• 한국도로학회논문집
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• 제10권1호
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• pp.11-18
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• 2008

본 논문은 하중재하시 강상판교의 방수층과 교면포장에서 발생하는 거동을 유한요소해석을 통하여 분석하였다. 포장표면에 연직방향으로 작용하는 차량하중과 수평방향으로 작용하는 차량의 제동하중의 크기에 따른 포장체와 방수시트에 발생되는 응력을 산정하였다. 그리고 강상판 두께 및 강성. 포장층 두께, 차량제동하중, 온도 등의 변수가 포장체의 응력변화에 어떠한 영향을 미치는지에 대하여 분석하였다. 방수층의 전단응력은 강상판의 두께가 얇아지고 강성이 감소할수록 증가하였으며, 강상판의 두께가 150mm이상의 경우와 탄성계수가 $2{\times}10^{5}MPa$이상의 경우에는 그 영향이 미비하였다 또한 교면 포장의 두께가 얇아지고 온도가 낮아질수록 방수층의 전단응력이 증가하였다. 포장체 하부에서 발생하는 인장변형률은 고온에서 최대가 되었으며 두께가 증가할수록 감소하였다.

• 대한금속재료학회지
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• 제50권4호
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• pp.316-323
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• 2012

The aim of this study is to investigate the effect of post heat treatment on bonding properties of roll cladded Ti/MS/Ti materials. First grade Ti sheets and SPCC mild steel sheets were prepared and then Ti/MS/Ti clad materials were fabricated by a cold rolling and post heat treatment process. Microstructure and point analysis of the Ti/MS interfaces were performed using the SEM and EDX Analyser. Diffusion bonding was observed at the interfaces of Ti/MS. The thickness of the diffusion layer increased with post heat treatment temperature and the diffusion layer was verified as having $({\epsilon}+{\zeta})+({\zeta}+{\beta}-Ti)$ intermetallic compounds at $700^{\circ}C$ and an $({\zeta}+{\beta}-Ti)$ intermetallic compound at $800^{\circ}C$, respectively. The micro Knoop hardness of mild steel decreased with post heat treatment temperature; however, those of Ti decreased at a range of $500{\sim}600^{\circ}C$ and showed a uniform value until $800^{\circ}C$ and then increased rapidly up to $900^{\circ}C$. The micro Knoop hardness value of the diffusion layer increased up to $700^{\circ}C$ and then saturated with post heat treatment. A T-type peel test was used to estimate the bonding forces of Ti/Mild steel interfaces. The bonding forces decreased up to $800^{\circ}C$ and then increased slightly with post heat treatment. The optimized temperature ranges for post heat treatment were $500{\sim}600^{\circ}C$ to obtain the proper formability for an additional plastic deformation process.

• Restorative Dentistry and Endodontics
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• 제21권1호
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• pp.227-241
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• 1996

