• 반도체디스플레이기술학회지
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• 제16권1호
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• pp.29-33
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• 2017

This paper presents a development of vision aligner with three channels for the wafer and plate bonding machine in manufacturing of LED. The developed vision aligner consists of three cameras and performs wafer alignment of rotation and translation, flipped wafer detection, and UV Tape detection on the target wafer and plate. Normally the process step of wafer bonding is not defined by standards in semiconductor's manufacturing which steps are used depends on the wafer types so, a lot of processing steps has many unexpected problems by the workers and environment of manufacturing such as the above mentioned. For the mass production, the machine operation related to production time and worker's safety so the operation process should be operated at one time with considering of unexpected problem. The developed system solved the 4 kinds of unexpected problems and it will apply on the massproduction environment.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.1376-1379
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• 2004

This study is designed integration and control system of GaAs bonding system consisted of multi-processing using DeviceNet and GEM-Protocol. Developing bonding system is composed of resin coating, pre-baking pre-aligner, bonding, material handler(flip robot), and wafer cassette, etc. This system has process-fluent of each a process and share information using GEM-protocol. This study devised virtual bonding simulator to control and to monitor bonding system efficiently. Also we can verify optimizing of system previously through a virtual bonding simulator.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.536-539
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• 2002

In this paper, we developed the automatic optical fiber aligner by image processing and automatic loading system. Optical fiber is indispensable for optical communication systems that transmit large volumes of data at high speed, but super-precision technology in sub-micron units is required for optical axis adjustment, we have developed 6-axis micro stage system for I/O optical fiber arrays, the initial automatic aligning system/software for a input optical array by the image processing technique, fast I/O-synchronous aligning strategy, the automatic loading/unloading system and the automatic UV bonding mechanism. In order to adjust the alignment it used on PC based motion controller, a $10\mu\textrm{mm}$ repeat-detailed drawing of automatic loading system is developed by a primary line up for high detailed drawing. Also, at this researches used the image processing system and algorithm instead of the existing a primary hand-line up. and fiber input array and waveguide chip formed in line by automatic. Therefore, the developed and manufactured optical aligning system in this research fulfills the great role of support industry for major electronics manufacturers, telecommunications companies, universities, government agencies and other research institutions.

• 산업기술연구
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• 제22권B호
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• pp.241-249
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• 2002

Optical fiber is indispensable for optical communication systems that transmit large volumes of data at high speed, but super precision technology in sub-micron units is required for optical axis adjustment. We developed the automatic optical fiber by image processing and automatic loading system. we have developed 6-axis micro stage system for I/O optical fiber arrays, the initial automatic aligning system software for a input optical array by the image processing technique, fast I/O-synchronous aligning strategy, the automatic loading/unloading system and the automatic UV bonding mechanism. In order to adjust the alignment it used on PC based motion controller, a $10{\mu}m$ repeat-detailed drawing of automatic loading system is developed by a primary line up for high detailed drawing. Also, at this researches used the image processing system and algorithm instead of the existing a primary hand-line up and fiber input array and waveguide chip formed in line by automatic.

• 한국전기전자재료학회논문지
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• 제15권4호
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• pp.301-307
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• 2002

Direct bonded SOI wafer pairs with $Si ll SiO_2/Si_3N_4 ll Si$ the heterogeneous insulating layers of SiO$_2$-Si$_3$N$_4$are able to apply to the micropumps and MEMS applications. Direct bonding should be executed at low temperature to avoid the warpage of the wafer pairs and inter-diffusion of materials at the interface. 10 cm diameter 2000 ${\AA}-SiO_2/Si(100}$ and 560 $\AA$- ${\AA}-Si_3N_4/Si(100}$ wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were pre- mated with facing the mirror planes by a specially designed aligner in class-100 clean room immediately. We employed a heat treatment equipment so called fast linear annealing(FLA) with a halogen lamp to enhance the bonding of pre mated wafers We kept the scan velocity of 0.08 mm/sec, which implied bonding process time of 125 sec/wafer pairs, by varying the heat input at the range of 320~550 W. We measured the bonding area by using the infrared camera and the bonding strength by the razor blade clack opening method, respective1y. It was confirmed that the bonding area was between 80% and to 95% as FLA heat input increased. The bonding strength became the equal of $1000^{\circ}C$ heat treated $Si ll SiO_2/Si_3N_4 ll Si$ pair by an electric furnace. Bonding strength increased to 2500 mJ/$\textrm{m}^2$as heat input increased, which is identical value of annealing at $1000^{\circ}C$-2 hr with an electric furnace. Our results implies that we obtained the enough bonding strength using the FLA, in less process time of 125 seconds and at lowed annealing temperature of $400^{\circ}C$, comparing with the conventional electric furnace annealing.

