• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.92-98
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• 2010

The design of press bonding tool in LCD module equipment is a very complex and difficult task because many design able variables are involved while their effects are not known. It takes longtime experiments and much expenses to verify the effects of these design variables. However the optimization of bonding tool using OLB(outer lead bonding) and PCB Bonding is a very important problem in LCD manufacturing process, so much design efforts have been made for improving the bonding tool performance. In this paper, a reasonable and fast process which gives optimized solution under the design requirements has been presented. Both analytical and statistical methods are employed in this process. A reliable analytic model using experiment-oriented FE analysis can be obtained, in which the regression equations that predict the tool efficiency from various DOE method are found. Improvement of tool efficiency could be estimated by the regression equations using meaningful factors converged by RSM(Response Surface Method). With this process a reasonable optimized solution that meets a variety of design requirements can be easily obtained.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.1
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• pp.61-66
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• 2016

In order to improve the bonding efficiency of starch adhesives and water resistance of corrugated board, mixing ratio of additives dosage was changed and its effects were analyzed. When the additives dosage was increased, bonding strength, vertical compression strength, bursting strength and water resistance were increased, because of hydroxyl groups or acetyl groups in starch adhesives and cellulose fibers of corrugated board were cross-linked by additives. When 1.0% glyoxal dosage was added, flat crush strength and vertical compression strength were increased. With 1.5% glyoxal, bonding strength and bursting strength were increased. However, 2.0% glyoxal dosage was added, most of strength except bursting strength were decreased. Thus, when the appropriate amount of additives are added during corrugated board production process, increased bonding efficiency of starch adhesives and higher water resistance of corrugated board can be achieved.

• 한국신재생에너지학회:학술대회논문집
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• 2007.11a
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• pp.309-311
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• 2007

Supramolecules containing double hydrogen bonding sites at their both chain ends were self-polymerized to become solid state polymer and were utilized to improve the efficiency of solid state DSSCs. Hydrogen bonding sites were attached at the chain ends of PEG of Mw=2000, such as pyrimethamine and glutaric acid. The solar cell with the solid state supramolecular polymer electrolyte resulted in the overall energy conversion efficiency of 4.63 % with a short circuit current density $(J_{sc})$ of 10.41 $mAcm^{-2}$, an open circuit voltage $V_{oc}$, of 0.71 V and a fill factor (FF) of 0.62 at one sun condition ([oligomer]:[1-methyl-3-propyl imidazolium iodide (MPII)]:$[I_2]$ = 20 : 1 : 0.19, active area = 0.16 $cm^2$, $TiO_2$ layer thickness = 10 ${\mu}m$). The ionic conductivity of the sol id state electrolyte was $5.11{\times}10^{-4}$ (S/cm). The cell performance was characterized by electrochemical impedance spectroscopy and ionic conductivity.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.84-91
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• 2010

The bonding process of LCD panel is attaching an inner lead to an outer lead in the production line of LCD panel module. It is composed of an OLB process and a PCB bonding process. Since bonding tool assembly is one of the core parts of the bonding equipment that determines the durability and performance of the final product, much design efforts to enhance uniformity and efficiency of the process have been made. In this paper, FE analyses have been employed to determine the bonding tool size. Bonding tool of long bar shape has been simplified as a piece with same heater pitch, and appropriate boundary conditions such as convection and radiation are considered. Thermal analysis results by the FEM have been validated by the experiments. With the use of FE analysis varies design parameters and the corresponding effects have been evaluated. It was observed that the approach presented in this paper could be employed for the design of LCD module bonding tool.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.3
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• pp.97-103
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• 2006

The development of a heat exchanger production model based on the microlamination technology and it's economic efficiency is addressed. A microchannel production model is proposed for the high-volume production. The microlamination system is made up of lamina patterning, laminae sorting and laminae bonding. A cost estimation model is developed based on the hewn cycle time and capital equipment costs. An economic efficiency analysis is performed to determine the cost drivers under the different market and product scenarios. The result of the economic efficiency analysis indicated that the device size and the production rate have a great effect on the overall manufacturing cost of microlamination devices. And it can be concluded that the microlamination should focus on bonding larger laminae and reducing both cycle time and warpage.

