• 제목/요약/키워드: Bonding State

검색결과 363건 처리시간 0.029초

Rene80/B/Rene80계의 액상확산 접합과정 -B분말 도포법을 이용한 액상확산접합 (Liquid Phase Diffusion Bonding Procedure of Rene80/B/Rene80 System -Liquid Phase Diffusion Bonding Using B Powder Coating Method)

  • 정재필;강춘식
    • Journal of Welding and Joining
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    • 제13권2호
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    • pp.132-138
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    • 1995
  • Rene80 superalloy was liquid phase diffusion bonded by using boron(B) as an insert material, where B has high diffusivity and higher melting point as an insert material. Bonding procedure and bonding mechanism of Rene80/B/Rene80 joint were investigated. As results, liquid metal was produced by solid state reaction between base metal and insert material on bonding zone. The liquid metal was produced preferentially at the grain boundary. Except for production of liquid metal, other bonding procedure was nearly same as TLP(Transient Liquid Phase) bonding. Bonding time, however, was reduced compared to prior result of TLP bonding. By bonding S.4ks at l453K, Ren80/B/Rene80 joint was isothermally solidified and homogenized where thickness of insert material was 7.5.mu.m.

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Excited State Dynamics of Curcumin and Solvent Hydrogen Bonding

  • Yang, Il-Seung;Jin, Seung-Min;Kang, Jun-Hee;Ramanathan, Venkatnarayan;Kim, Hyung-Min;Suh, Yung-Doug;Kim, Seong-Keun
    • Bulletin of the Korean Chemical Society
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    • 제32권spc8호
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    • pp.3090-3093
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    • 2011
  • Curcumin is a natural product with antioxidant, anti-inflammatory, antiviral and antifungal functions. As it is known that the excited state intramolecular hydrogen transfer of curcumin are related to its medicinal antioxidant mechanism, we investigated its excited state dynamics by using femtosecond transient absorption spectroscopy in an effort to understand the molecule's therapeutic effect in terms of its photophysics and photochemistry. We found that stronger intermolecular hydrogen bonding with solvents weakens the intramolecular hydrogen bonding and decelerates the dynamical process of the enolic hydrogen. Exceptions are found in methanol and ethylene glycol due to their nature as simultaneous hydrogen bonding donor-acceptor and high viscosity solvent, respectively.

Bonding and Etchback Silicon-on-Diamond Technology

  • Jin, Zengsun;Gu, Changzhi;Meng, Qiang;Lu, Xiangyi;Zou, Guangtian;Lu, Jianxial;Yao, Da;Su, Xiudi;Xu, Zhongde
    • The Korean Journal of Ceramics
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    • 제3권1호
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    • pp.18-20
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    • 1997
  • The fabrication process of silicon-diamond(SOD) structure wafer were studied. Microwave plasma chemical vapor deposition (MWPCVD) and annealing technology were used to synthesize diamond film with high resistivity and thermal conductivity. Bonding and etchback silicon-on-diamond (BESOD) were utilized to form supporting substrate and single silicon thin layer of SOD wafer. At last, a SOD structure wafer with 0.3~1$\mu\textrm{m}$ silicon film and 2$\mu\textrm{m}$ diamond film was prepared. The characteristics of radiation for a CMOS integrated circuit (IC) fabricated by SOD wafer were studied.

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Facile Modulation of Electrical Properties on Al doped ZnO by Hydrogen Peroxide Immersion Process at Room Temperature

  • Park, Hyun-Woo;Chung, Kwun-Bum
    • Applied Science and Convergence Technology
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    • 제26권3호
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    • pp.43-46
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    • 2017
  • Aluminum-doped ZnO (AZO) thin films were deposited by atomic layer deposition (ALD) with respect to the Al doping concentrations. In order to explain the chemical stability and electrical properties of the AZO thin films after hydrogen peroxide ($H_2O_2$) solution immersion treatment at room temperature, we investigated correlations between the electrical resistivity and the electronic structure, such as chemical bonding state, conduction band, band edge state below conduction band, and band alignment. Al-doped at ~ 10 at % showed not only a dramatic improvement of the electrical resistivity but also excellent chemical stability, both of which are strongly associated with changes of chemical bonding states and band edge states below the conduction band.

통전압접을 활용한 알루미늄 소재 간 고상접합에 관한 연구 (Study on Electrically Assisted Pressure Solid State Joining Between Aluminum Alloys)

  • 최호욱;이시환;김이재;홍성태;한흥남
    • 소성∙가공
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    • 제31권6호
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    • pp.337-343
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    • 2022
  • Electrically assisted pressure joining (EAPJ) utilizes electric current-induced kinetic enhancement to achieve solid state diffusion bonding within a short time. In this study, aluminum alloy specimens, which are known as a hard-to-weld metal, were successfully solid-state joined through EAPJ. The bonding process was performed in two ways: continuous direct current (CDC), which applies relatively low current density, and pulsed direct current (PDC), which applies high current density. It was observed that the bonding strength was higher in PDC than in CDC. The microstructure of the joint was characterized using 3D X-ray microscopy (XRM) and electron backscatter diffraction (EBSD).

