and to evaluate the effect of the intermediate resins which have different hydrophilicity on bonding ability by means of the micro shear bond testing and TEM examination for the adhesive interface. The adhesive used in this study was an experimental single step system (Bisco Inc., Schaumburg IL). Experimental groups were produced by using six kinds of intermediate resin having different hydrophilicity that was hydrophilic, hydrophobic and most hydrophobic resin and as filled or not after applying adhesive. Each experimental group was further divided into two subgroups whether the adhesive was light cured or not. Dual cured composite (Bis Core, Bisco Ltd., Schaumburg, IL) was placed on the adhesive layer as light cure or self cure mode. The results or bond strength were statistically analyzed using one way ANOVA and multiple comparisons are made using Tukey's test at ${\alpha}\;<\;0.05$ level. The results of this study were as follows ; 1. The application of intermediate resin did not increase the bond strength for light cured composite. 2. The bond strength of an experimental adhesive with self cured composite was significantly increased by the application of intermediate resin layer. 3. The bond strength of adhesive was irrespective of the cure or not of itself before intermediate resin layer applied. 4. As applied hydrophilic resin layer was, the initial bond strength was higher than both hydrophobic and most hydrophobic one used but there was no significance. Using a single step adhesive with dual/self cured composite, the incompatibility between both of them should be solved by the application of intermediate hydrophobic resin to reduce the adhesive permeability. However, Single step adhesive can be used in the light cured composite restoration without any decrease of the initial bond strength.

• International Journal of Highway Engineering
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• v.9 no.2 s.32
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• pp.129-140
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• 2007

A major purpose of this study is to develop a drainage system that can quickly drain water penetrated into pavement layers to mitigate pot holes which is one of the major distress types in bridge deck pavements. This system can be established by applying a thin drainage layer between waterproof and pavement layers. The most important elements for this system are the performance of waterproof layer and construction technique for the thin drainage layer. The porous asphalt mix with the maximum aggregate size of 10mm is first developed based on the porous asphalt mix design guide proposed by NCAT, and various physical and mechanical tests are performed to confirm that the porous mix satisfies all the specification requirements. In addition, a series of laboratory tests including low-temperature bending and bonding strength tests for the MMA(Methyl Methacrylate) type of waterproofing material. It is observed from the tests that the MMA material satisfies all the specification requirements. To evaluate the Reld performance of the drainage system, a field study has been conducted on a relatively small size bridge. The QC/QA tests are conducted on the both waterproofing and pavement materials. It has been found that the drainage system works well to drain the water penetrated into the pavement layers.