• The korean journal of orthodontics
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• v.19 no.2
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• pp.155-163
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• 1989

Indirect bonding is done by placing the brackets on a model in the laboratory and using a template or tray to transfer the laboratory positioning to the teeth. The advantages of this technique are 1. decreased chair time 2. less patient discomfort 3. accuracy of a attachment placement 4. good adaptation of attachment to tooth contour 5. occlusal relationship of brackets and opposing teeth can be checked The disadvantages of the technique are 1. complex laboratory procedure 2. sometimes difficult on very short clinical crowns 3. teeth with crowns, large buccal restoration will not bond 4. may not be fitted close, if poor adaptation 5. likely to be disturbed setting Several indirect bonding techniques have proved reliable in clinical practice. However, they differ in the way the brackets are attached temporarily to the model, the type of transfer tray or other mechanism used, the adhesive or sealant employed, whether segmented or full bonding used, and the way the transfer is removed so as not to exert excessive force on a still maturing bond.

• Computers and Concrete
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• v.7 no.5
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• pp.437-453
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• 2010

CFRP has been widely used for strengthening reinforced concrete members in last decade. The strain transfer mechanism from concrete face to CFRP is a key factor for rigidity, ductility, energy dissipation and failure modes of concrete members. For these reasons, determination of the effective CFRP bonding length is the most crucial step to achieve effective and economical strengthening. In this paper, generalizations are made on effective bonding length by increasing the amount of test data. For this purpose, ANSYS software is employed, and an experimentally verified nonlinear finite element model is prepared. Special contact elements are utilized along the concrete-CFRP strip interface for investigating stress distribution, load-displacement behavior, and effective bonding length. Then results are compared with the experimental results. The finite element model found consistent results with the experimental findings.

• Journal of the Korean Ceramic Society
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• v.20 no.1
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• pp.70-78
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• 1983

This paper discusses the application of Si-Borosilicate glass sealing to a new sealing method which utilizes a large electrostatic field to pormote bound formation at relatively low temperature. Bonding mechanism and the effect of bonding time bonding temperature glass thickness and surface roughness on the bond strength were investigated. Application of a de voltage across bonded specimen gradually produced a layer of glass adjacent silicon which was depleted of mobile ions. As a consequence a n increasingly larger fraction of the applied voltage appeared across the depleted region and very large electric field resulted This field accompanyed by large electrostatic force acted as driving force the of strong bond. And stronger bond was formed with increasing bonding time and temperature. A low temperature preoxidation is advantageous for the Si surface having a rougher surface finish that 1 microinch.

• Journal of the Korea Concrete Institute
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• v.28 no.3
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• pp.329-340
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• 2016

Increase in demotion and repair works on buildings in the construction market generates a large amount of construction waste. Recycling of construction waste is important for saving of resources, preservation of environment and constant advance of the construction industry. Accordingly, the environmental and economic value of recycled aggregate, which is produced after waste concrete is crushed, is increasingly highlighted. It is generally known that compared to concrete made of ordinary aggregate, concrete made of recycled aggregate has low quality, and the low quality is dependent on the amount of the bonding heterogeneous (cement paste and mortar) as well as the amount of the pores within the bonding heterogeneous. Reports on carbonation mechanism shows that the pores of cement-based materials are filled up by the progress of carbonation. Therefore, this study aims at an estimation of the period for optimum carbonation reforming appropriate for the thickness of the bonding heterogeneous of recycled aggregate, based on carbonation mechanism, with a view to improving the product quality by means of filling up the pores of the bonding heterogeneous of recycled aggregate. This study drew the carbonation depth according to the passage of age by calculating the bonding ratio and bonding thickness of the bonding heterogeneous as against the particle size distribution of recycled aggregate as well as by chemical quantitative analysis according to the age of accelerated carbonation of mock-up samples imitating bonding heterogeneous. Based on the correlation between the age of accelerated carbonation and carbonation depth, this study also proposed the estimated period of carbonation reforming of recycled aggregate appropriate for the thickness of the bonding heterogeneous.

• 대한치과교정학회:학술대회논문집
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• 2004.11a
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• pp.83.3-84
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• 2004

• 대한치과교정학회:학술대회논문집
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• 2004.11a
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• pp.34.2-34.2
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• 2004

• Korean Journal of Materials Research
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• v.16 no.2
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• pp.99-105
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• 2006

This paper reports an improved bonding method using the IPA (isopropyl alcohol) assisted low-temperature bonding process for the PMMA (polymethylmethacrylate) micro CE (capillary electrophoresis) chip. There is a problem about channel deformations during the conventional processes such as thermal bonding and solvent bonding methods. The bonding test using an IPA showed good results without channel deformations over 4 inch PMMA wafer at $60^{\circ}C$ and 1.3 bar for 10 minutes. The mechanism of IPA bonding was attributed to the formation of a small amount of vaporized acetone made from the oxidized IPA which allows to solvent bonding. To verify the usefulness of the IPA assisted low-temperature bonding process, the PMMA micro CE chip which had a $45{\mu}m$ channel height was fabricated by hot embossing process. A functional test of the fabricated CE chip was demonstrated by the separation of fluorescein and dichlorofluorescein. Any leakage of liquids was not observed during the test and the electropherogram result was successfully achieved. An IPA assisted low-temperature bonding process could be an easy and effective way to fabricate the PMMA micro CE chip and would help to increase the yield.

• Journal of Advanced Marine Engineering and Technology
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• v.24 no.1
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• pp.59-66
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• 2000

To investigate the optimum brazing condition, variation of bonded structure and mechanical properties of novel brazed pure Al with bonding condition (brazing temperature, time and Si/flux ratio) was studied. A basic study of the bonding mechanism was also examined. The optimum brazing condition was obtained at $590^{\circ}$ for 2 minutes and the bonded structure showed that it is composed of almost entirely eutectic Al-Si with near eutectic composition. At higher brazing temperature $630^{\circ}$, hypoeutectic Al-Si structure was observed in the bonded area and resulted in erosion of base metal. The thickness of eutectic layer formed in optimum brazing temperature increased linearly with the square root of time, showing a general diffusion controlled process. The ultimate tensile strength of bonded joint brazed at an optimum brazing condition was about 60% of base metal and its fracture surface showed a brittle mode.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.03a
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• pp.140-143
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• 1997

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.11a
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• pp.206-209
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• 1994

This paper has been researched bondability of electronic devices, such as lead frame and thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to control both the thermal distribution of the bonds and it stability, because electronics components is consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realzed fluxless bonding process with filler metal such as plating layers.