• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.37 no.2 s.110
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• pp.64-69
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• 2005

Suitability of corrugating medium for microflute shape formation was analyzed in terms of fiber bonding strength and paper stiffness. Cationic starch and oxidized starch were applied to corrugating medium's surface by bar coater in order to compare the relative importance of stiffness and fiber bonding on microflute formation. It was found that cationic starch was beneficial for better stiffness and oxidized starch was beneficial for better fiber bonding. The results of the decreasing ratio of length by flute formation, the calculated conditioning effect, and the flute height before and after conditioning treatment were obtained. For better microflute shape formation and its preservation it was found that fiber bonding strength should be increased, proper stiffness was required, and resistance to water absorption from surroundings should be increased.

• Restorative Dentistry and Endodontics
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• v.18 no.2
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• pp.423-430
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• 1993

The purpose of this study was to investigate the effect of ferric and ferric ions contained in phosphoric acid solution as a pretreatment solution on bonding of MMA/TBBO resin to dentin. Each of 1 % and 3 % ferric chloride. cupric chloride. cupric sulfate. and cupric nitrate was mixed into 10% phosphoric acid solution and pretreated dentin surface of bovine anterior teeth for 30 seconds followed- by water rinse and dry. Tensile bond strength was determined after bonding of pretreated dentin with MMA/TBBO resin by use of brush-on ;technique and storing for 24 hours in 3it distilled water. The amount of cupric ions adsorbed on pretreated dentin surface was detected by Wave-Dispersion X-ray microanalyzer for different groups of each pretreatment solution containing cupric salts. The pretreatment with cupric ions contained in 10% phosphoric acid solution was effective to increase bonding strength of MMA/TBBO resin to dentin but not in case of ferric ions. The pretreatment with 3 % cupric chloride and cupric nitrate both enhanced significant increase in bonding strength compared to the control group of 10% phosphoric acid solution(p<0.05). Cupric ions measured in pretreated dentin surface was higher in 3 % cupric chloride group than in 1% cupric chloride group, but couldn't find distinct relationship from the results of this experiment between the amount of adsorbed cupric ions according to the kind of cupric salts and the bonding strength value.

• Restorative Dentistry and Endodontics
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• v.19 no.1
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• pp.180-193
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• 1994

The purpose of this study was to observe the sealing ability and durability of All-Bond 2, Gluma Bonding System, Scotch bond 2 and Superbond D-liner which are dentin bonding agents used as desensitizing agents. The durability of the sealing ability of the materials were compared after 0, 140, 420, 840 tooth brushing strokes. 120 extracted teeth were divided into 5 groups and the agents were applied to the exposed dentin. No agents was applied on group I, the control group. Each specimen went through thermocycling from $5^{\circ}$ to $55^{\circ}C$, 200 times. Each group was devide into 4 subgroups and artificial tooth brushing strokes were done for 0, 140, 420, 840 times. Finally the specimens were stored in 0.5 % methylene blue solution for 24 hours in a incubator set at $37^{\circ}C$. The tooth were sectioned perpendicular to the long axis and the dye penetration ratio to the pulp was measured. The following results were obtained. 1. All four dentin bonding agents initially showed excellent sealing ability. 2. All-bond 2, Gluma Bonding System and Superbond D-liner showed durability of dentinal tubule sealing effect after 840 strokes(6-week) artificial tooth brushing. 3. Scotchbond 2 showed a significant decrease in sealing ability after 420 strokes(3-week) artificial tooth brushing. (P<0.05).

