• Journal of the korean academy of Pediatric Dentistry
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• v.25 no.2
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• pp.304-311
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• 1998

The purpose of this study was to evaluate the shear bond strength on dentin of bonding agents based on glass ionomer cements, and to establish the appropriate method of bonding which has biological safety and decrease the pulpal damage. Fuji Bond LC, Advance, All Bond 2 and Scotchbond Multipurpose were applicated on occlusal dentin layer in acrylic resin block. Each group was composed of 10 specimens and the shear bond strenth between dentin layer and composite resin was measured with the Universal Testing Machine and analyzed. The result were as follows: 1. When using ANOVA and Scheffe' s multiple range test, there were not statistical differences among the four group. (P < 0.05) 2. The shear bond strength was high in the order of C, D, A. B and bond strength of group B showed relatively lower. 3. In digital image processing, there were not significant differences on morphology of failure surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.262-263
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• 2005

For mechanical and electrical stability and environment protection, Cu and stainless steel stabilizer is laminated to Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. this architecture allows the wire to meet operational requirements including stresses at cryogenic temperature, winding tensions, mechanical bending requirements thermal and electrical stability under fault conditions. we have experimentally studied mechanical properties of laminated stainless steel stabilizer on YBCO coated conductors. we have laminated YBCO coated conductors by continuous dipping soldering process. we have investigated lamination interface between solder and stabilizer, YBCO coated conductor. we evaluated bonding properties tensile / shear bonding strength, peeling strength laminated YBCO coated conductors.

• Korean Journal of Materials Research
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• v.15 no.7
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• pp.444-447
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• 2005

In this study, $Hydroxyapatite+TiO_2(HAp+TiO_2)$ composite sol coatings on Cp-Ti substrates were deposited by using a sol-gel derived precursor. Prior to hydroxyapatite coating, the samples were micropolished and divided into three sets. The first set was coated with hydroxyapatite (HAp) directly on Cp-Ti. The second set was first coated with intermediate titania layer and then coated with HAp. The third set samples were coated with $HAp+TiO_2$ (50:50) composite sol. Each samples were predried at $200^{\circ}C$, and heat treated at $600^{\circ}C$. The formation of hydroxyapatite has been confirmed by XRD analyses and the substrate material was found to be oxidized with negligible amount of CaO in the coating. The NaOH treated samples showed the presence of rutile crystal. The SEM studies revealed surface morphologies of each samples. $HAp+TiO_2$ composite sol coating layer was found to be smooth. The bonding strength of each samples were calculated using pull out tests. The bonding strength of the $HAp+TiO_2$ composite sol coating on substrate was 29.35MPa.

• Progress in Superconductivity and Cryogenics
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• v.8 no.3
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• pp.23-26
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• 2006

For mechanical and electrical stability and environment protection. Cu and stainless steel stabilizers are laminated to a Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. This architecture allows the wire to meet operational requirements including stresses at cryogenic temperature. winding tensions as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. We have experimentally studied mechanical properties of the laminated stainless steel and Cu stabilizers on YBCO coated conductors. We have laminated YBCO coated conductors by continuous dipping soldering process. We have investigated lamination interface between solder and stabilizer of the YBCO coated conductor. We evaluated bonding properties. tensile / shear bonding strength. and peeling strength laminated YBCO coated conductors.

• Journal of dental hygiene science
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• v.9 no.4
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• pp.405-412
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• 2009

The purpose of this study investigated the effect of Au coating on adhesion between porcelain matrix and metal substructure interface. Titanium, Ni-Cr alloy and Co-Cr alloy are well known as proper metal for the dental restorations. The success of a porcelain fused to metal (PFM) restoration depends upon the quality of the porcelain-metal bond. However, adhesion between dental alloys and porcelain is related to diffusion of oxygen during ceramic firing. The excessive oxidized layers make hard adhesion between dental alloy and ceramic. Ni-Cr and Co-Cr specimens were divided into test and a control group and Titanium specimens were divided into three test groups and a control group. Each group had 20 specimens. The adhesion characteristics of porcelain and metal with Au coating layer and without Au coating layer were observed with scanning electron microscopy(SEM). The adhesion was evaluated by a biaxial flexure test and volume fraction of adherent porcelain was determined by SEM/EDS analysis. Result of this study suggest that Au coating layer is effective barrier to diffuse oxide layer completely protect non-precious alloys from oxidation during the porcelain firing. The SEM photomicrographs of cross-section specimens showed a smooth interface between Au coating layer and metals and porcelain which suggested proper chemical bonding, and no gap, porosity were observed. The mode of failure was mainly adhesive for Ti tested specimens, but mixed failures with adhesive and cohesive were observed in Ni-Cr and Co-Cr specimens. The adhesion between non-precious metals and porcelain would not be improved by Au coating agent. However, It is suggested that the continuous study is required further investigation and development.