• Journal of the Korea institute for structural maintenance and inspection
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• v.5 no.1
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• pp.188-194
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• 2001

A reinforced concrete structure is complex structure that works as one body with bonding role of steel bar and concrete. The bonding action between steel bar and concrete makes possible the compound structure. The transmission of mutual strength of the steel bar with concrete in structure is determined by the bonding characteristic of steel bar and concrete surface. But the efficiency of bonding characteristic of steel bar is Questionable by the corrosion cause by the delay construction term, the wrong management, etc. So this study investigate bonding characteristic of reinforced concrete using pull-out test method which steel bar removed rust and the principal variables of this study are concrete compression strength and the degree of corrosion. The result showed that bonding strength tend to increase when removed rust of steel bar whereas it tend to decrease when not removed rust.

• Journal of Powder Materials
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• v.13 no.1 s.54
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• pp.62-67
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• 2006

Friction welding of $Al_2O_3$ particulate reinforced aluminum composites was performed and the following conclusions were drawn from the study of interfacial bonding characteristics and the relationship between experimental parameters of friction welding and interfacial bond strength. Highest bonded joint efficiency (HBJE) approaching $100\%$ was obtained from the post-brake timing, indicating that the bonding strength of the joint is close to that of the base material. For the pre-brake timing, HBJE was $65\%$. Most region of the bonded interface obtained from post-brake timing exhibited similar microstructure with the matrix or with very thin, fine-grained $Al_2O_3$ layer. This was attributed to the fact that the fine-grained $Al_2O_3$ layer forming at the bonding interface was drawn out circumferentially in this process. Joint efficiency of post-brake timing was always higher than that of pre-brake timing regardless of rotation speed employed. In order to guarantee the performance of friction welded joint similar to the efficiency of matrix, it is necessary to push out the fine-grained $Al_2O_3$ layer forming at the bonding interface circumferentially. As a result, microstructure of the bonded joint similar to that of the matrix with very thin, fine-grained $Al_2O_3$ layer can be obtained.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.65 no.4
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• pp.250-254
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• 2016

In this paper, solar-cell modules were fabricated by low-temperature bonding method of construction using CF. CF adhesive strength of cells at 180 degree using 3bus bar structure was measured average 2.4N. As the bonding temperature got higher, Voc and Iscwas increased. And at $185^{\circ}C$, Rseries was measured 0.013[${\Omega}$] which is the highest point. At $185^{\circ}C$, 2N and 6sec in bonding time, $P_{max}$ was measured 3.954[W], fillfactor was measured 67.36[%] and efficiency was measured13.178[%] the highest point.

• International Journal of Automotive Technology
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• v.7 no.5
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• pp.565-570
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• 2006

The development of a light-weight vehicle is in great demand for enhancement of fule efficiency and dynamic performance. The vehicle weight can be reduced effectively by using lightweight materials such as aluminum and magnesium. However, if such materials are used in vehicles, there are often instances when different materials such as aluminum and steel need to be joined to each other. The conventional joining method, namely resistance spot welding, cannot be used in joining different materials. Self-piercing rivet(SPR) and adhesive bonding, however, are good alternatives to resistance spot welding. This paper is concerned with the crushing test of double hat-shaped member made by resistance spot welding, SPR and adhesive bonding. Various parameters of crashworthiness are analyzed and evaluated. Based on these results, the applicability of SPR and adhesive bonding are proposed as an alternative to resistance spot welding.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.135-142
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• 2024

Cu-Cu bonding, one of the key technologies in advanced packaging, enhances semiconductor chip performance, miniaturization, and energy efficiency by facilitating rapid data transfer and low power consumption. However, the quality of the interface bonding can significantly impact overall bond quality, necessitating strategies to quickly detect and classify in-process defects. This study presents a methodology for detecting defects in wafer junction areas from Scanning Acoustic Microscopy images using a ResNet-50 based deep learning model. Additionally, the use of the defect map is proposed to rapidly inspect and categorize defects occurring during the Cu-Cu bonding process, thereby improving yield and productivity in semiconductor manufacturing.