COLLECTIVE BEHAVIORS OF SECOND-ORDER NONLINEAR CONSENSUS MODELS WITH A BONDING FORCE

  • Hyunjin Ahn;Junhyeok Byeon;Seung-Yeal Ha;Jaeyoung Yoon
    • 대한수학회지
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    • 제61권3호
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    • pp.565-602
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    • 2024
  • We study the collective behaviors of two second-order nonlinear consensus models with a bonding force, namely the Kuramoto model and the Cucker-Smale model with inter-particle bonding force. The proposed models contain feedback control terms which induce collision avoidance and emergent consensus dynamics in a suitable framework. Through the cooperative interplays between feedback controls, initial state configuration tends to an ordered configuration asymptotically under suitable frameworks which are formulated in terms of system parameters and initial configurations. For a two-particle system on the real line, we show that the relative state tends to the preassigned value asymptotically, and we also provide several numerical examples to analyze the possible nonlinear dynamics of the proposed models, and compare them with analytical results.

A 1D model considering the combined effect of strain-rate and temperature for soft soil

  • Zhu, Qi-Yin;Jin, Yin-Fu;Shang, Xiang-Yu;Chen, Tuo
    • Geomechanics and Engineering
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    • 제18권2호
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    • pp.133-140
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    • 2019
  • Strain-rate and temperature have significant effects on the one-dimensional (1D) compression behavior of soils. This paper focuses on the bonding degradation effect of soil structure on the time and temperature dependent behavior of soft structured clay. The strain-rate and temperature dependency of preconsolidation pressure are investigated in double logarithm plane and a thermal viscoplastic model considering the combined effect of strain-rate and temperature is developed to describe the mechanical behavior of unstructured clay. By incorporating the bonding degradation, the model is extended that can be suitable for structured clay. The extended model is used to simulate CRS (Constant Rate of Strain) tests conducted on structural Berthierville clay with different strain-rates and temperatures. The comparisons between predicted and experimental results show that the extended model can reasonably describe the effect of bonding degradation on the stain-rate and temperature dependent behavior of soft structural clay under 1D condition. Although the model is proposed for 1D analysis, it can be a good base for developing a more general 3D model.

상아질 접착 시스템의 국내 사용 동향에 관한 연구 (Survey study on the using state of dentin bonding systems in Korea)

  • 김물결;김광만
    • 대한치과의사협회지
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    • 제54권10호
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    • pp.780-788
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    • 2016
  • Dentin bonding systems are unique dental materials which are rapidly evolute and essential materials for bonding of restorative materials to dentin. Now, 4th generation, 5th generation, 6th generation and 7th generation of dentin bonding systems are used in clinic. We investigated the frequency, motivation of choosing dentin bonding systems and satisfaction of them by survey in 2014. 5th generation of dentin bonding systems are mostly used in Korea and young dentist have tendency to choose newly developed dentin bonding systems.

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레진시멘트와 치아와의 접착 (Resin cement bond to tooth)

  • 이정환
    • 대한치과의사협회지
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    • 제53권3호
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    • pp.187-194
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    • 2015
  • This paper reflects on the state of the art of two kinds of tooth hard tissue (enamel and dentin) bonding with resin cement. After presenting composition of resin cement, concepts of enamel bonding and resin bonding are addressed. Special attention is devoted to the concept and advantage of self-etching technique. Finally, recommended clinical performance regarding bonding to tooth with resin cement is summarized.

THE ANALYSIS OF THE FT-NIR SPECTRA OF WATER ON THE BASIS OF TWO-STATE MODEL

  • Boguslawa, Czarnik-Matusewicz
    • 한국근적외분광분석학회:학술대회논문집
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    • 한국근적외분광분석학회 2001년도 NIR-2001
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    • pp.1181-1181
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    • 2001
  • Robinson with ${coworkers}^{1}$ have introduced two-state outer-neighbor bonding model to explain the anomalies of water. The studies on the properties of water as a function of temperature and pressure revealed that, unlike other ideas, all $H_2O$ molecules in liquid are tetrabonded. On the average they are forming two different bonding types. One type is the regular tetrahedral water-water bonding similar to that found in the ordinary ice Ih, whereas the other is a more dense nonregular tetrahedral bonding similar to that appearing in the ice II. The transformation between these two bonding forms is evidenced by FT-NIR experiment. The FT-NIR measurements were done for liquid water in the temperature range from $20^{\circ}C$ up to $80^{\circ}C$ in a wide extent of frequencies: 12 000 - 4000 $cm^{-1}$ /. Temperature dependent variations in the volume fraction of these two structures are directly related to the spectral changes. The absorbance variations are explored by means of the two-dimensional correlation spectroscopy (2DCOS), principal component analysis (PCA), curve fitting and second derivatives. The presence of the isosbestic points in a range of the combination and overtone transitions indicates that the experimental spectra are a superposition of two temperature independent components. One component of diminishing intensity with temperature increase, is assigned to a stronger hydrogen bonds occurred in the Ih type, whereas the second component showing an opposite behavior, one can attribute to a weaker H-bonds characteristic for the II type. The understanding of the hydrogen bonding network in the liquid water is very important in interpretation of the interaction between water and protein chain. The two-state model of water surrounding the protein surface could advance an understanding of the hydration process.

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