• Restorative Dentistry and Endodontics
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• 제23권1호
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• pp.304-315
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• 1998

The purpose of this study was to evaluate the microleakage of light cured glass ionomer restorative materials in class 5 cavities. In this in vitro study, class 5 cavities were prepared on buccal and lingual surfaces of forty extracted human premolars and molars on cementum margin. These specimen were randomly divided into four groups of 10 each : Group 1 was Fugi II (control), Group 2 was Fugi II LC, Group 3 was Vitremer, and Group 4 was Dyract. Group 2 was also divided once more into 2 groups of 5 each : Group 2-1 was pretreated with dentin conditioner and Group 2-2 was not. All teeth were restored according to the manufacturer's instructions. After 500 thermocycling between $5^{\circ}C$ and $55^{\circ}C$, the 40 teeth were placed in 2 % Methylene blue dye for 24hr, then rinsed with tab water. The specimen were embedded in clear resin, then sectioned buccolingually through the center of restoration with a low speed diamond saw. The dye penetration on each of the specimen were then observed with a stereomicroscope at 20. The results of the study were statistically analyzed using the Student-Newman-Keuls Methods and the Mann-Whitney Rank Sum Test. Tooth restorative interfaces were evaluated using SEM analysis. Results were as follows, 1. Compared to conventional glass ionomer restoratioqs, all light cured glass ionomer restorations were fairly resistant to microleakage (P<0.05). 2. Groups 3 (Vitremer) and Group 4 (Dyract) were found to be the most resistant, Group 2 (Fugi II LC) fairly resistant, and Group 1 (Fugi II) least resistant to microleakage(P<0.05). 3. No significant differences were found between Group 2-1 and Group 2-2 (P>0.08). 4. With the backscattered SEM analysis, the degrees to which tight bonding occurred were also observed in all the groups except for Group 1. Group 4 showed the highest degree of tight bonding than any other materials used in this study.

• 대한금속재료학회지
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• 제50권12호
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• pp.939-948
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• 2012

A 3-ply clad metal consisting of aluminum and copper was fabricated by roll bonding process and the microstructures and mechanical properties of the roll-bonded and post-roll-bonding heat treated Cu/Al/Cu clad metal were investigated. A brittle interfacial reaction layer formed at the Cu/Al interfaces at and above $400^{\circ}C$. The thickness of the reaction layer increased from $12{\mu}m$ at $400^{\circ}C$ to $28{\mu}m$ at $500^{\circ}C$. The stress-strain curves demonstrated that the strength decreased and the ductility increased with heat treatment up to $400^{\circ}C$. The clad metal heat treated at $300^{\circ}C$ with no indication of a reaction layer exhibited an excellent combination of the strength and ductility and no delamination of layers up to final fracture in the tensile testing. Above $400^{\circ}C$, the ductility decreased rasxpidly with little change of strength, reflecting the brittle nature of the intermetallic interlayers. In Cu/Al/Cu clad heat treated above $400^{\circ}C$, periodic parallel cracks perpendicular to the stress axis were observed at the interfacial reaction layer. In-situ optical microscopic observation revealed that cracks were formed in the Cu layer due to the strain concentration in the vicinity of horizontal cracks in the intermetallic layer, promoting the premature fracture of Cu layer. Vertical cracks parallel to the stress axis were also formed at 15% strain at $500^{\circ}C$, leading to the delamination of the Cu and Al layers.

• 열처리공학회지
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• 제36권2호
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• pp.61-68
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• 2023

Ti and Ti alloys are used in the automobile and aerospace industries due to their high specific strength and excellent corrosion resistance. However their application is limited due to poor formability at room temperature and high unit cost. In order to overcome these issues, dissimilarly jointed materials, such as cladding materials, are widely investigated to utilize them in each industrial field because of an enhanced plasticity and relatively low cost. Among various dissimilar bonding processes, the rolled cladding process is widely used in Ti alloys, but has a disadvantage of low bonding strength. Although this problem can be solved through post-heat treatment, the mechanical properties at the bonded interface are deteriorated due to residual stress generated during post-heat treatment. Therefore, in this study, the microstructure change and residual stress trends at the interfaces of Ti/Al cladding materials were studied with increasing post-heat treatment temperature. As a result, compared to the as-rolled specimens, no difference in microstructure was observed in the specimens after postheat treatment at 300, 400, and 500℃. However, a new intermetallic compound layer was formed between Ti and Al when post-heat treatment was performed at a temperature of 600℃ or higher. Then, it was also confirmed that compressive residual stress with a large deviation was formed in Ti due to the difference in thermal expansion coefficient and modulus of elasticity between Ti Grade II and Al 1050.

