• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.5
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• pp.111-116
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• 2018

Thermal fusion bonding is a method to enclose open microchannels fabricated on polymer chips for use in lab-on-a-chip (LOC) devices. Polymethyl methacrylate (PMMA) is utilized in various biomedical-microelectromechanical systems (bio-MEMS) applications, such as medical diagnostic kits, biosensors, and drug delivery systems. These applications utilize PMMAs biochemical compatibility, optical transparency, and mold characteristics. In this paper, we elucidate both the conformational entanglement of PMMA molecules at the contact interfacial regime, and the qualitative nature of the thermal fusion bonding phenomena through systematic molecular dynamics simulations.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.293-294
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• 2010

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.99-101
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• 2002

• Journal of the Korean Ceramic Society
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• v.30 no.2
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• pp.131-138
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• 1993

The effects of silane coupling agents on the injection molding process were investigated using silicone nitride mixtrues with a binder system containing polypropylene as a major binder (55vol% solid loading). The formation of bonding between silicon nitride powder and coupling agents was confirmed through the analyses of powder surface. The use of coupling agents improved mixing characteristics judged by the torque change during mixing process. the coupling agents also reduced molten viscosity of the mixture considerably, which is a main factor to determine the flow of the mixture. However, the bonding between coupling agents and polymers had a negative effect on the debinding process by retarding the thermal decomposition.

• Korean Journal of Materials Research
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• v.34 no.3
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• pp.170-174
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• 2024

In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 ℃, die bonding and isothermal heat treatment at 330 ℃ for 5 min and wire bonding at 260 ℃, respectively. At the interface between the chip and lead frame, Ni₃Sn₄ and Ag₃Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni₃Sn₄ and Ag₃Sn IMCs. After the wire bonding process, the interface is composed of Ni₃Sn₄, Ag₃Sn and (Ag,Cu)₃Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2000.10a
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• pp.21-24
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• 2000

Ultra-fine grains were produced in pure Al using an Accumulative Rolling-Bonding (ARB) process. After several cycles of the ARB process, pure Al sheets were filled with the ultra-fine grains whose diameters were several hundred nano-meters. With ARB cycles, the nature of grain boundaries of the ultra-fine grains changed from diffusive sub-boundaries to well-defined high angle boundaries. After 7 cycles, ultra-fine polycrystals with large misorientations between neighboring grains were obtained. Sliding wear tests using a pin-on-disk type wear tester were co ducted on the ultra-fine grained pure Al. Wear rates of pure Al increased with the increase of ARB cycle numbers in spite of the increase in hardness. Worn surfaces and cross-sections were examined with optical microscopy (OM) and scanning electron microscopy (SEM) In investigate the wear mechanism of the ultra-fine grained pure Al.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.265-268
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• 2006

The superplastic forming/diffusion bonding is widely accepted as an advanced technique for forming complex industrial components. But the superplastic forming process requires much forming time and generates excessive thinning thickness distribution of formed part. Superplastic in materials is only achieved in a narrow range of strain-rate with optimum value unique to each material. In this study, finite element analysis for surperplastic forming/diffusion bonding (SPF/DB) processes of three-sheet and four-sheet sandwich parts. From this study, forming analysis have offered a lot of information for developing the forming process.

• Transactions of Materials Processing
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• v.16 no.4 s.94
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• pp.239-243
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• 2007

Superplastic forming/diffusion bonding(SPF/DB) has been widely used in the automotive and aerospace industry since it has great advantages to produce very light and strong components. Finite element method(FEM) is used to model the SPF/DB process of 3-sheet sandwich panel to predict the pressure-time curve and to analyze the process parameters. In order to eliminate defects of the part, a new pressurization scheme is proposed. Contrary to the conventional one-step pressurization, which causes the folding at the DB joint, two-step pressurization can eliminate the folding. Effect of pressurization cycle was investigated by using FE analysis and proper pressurization cycle is proposed.

• Journal of Powder Materials
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• v.9 no.3
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• pp.189-198
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• 2002

In this work, transient liquid phase (TLP) bonding of Ni-Cr heat resisted cast alloy (HP) was investigated. And also the behaviors of the solid particles distributed in the interlayer during TLP bonding were investigated. The MBF-60 and solid particles (Ni, Fe, and $Al_2O_3$ powders respectively) added MBF-60 which will be a liquid phase coexisting with solid particles at the bonding temperature were used as insert metal. The effective and sound bonding was possible by spark plasma sinter-bonding due to the differences of electric resistance between base metal and liquid insert layer which creates high temperature region. During the isothermal solidification, $Al_2O_3$ particles and solid particles of liquid phase sintered insert metal have shown no growth, while Ni and Fe particles grow rapidly. In this TLP bonding using the MBF-60 and distributed Fe, Ni particles as insert materials, the whole isothermal solidification process was dominated by the growth rate of the solid particles distributed in the interlayer.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.82-88
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• 2003

The bonding phenomenon and mechanism in the transient liquid phase bonding(TLP Bonding) of directionally solidified Ni base superalloy, GTD-111 was investigated. At the bonding temperature of 1403K, liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B and Si into the base metal and solids in the bonded interlayer grew epitaxially from mating base metal inward the insert metal. The number of grain boundaries formed at the bonded interlayer was corresponded with those of base metal. The liquation of grain boundary and dendrite boundary occurred at 1433K. At the bonding temperature of 1453K which is higher than liquation temperature of grain boundary, liquids of the Insert metal were connected with liquated grain boundaries and compositions in each region mixed mutually. In Joints held for various time at 1453t phases formed at liquated grain boundary far from the interface were similar to those of bonded interlayer. With prolonged holding time, liquid phases decreased gradually and liquids of continuous band shape divided many island shape. But liquid phases did not disappeared after holding for 7.2ks at 1453k. Isothermal solidification process at the bonding temperature which is higher than the liquation temperature of the grain boundary was controlled by diffusion of Ti to be result in liquation than B or Si. in insert metal. (Received January 15, 2003)