The effect of collagen dissolution in acid conditioned dentin was morphologically examined by both scanning and transmission electron microscopy. 18 freshly extracted human molars and dentin bonding systems of All Bond 2, Scotchbond Multipurpose, Superbond D-Liner were used in this study. For SEM preparation, each 3 of ~ exposed dentin surfaces were acid conditioned by using various acids within the above three bonding systems respectively. After acid conditioning of the other 3 exposed dentin surfaces as above, they were treated with 1.7% NaOCl for 2 minutes. The remaining 3 dentin surfaces were acid conditioned and treated with 3.3 % NaOCl for 2 minutes. All of the specimens were then fixed in 4 % glutaraldehyde for 12 h at $4^{\circ}C$ and dehydrated in ethanols grades from 50 % to 100 %, then surface changes of the specimens were observed by using SEM. For TEM preparation, exposed dentin surfaces were acid conditioned with the same acid as SEM specimens and treated with 1.7%, 3.3 % NaOCl respectively, then applied with corresponding bonding agents. After the procedures were finished, composite resin were applied on the dentin surfaces and light cured. Small, rectangular sticks with end dimensions of approximately 1 by 1 mm were sectioned and further sample preparative techniques for transmission electron microscopy were performed in accordance with the procedures used for ultrastructural TEM observations of calcified tissues. The results were as follows : 1. In the 1.7 % NaOCl retreated specimens after acid conditioning, the porous dentin surface of intertubular dentin and wide opening of dentinal tubules were appeared. And there were fine irregularities on the intertubular dentin, indicating a clear difference as compared with the acid conditioned specimens. 2. In the 3.3% NaOCl retreated specimens after acid conditioning, the intertubular dentin was further eroded causing a more porous and wider opening of dentinal tubules. Moreover, sharp irregularities on the intertubular dentin were more evident than those of acid conditioned and 1.7% NaOCl retreated specimens. 3. In all of the acid conditioned specimens, the resin-dentin hybrid layer of approximately 3.5mm thickness was formed and the collapsed collagen layer was observed on the uppermost part of hybrid layer in the specimens applied with All Bond 2. The collgen fibrils of intertubular dentin in specimens applied with Scotchbond Multipurpose were running perpendicular to the interface, and electron dense black layer demarcated from the deep unaltered dentin was more evident in the specimen applied with Superbond D-Liner than any other specimens. 4. In the 1.7 % NaOCl retreated specimens after acid conditioning, the resin-dentin hybrid layer of approximately 2.5-3.0mm thickness was formed and the collapsed collagen layer and longitudinally running collagen fibrils as shown in the acid conditioned specimens were observed in the specimens applied with All Bond 2 and Superbond D-Liner. 5. In all of the 3.3% NaOCl retreated specimens after acid conditioning, the evidence of resin-dentin hybrid layer was not identified ; nevertheless, the longitudinally running collagen fibrils remained slightly in the specimens applied with All Bond 2.

• 한국주조공학회지
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• 제17권4호
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• pp.371-378
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• 1997

The study for direct synthesis of TaC carbide which was a reaction product of tantalum and carbon in the cast iron was performed. Cast iron which has hypo-eutectic composition was cast bonded in the metal mold with tantalum thin sheet of thickness of $100{\mu}m$. The contents of carbon and silicon of cast iron matrix was controlled to have constant carbon equivalent of 3.6. The chracteristics of microstructure and the formation mechanism of TaC carbide in the interfacial reaction layer in the cast iron/tantalum thin sheet heat treated isothermally at $950^{\circ}C$ for various time were examined. TaC carbide reaction layer was grown to the dendritic morphology in the cast iron/tantalum thin sheet interface by the isothermal heat treatment. The composition of TaC carbide was 48.5 at.% $Ti{\sim}48.6$ at.% C-2.8 at.% Fe. The hardness of reaction layer was MHV $1100{\sim}1200$. The thickness of reaction layer linearly increased with increasing the total content of carbon in the cast iron matrix and isothermal heat treating time. The growth constant for TaC reaction layer was proportional to the log[C] of the matrix. The formation mechanism of TaC reaction layer at the interface of cast iron/tantalum thin sheet was proved to be the interfacial reaction.

• 한국재료학회지
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• 제34권3호
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• pp.163-169
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• 2024

As the limitations of Moore's Law become evident, there has been growing interest in advanced packaging technologies. Among various 3D packaging techniques, Cu-SiO₂ hybrid bonding has gained attention in heterogeneous devices. However, certain issues, such as its high-temperature processing conditions and copper oxidation, can affect electrical properties and mechanical reliability. Therefore, we studied depositing only a heterometal on top of the Cu in Cu-SiO₂ composite substrates to prevent copper surface oxidation and to lower bonding process temperature. The heterometal needs to be deposited as an ultra-thin layer of less than 10 nm, for copper diffusion. We established the process conditions for depositing a Co film using a Co(EtCp)₂ precursor and utilizing plasma-enhanced atomic layer deposition (PEALD), which allows for precise atomic level thickness control. In addition, we attempted to use a growth inhibitor by growing a self-assembled monolayer (SAM) material, octadecyltrichlorosilane (ODTS), on a SiO₂ substrate to selectively suppress the growth of Co film. We compared the growth behavior of the Co film under various PEALD process conditions and examined their selectivity based on the ODTS growth time.