• 한국재료학회지
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• 제12권2호
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• pp.117-120
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• 2002

We investigated the possibility of direct bonding of the Si ∥SiO$_2$/Si$_3$N$_4$∥Si wafers for Oxide-Nitride-Oxide(ONO) gate oxide applications. 10cm-diameter 2000$\AA$-thick thermal oxide/Si(100) and 500$\AA$-Si$_3$N$_4$LPCVD/Si (100) wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were premated wish facing the mirror planes by a specially designed aligner in class-100 clean room immediately. Premated wafer pairs were annealed by an electric furnace at the temperatures of 400, 600, 800, 1000, and 120$0^{\circ}C$ for 2hours, respectively. Direct bonded wafer pairs were characterized the bond area with a infrared(IR) analyzer, and measured the bonding interface energy by a razor blade crack opening method. We confirmed that the bond interface energy became 2,344mJ/$\m^2$ when annealing temperature reached 100$0^{\circ}C$, which were comparable with the interface energy of homeogenous wafer pairs of Si/Si.

• 한국정밀공학회지
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• 제21권2호
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• pp.195-202
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• 2004

This paper presents the fabrication and evaluation of mechanical behavior for a peristaltic micropump by flow simulation. The valve-less micropump using the diffuser/nozzle is consists of the lower plate, the middle plate, the upper plate and the tube that connects inlet and outlet of the pump. The lower plate includes the channel and the chamber, and the plain middle plate are made of glass and actuated by the piezoelectric translator. Channels and a chamber on the lower plate are fabricated on high processability silicon wafer by the DRIE(Deep Reactive Ion Etching) process. The upper plate does the roll of a pump cover and has inlet/outlet/electric holes. Three plates are laminated by the aligner and bonded by the anodic bonding process. Flow simulation is performed using error-reduced finite volume method (FVM). As results of the flow simulation and experiments, the single chamber pump has severe flow problems, such as a backflow and large fluctuation of a flow rate. It is proved that the double-chamber micropump proposed in this paper can reduce the drawback of the single-chamber one.

• 대한치과교정학회지
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• 제42권1호
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• pp.39-46
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• 2012

Objective: We evaluated the detachment force, amount of deformation, fracture mode, and pull-out force of 3 different wires used for bonded lingual retainer fabrication. Methods: We tested 0.0215-inch five-stranded wire (PentaOne, Masel; group I), $0.016{\times}0.022$-inch dead-soft eight-braided wire (Bond-A-Braid, Reliance; group II), and 0.0195-inch dead-soft coaxial wire (Respond, Ormco; group III). To test detachment force, deformation, and fracture mode, we embedded 94 lower incisor teeth in acrylic blocks in pairs. Retainer wires were bonded to the teeth and vertically directed force was applied to the wire. To test pull-out force, wires were embedded in composite that was placed in a hole at the center of an acrylic block. Tensile force was applied along the long axis of the wire. Results: Detachment force and mode of fracture were not different between groups. Deformation was significantly higher in groups II and III than in group I (p < 0.001). Mean pull-out force was significantly higher for group I compared to groups II and III (p < 0.001). Conclusions: Detachment force and fracture mode were similar for all wires, but greater deformations were seen in dead-soft wires. Wire pull-out force was significantly higher for five-stranded coaxial wire than for the other wires tested. Five-stranded coaxial wires are suggested for use in bonded lingual retainers.

• 대한심미치과학회지
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• 제27권2호
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• pp.82-96
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• 2018

3D 프린팅은 삼차원 이미지 정보를 이용하여 레이어로 분할한 후 선택한 소재를 적층하여 가공하는 방법을 말한다. 소재를 적층하는 방법에 따라 다양한 종류의 3D 프린팅이 존재하는데 최근 치과분야에서는 SLA방식과 DLP방식으로 광원을 이용한 경화를 통해 적층 가공하는 3D 프린팅이 널리 보급되어 사용되고 있다. 전악 범위의 3D프린팅 치과용 모델은 전통적인 인상 채득으로 제작된 스톤모델보다는 다소 정확성이 부족한 것으로 보고되었으나, 같은 STL파일을 이용하여 4분악 범위를 3D 프린팅한 모델은 밀링 방법으로 가공한 모델보다 정확하였다. 디자인 소프트웨어의 활용도에 따라 보철치료의 진단, 임시 보철물의 제작, 의치의 제작이 가능하였다. 교정에서는 투명 교정 모델과 브라켓 간접 부착을 위한 트레이 제작이 가능하였다. 임플란트 수술에 있어서 CT를 기반으로 한 정확한 위치에 임플란트를 식립하는 가이드 제작에 활용하고 있다. 출력 방식의 발전으로 인하여 3D 프린터의 출력시간이 계속적으로 단축되고 있으며, 이로 인해 치과 진료실 내에서 3D 프린터가 기존의 전통적인 가공 방법을 대체할 수 있을 것으로 기대한다.