• Korean Journal of Materials Research
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• v.18 no.4
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• pp.204-210
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• 2008

$1.5\;{\mu}m$-thick copper films deposited on silicon wafers were successfully bonded at $415^{\circ}C$/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than $10.4\;J/m^2$ as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than $300^{\circ}C$ had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over $400^{\circ}C$. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1879-1884
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• 2014

Recently, the micro bonding technology comes into the spotlight as the miniaturization of the electronic product. The micro bonding technique can classify by way of laser welding and ultrasonic bonding and etc. However, the research on the micro bonding is much lacks. In this paper, carried out the cooling analysis of the 60 [kHz] ultrasonic bonding equipment to know heat effect of the piezoelectric element when the ultrasonic bonding equipment was operated. The ultrasonic horn having the natural frequency with 60 [kHz] for the dissimilar material bonding of the glass and solder tried to be designed. The parameters and response was set through the basic experiment. The dissimilar material bonding strength analysis using the 60 [kHz] ultrasonic bonding equipment was done. We carried out the bonding for improving bonding strength to using the silver paste. air thightness of bonding surface was confirmed by analysis of bonding interfaces.

• Bulletin of the Korean Chemical Society
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• v.27 no.12
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• pp.2045-2050
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• 2006

The interstitial hydrogen bonding in NiTi solid and its effect on the metal-to-metal bond is investigated by means of the EH tight-binding method. Electronic structures of octahedral clusters $Ti_4Ni_2$ with and without hydrogen in their centers are also calculated using the cluster model. The metal d states that interact with H 1s are mainly metal-metal bonding. The metal-metal bond strength is diminished as the new metal-hydrogen bond is formed. The causes of this bond weakening are analyzed in detail.

• Geomechanics and Engineering
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• v.18 no.2
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• pp.133-140
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• 2019

Strain-rate and temperature have significant effects on the one-dimensional (1D) compression behavior of soils. This paper focuses on the bonding degradation effect of soil structure on the time and temperature dependent behavior of soft structured clay. The strain-rate and temperature dependency of preconsolidation pressure are investigated in double logarithm plane and a thermal viscoplastic model considering the combined effect of strain-rate and temperature is developed to describe the mechanical behavior of unstructured clay. By incorporating the bonding degradation, the model is extended that can be suitable for structured clay. The extended model is used to simulate CRS (Constant Rate of Strain) tests conducted on structural Berthierville clay with different strain-rates and temperatures. The comparisons between predicted and experimental results show that the extended model can reasonably describe the effect of bonding degradation on the stain-rate and temperature dependent behavior of soft structural clay under 1D condition. Although the model is proposed for 1D analysis, it can be a good base for developing a more general 3D model.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.2
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• pp.1-9
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• 1997

For the reduction of parasitic inductance and matching of bonding wire in the package of microwave devices, we propose multiple bonding wires buried in a dielectric material of FR-4 composite. This structure is analyzed using the method of moments (MoM) and compared with the common bondwires and ribbon interconnections. The FR-4 composite is modelled by the cole-cole model which can consider the loss and the variation of the permittivity in a frequency. At 20 GHz, the parasitic reactance is reduced by 90%, 80%, 60% compared to those of a single bonding wire in air, double bonding wires in air and ribbon interconnection in air, respectively. Also, the new bondwire shows very good matching of 60.ohm characteristic impedance and has 15dB, 10dB, 5dB improvement of the return loss and 2.5dB, 0.7dB, 0.2dB improvement of the insertion loss compared to the common interconnections. This technique can minimize the parasitic effect of bondwires in microwave device packaging.

• Journal of Welding and Joining
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• v.20 no.4
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• pp.498-504
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• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2006.06b
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• pp.423-426
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• 2006

Paper has fibers and fines network structure and it is strongly affected by interface bonding between fibers. Depending on the inter-fiber bonding, paper bulk is determined. Fines play an important roll in Campbell and consolidation effect through wet pressing and drying operations. Refined Sw-BKP, Hw-BKP and BCTMP fines were used to investigate the fines effect. Wet-web strength, breaking length, scattering coefficient, and hydrodynamic specific volume were measured. According to the result of experiments, chemical and morphological compositions of fines do not strongly affect to wet-web forming, but strongly affect to drying operations which form hydrogen bonding among fiber-fines-fiber matrixes. Paper bulk should be controlled by the extent of hydrogen bonding between fibers during drying operations.