• 소성∙가공
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• 제20권2호
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• pp.140-145
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• 2011

The aim of the present study is to derive optimized post heat treatment temperatures to get a proper formability for Ti/STS409L/Ti clad materials. These clad materials were fabricated by cold rolling followed by a post heat treatment process for 10 minutes at temperatures ranging from $500^{\circ}C$ to $850^{\circ}C$. The microstructure of the interface was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersive X-ray Analyser(EDX) in order to investigate the effects of post heat treatment on the bonding properties of the Ti/STS409L/Ti clad materials. Diffusion bonding was observed at the interfaces with a diffusion layer thickness increasing with the post heat treatment temperature. The diffusion layer was composed of a type of(${\varepsilon}+{\zeta}$) intermetallic compound containing additional elements, namely, Fe, Ti and Ni. The micro Knoop hardness of the Ti/STS409L interfaces was found to increase with heat treatment up to $800^{\circ}C$ and then decrease for temperatures rising up to $850^{\circ}C$. The tensile strength was shown to decrease for heat treatment temperature increasing to $750^{\circ}C$ and then increase rapidly for temperature rising up to $850^{\circ}C$. A post heat treatment temperature range of $700{\sim}750^{\circ}C$ was found to optimize the formability of Ti/STS409L/Ti clad materials.

• Journal of Welding and Joining
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• 제19권3호
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• pp.305-310
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• 2001

UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

• Structural Engineering and Mechanics
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• 제87권2호
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• pp.107-116
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• 2023

The three-dimensional Hashin criterion and user subroutine VUMAT were used to simulate the damage in the composite layer, and the secondary stress criterion was used to simulate the interlayer failure of the cohesive element of the bonding layer and the propagation characteristics under the layer. The results showed that when the shear stress wave (shear wave) propagates on the surface of the laminate, the stress wave attenuation along the fiber strength direction is small, and thus producing a large stress profile. When the compressive stress wave (longitudinal wave) is transmitted between the layers, it is reflected immediately instead of being transmitted immediately. This phenomenon occurs only when the energy has accumulated to a certain degree between the layers. The transmission of longitudinal waves is related to the thickness and the layer orientation. Along the symmetry across the thickness direction, the greater is the stress amplitude along the layer direction. Based on the detailed investigation on the impact on various laminated composites carried out in this paper, the propagation characteristics of stress waves, the damage and the destruction of laminates can be explained from the perspective of stress waves and a reasonable layering sequence of the composite can be designed against damage and failure from low velocity impact.

• 센서학회지
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• 제23권4호
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• pp.234-237
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• 2014

In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.

• 대한소아치과학회지
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• 제30권4호
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• pp.581-592
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• 2003

본연구는 유치와 영구치의 우식상아질을 제거하는 방법에 따른 상아질표면의 변화와 산부식양상, 혼성층의 양상, 그리고 이들이 상아질에 대한 복합레진의 전단결합강도에 미치는 영향을 평가할 목적으로 시행되었다. 92개의 유구치와 92개의 영구 구치를 준비하여 상아질 표면을 노출시키고 인공우식을 유발시켰다. 이중 32개의 유구치와 32개의 영구구치는 $Carisolv^{TM}$과 bur로 삭제후 상아질표면을 SEM관찰하였으며 나머지 치아에서는 레진-상아질간 전단결합강도를 측정하였다. 두가지 접착시스템(Single bond system, self-etching bonding system)과 한 종류의 레진(Z250, 3M)을 사용하였으며 다음과 같은 결과를 얻었다. 1. $Carisolv^{TM}$의 우식치질 제거효과는 영구치보다 유치에서 더 우수하였으며, bur로 제거한 경우보다 더 거친 상아질 표면이 관찰되었다. 2. 산부식처리한 경우 유치와 영구치 모두 우식제거방법과 관계없이 도말층이 제거된 양상을 보였다. 3. Single bond system을 이용한 경우 두터운 $2-4{\mu}m$의 혼성층과 $10-15{\mu}m$의 adhesive layer가 관찰된 반면, self-etching bonding system에서는 비교적 얇은($1-2{\mu}m$) 혼성층만이 형성되었다. 4. 전단결합강도는 유치와 영구치 모두 우식제거방법에 관계없이 Single bonding agent를 적용한 경우에 self-etching bonding agent를 적용한 군보다 유의하게 높게 나타났다(P<0.05). 5. $Carisolv^{TM}$와 self-etching bonding agent 처리군에서 bur와 self-etching system 처리군보다 다소 높은 전단결합강도를 보였으나 유의성은 없었다(P>0.05).