• Restorative Dentistry and Endodontics
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• v.21 no.1
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• pp.227-241
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• 1996

The effect of collagen dissolution in acid conditioned dentin was morphologically examined by both scanning and transmission electron microscopy. 18 freshly extracted human molars and dentin bonding systems of All Bond 2, Scotchbond Multipurpose, Superbond D-Liner were used in this study. For SEM preparation, each 3 of ~ exposed dentin surfaces were acid conditioned by using various acids within the above three bonding systems respectively. After acid conditioning of the other 3 exposed dentin surfaces as above, they were treated with 1.7% NaOCl for 2 minutes. The remaining 3 dentin surfaces were acid conditioned and treated with 3.3 % NaOCl for 2 minutes. All of the specimens were then fixed in 4 % glutaraldehyde for 12 h at $4^{\circ}C$ and dehydrated in ethanols grades from 50 % to 100 %, then surface changes of the specimens were observed by using SEM. For TEM preparation, exposed dentin surfaces were acid conditioned with the same acid as SEM specimens and treated with 1.7%, 3.3 % NaOCl respectively, then applied with corresponding bonding agents. After the procedures were finished, composite resin were applied on the dentin surfaces and light cured. Small, rectangular sticks with end dimensions of approximately 1 by 1 mm were sectioned and further sample preparative techniques for transmission electron microscopy were performed in accordance with the procedures used for ultrastructural TEM observations of calcified tissues. The results were as follows : 1. In the 1.7 % NaOCl retreated specimens after acid conditioning, the porous dentin surface of intertubular dentin and wide opening of dentinal tubules were appeared. And there were fine irregularities on the intertubular dentin, indicating a clear difference as compared with the acid conditioned specimens. 2. In the 3.3% NaOCl retreated specimens after acid conditioning, the intertubular dentin was further eroded causing a more porous and wider opening of dentinal tubules. Moreover, sharp irregularities on the intertubular dentin were more evident than those of acid conditioned and 1.7% NaOCl retreated specimens. 3. In all of the acid conditioned specimens, the resin-dentin hybrid layer of approximately 3.5mm thickness was formed and the collapsed collagen layer was observed on the uppermost part of hybrid layer in the specimens applied with All Bond 2. The collgen fibrils of intertubular dentin in specimens applied with Scotchbond Multipurpose were running perpendicular to the interface, and electron dense black layer demarcated from the deep unaltered dentin was more evident in the specimen applied with Superbond D-Liner than any other specimens. 4. In the 1.7 % NaOCl retreated specimens after acid conditioning, the resin-dentin hybrid layer of approximately 2.5-3.0mm thickness was formed and the collapsed collagen layer and longitudinally running collagen fibrils as shown in the acid conditioned specimens were observed in the specimens applied with All Bond 2 and Superbond D-Liner. 5. In all of the 3.3% NaOCl retreated specimens after acid conditioning, the evidence of resin-dentin hybrid layer was not identified ; nevertheless, the longitudinally running collagen fibrils remained slightly in the specimens applied with All Bond 2.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.295-301
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• 2002

In this paper, solenoid-type 3-D passives (inductors and transformers) have been designed, fabricated, and characterized by using electroplating techniques, wire bonding techniques, multi-layer thick photoresist, and low temperature processes which are compatible with semiconductor circuitry fabrication. Two different fabrication approaches are performed to develop the solenoid-type 3-D passives and relationship of performance characteristics and geometry is also deeply investigated such as windings, cross-sectional area of core, spacing between windings, and turn ratio. Fully integrated inductor has a quality factor of 31 at 6 GHz, an inductance of 2.7 nH, and a self resonant frequency of 15.8 GHz. Bonded wire inductor has a quality factor of 120, an inductance of 20 nH, and a self resonant frequency of 8 GHz. Integrated transformers with turn ratios of 1:1 and n:l have the minimum insertion loss of about 0.6 dB and the wide bandwidth of a few GHz.

• Transactions on Electrical and Electronic Materials
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• v.1 no.1
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• pp.6-11
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• 2000

The hydrogen plasma treatment of silicon wafers in the reactive ion-etching mode was studied for the application to silicon-on-insulator wafers which were prepared using the wafer bonding technique. The chemical reactions of hydrogen plasma with surface were used for both surface activation and removal of surface contaminants. As a result of exposure of silicon wafers to the plasma, an active oxide layer was found on the surface. This layer was rendered hydrophilic. The surface roughness and morphology were examined as functions of the plasma exposing time and power. In addition, the surface became smoother with the shorter plasma exposing time and power. The value of initial surface energy estimated by the crack propagation method was 506 mJ/㎡, which was up to about three times higher as compared to the case of conventional direct using the wet RCA cleaning method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.921-926
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• 1997

SOI(Silicon On lnsulator) technology is many advantages in the gabrication of MOS(Metal-Oxide Semiconductor) and CMOS(Complementary MOS) structures. These include high speed, lower dynamic power consumption,greater packing density, increased radiation tolearence et al. In smiple form of bonded SOL wafer manufacturing, creation of a bonded SOI structure involves oxidizing at least one of the mirror polished silicon surfaces, cleaning the oxidized surface and the surface of the layer to which it will be bonded,bringing the two cleanded surfaces together in close physical proximity, allowing the subsequent room temperature bonding to proceed to completion, and than following this room temperature joining with some form of heat treatment step,and device wafer is thinned to the target thickness. This paper has been performed to investigate the possibility of the bonded SOI wafer manufacturing Especially, we focused on the bonding quality and thinning method. Finally,we achieved the bonded SOI wafer that Si layer thickness is below 3 .mu. m and average roughness is below 5.angs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.11a
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• pp.86-89
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• 1994

This paper describes the fabrication and basic characteristics of a Si Hall device fabricated on a SOI(Si-on-insulator) structure. In which SOI structure was formed by SOB(Si-wafer direct bonding) technology and the insulator of the SOI structure was used as the dielectrical isolation layer of a Hall device. The Hall voltage and sensitivity of the implemented SDB SOI Hall devices showed good linearity with respectivity to the applied magnetic flux density and supple iud current. The product sensitivity of the SDB SOI Hall device was average 670 V/A$.$T and its value has been increased up to 3 times compared to that of bulk Si with buried layer of 10$\mu\textrm{m}$. Moreover, this device can be used at high-temperature, high-radiation and in corrosive environments.