• 대한화학회지
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• 제36권5호
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• pp.627-631
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• 1992

Lippincott의 실험적 퍼텐셜을 사용하여 결정상내의 수소결합을 나타내는 간단한 1차원적 모형을 제시하였다. 이 모형에 의하여 압력의 증가에 따른 내부 대칭 신축진동수의 변화를 $NH_4I$에 대하여 계산하였다. 계산 결과는 실험치와 정성적인 일치를 보였다. 낮은 압력에서는 압력의 증가가 수소결하비의 세기를 증가시켜 N-H 진동을 약화시키고, 높은 압력에서는 이온 내의 원자간의 거리의 감소에 의하여 척력의 증가 때문에 진동수가 증가함을 보인다.

• 소성∙가공
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• 제31권6호
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• pp.337-343
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• 2022

Electrically assisted pressure joining (EAPJ) utilizes electric current-induced kinetic enhancement to achieve solid state diffusion bonding within a short time. In this study, aluminum alloy specimens, which are known as a hard-to-weld metal, were successfully solid-state joined through EAPJ. The bonding process was performed in two ways: continuous direct current (CDC), which applies relatively low current density, and pulsed direct current (PDC), which applies high current density. It was observed that the bonding strength was higher in PDC than in CDC. The microstructure of the joint was characterized using 3D X-ray microscopy (XRM) and electron backscatter diffraction (EBSD).

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.2020-2022
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS fileds because of its application possibility in harsh environements. This paper presents on pre-bonding according to HF pre-treatment conditions in SiC wafer direct bonding using PECVD oxide. The PECVD oxide was characterized by XPS and AFM, respectively. The characteristics of bonded sample were measured under different bonding conditions of HF concentration and applied pressure, respectively. The bonding strength was evaluated by tensile strength method. Components existed in the interlayer were analyzed by using FT-IR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 5.3 kgf/$cm^2{\sim}$ Max : 15.5 kgf/$cm^2$).

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.233-235
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• 2006

This study was performed to find the best bonding conditions by comparing mechanical properties in solar collector. The solar collector that consists of copper plate and tube was successfully bonding by ultrasonic seam welding. In this experiment, we varied the values of welding pressure and welding amplitude and fixed the values of speed and frequency. Consequently, it was find that the welding pressure had higher effort on bonding strength than the welding amplitude.

• Restorative Dentistry and Endodontics
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• 제29권4호
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• pp.339-345
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• 2004

The aim of this study was to measure and compare the micro shear bond strengths of the following dentin bonding systems to the dentin surfaces under simulated pulpal pressure: All Bond $2^{\circledR},{\;}Second^{\circledR},{\;}AdheSE^{\circledR}$, Adper Prompt $L-Pop^{\circledR}$. The occlusal surfaces of 180 extracted human molars were prepared so the dentin bonding surfaces could be exposed. The teeth were randomly assigned to 3 equal groups of 60 each and subdivided. The dentin surfaces were treated with the above mentioned bonding system and resin composite cylinders were built up under a simulated pulpal pressure when saline (Group II) or diluted bovine serum (Group III) was used as the pulpal fluid. As a control. the same procedures were performed in the dried dentin surfaces (Group I). After one day of storage in water. the micro shear bond strengths were measured using an EZ tester. Group II and III showed significantly lower shear bond strength than Group I statistically (p < 0.05). $SEbond^{\circledR}{\;}and{\;}AdheSE^{\circledR}$ showed no difference among the different dentin condition. In the Adper Prompt $L-Pop^{\circledR}$. a simulated pulpal pressure were applied to the specimens using diluted bovine serum. which showed a higher strength than the specimens in which saline was used (p < 0.05).

• Composites Research
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• 제24권5호
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• pp.23-28
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• 2011

본 논문에서는 필라멘트 와인딩 시 장력에 의해 복합재료에 발생한 압력 정보를 이용하여 동시경화법으로 제조된 T800 탄소섬유/에폭시 복합재료-알루미늄 단면겹치기 접착조인트의 접착강도를 부가압력의 크기에 따라 측정하였다. 실험시편은 오토클레이브 진공백 성형을 통해 성형압력 (절대압력 0.1MPa, 0.3MPa, 0.7MPa)을 조절하여 제작하였다. 접착강도를 측정하기 위하여 인장실험이 실시되었으며, 필라멘트 와인딩 공정에 의해 제조된 Type III 수소저장용가의 복합재료-알루미늄 라이너의 계면 접착강도를 측정하기 위해 단면겹치기 접착조인트의 접착부에 일정한 압력을 가해줄 수 있는 압력부가 장치를 설계하였다. 적층된 복합재료에 가해지는 부가압력이 접착강도에 미치는 영향을 확인하기 위해 서로 다른 세 종류의 부가압력 (절대압력 0.1MPa, 0.3MPa, 0.7MPa)을 시편에 부가하여 접착강도를 측정하고, 그 결과를 비교하였다.

• Journal of Welding and Joining
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• 제18권1호
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• pp.70-76
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• 2000

A rolled steel for structural parts and lead bronze alloy were bonded each other by a new semi-solid diffusion bonding process to investigate the effect of the process parameters, for example bonding temperature and bonding time, on the interface characteristics, and bonding behavior. It can be possible that manufacture of the bonded steel/lead bronze which has a cylindrical shape with inserted the lead bronze alloy into the steel ring by the diffusion bonding process under the semi-solid condition of the lead bronze alloy without any pressure and flux. It has been know that the control of the amount of the liquid phase in semi-solid lead bronze alloy was very important to obtain soundness interface, since the shear strength of the bonded steel/lead bronze at 850℃ for 60 minutes under the condition of about 40% of the liquid phase in the lead bronze alloy shows maximum value, 210 MPa. The shear strength increases with an increase in bonding time and show maximum value, and then decreases.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.447-450
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• 2001

Abstract-Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively. Components existed in the interlayer were analysed by using FT-lR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 2.4kgf/cm$^2$∼Max : 14.9kgf/cm$^2$).

• 반도체디스플레이기술학회지
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• 제10권2호
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• pp.103-108
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• 2011

Ultrasonic welding is widely used in bonding of the same kind or dissimilar materials. The important variable of ultrasonic bonding is the bonding pressure, bonding time and applied amplitude energy. These variables have to be optimized in order to obtain the optimum bonding results. In this research, the important factor to optimal bonding between metal and glass were experimentally investigated by applying design of experiment.

• 센서학회지
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• 제29권5호
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• pp.354-359
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• 2020

The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10^-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.