• Korean Chemical Engineering Research
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• 제45권5호
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• pp.479-486
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• 2007

BCB 수지를 이용하여 본딩한 웨이퍼의 BCB 두께, 본딩 촉진제의 사용여부 및 이웃하는 적층 물질의 종류에 따른 본딩 결합력에 대한 영향을 4-점 굽힘방법을 이용하여 규명한다. 실험결과 본딩 결합력은 BCB 두께에 선형 비례하는데, 이는 BCB의 소성 변형의 정도가 두께에 비례하는 반면에 BCB의 항복 강도에는 영향을 미치지 않기 때문이다. 본딩한 BCB의 두께가 각각 $2.6{\mu}m$ 및 $0.4{\mu}m$인 경우에 대하여 본딩 촉진제를 사용 했을 때, 본딩 촉진제와 본딩된 물질의 표면에서는 공유 결합이 형성되기 때문에 본딩 결합력이 증가한다. 산화 규소막이 증착된 실리콘 웨이퍼와 BCB 사이 계면에서의 본딩 결합력은 글래스 웨이퍼와 BCB 사이의 계면에서 보다 약 3배 정도 높다. 이러한 본딩 결합력의 차이는 각 계면에서 Si-O 본드의 본딩 밀도 및 본드 파단 에너지의 차이에 기인한다. PECVD 산화 규소막을 증착한 실리콘 웨이퍼와 BCB 사이 계면의 경우, 기 측정된 $18J/m^2$ 및 $22J/m^2$의 본드 파단 에너지를 얻기 위해 각각 약 $12{\sim}13bonds/nm^2$ 및 $15{\sim}16bonds/nm^2$의 Si-O 본드 밀도가 필요하다. 반면에, 글래스 웨이퍼와 BCB 사이 계면의 경우에는 기 측정된 $5J/m^2$의 본드 파단 에너지를 얻기 위해 약 $7{\sim}8bonds/nm^2$의 Si-O 본드 밀도가 필요하다.

• 한국진공학회지
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• 제8권4B호
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• pp.514-518
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• 1999

Gold (Au) is not supposed to react with sapphire(single crystalline ) under thermodynamic equillibrium, therefore, a strong adhesion between these two dissimilar materials is not expected. However, pull test showed that the gold film sputter-deposited onto annealed and pre-sputtered sapphire exhibited very strong adhesion even without post-deposition annealing. Strongly and weakly adhered samples as a result of the pull testing were selected to investigate the adhesion mechanisms with Auger electron spectroscopy. The Au/ interfaces were analyzed using a new technique that probes the interface on the film using Auger electron escape depth. It revealed that one or two monolayers of Au-Al-O compound formed at the Au/Sapphire interface when AES in the UHV chamber. It showed that metallic aluminum was detected on the surface of sapphire substrates after irradiating for 3 min. with 7keV Ar+ -ions. These results agree with TRIM calculations that yield preferential ion-beam etching. It is concluded that the formation of Au-Al-O compound, which is responsible for the strong metal-ceramic bonding, is due to ion-induced cleaning and reduction of the sapphire surface, and the kinetic energy of depositing gold atoms, molecules, and micro-particles as a driving force for the inter-facial reaction.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 추계학술대회 논문집 학회본부
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• pp.348-351
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• 1995

A modified silicon direct bonding method has been developed alloying an intimate contact between grooved and smooth mirror-polished oxide-free silicon wafers. A regular set of grooves was formed during preparation of heavily doped $p^+$-type grid network by oxide-masking und boron diffusion. Void-free bonded interfaces with filing of the grooves were observed by x-ray diffraction topography, infrared, optical. and scanning electron microscope techniques. The presence of regularly formed grooves in bending plane results in the substantial decrease of dislocation over large areas near the interface. Moreover two strongly misoriented waters could be successfully bonded by new technique. Diodes with bonded a pn-junction yielded a value of the ideality factor n about 1.5 and the uniform distribution of series resistance over the whole area of horded pn-structure. The suitability of the modified technique was confirmed by I - V characteristics of power diodes and reversly switched-on dynistor(RSD) with a working area about $12cm^2$. Both devices demonstrated breakdown voltages close to the calculation values.

• 한국표면공학회지
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• 제46권1호
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• pp.22-28
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• 2013

$WS_2$ particles were added to micro-diamond blades with Cu/Sn binding metal as lubricants to improve cutting efficiency. It was found in previous works that the added $WS_2$ lubricant could reduce remarkably the momentary energy consumption during dicing tests but increased wear rate slightly owing to weak bonding between lubricant particles and bond metals. In the present work, the surface of $WS_2$ lubricant particles were etched for activating the surface of $WS_2$ particles that provide even distribution of particles during powder mixing process and improvement of wetting at the interfaces between $WS_2$ particles and molten Cu/Sn bond metals during pressurized sintering so that could provide the improved strength of micro-blades and result in extended life. Chipping behavior of workpiece with the types of micro-blades including $WS_2$ were compared because it is important in semiconductor and micro-packaging industries to control average roughness and straightness of sliced surface which is closely related with quality.

• Bulletin of the Korean Chemical Society
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• 제32권1호
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• pp.196-200
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• 2011

In this work, poly(methyl methacrylate) (PMMA) was grafted onto amine treated graphite nanosheets ($NH_2$-GNs) and the surface characteristics and physical properties of the $NH_2$-GNs-g-PMMA films were investigated. The graft reaction of $NH_2$-GNs and PMMA was confirmed from the shift of the $N_{1S}$ peak, including amine oxygen and amide oxygen, by X-ray photoelectron spectroscopy (XPS). The surface characteristics of the $NH_2$-GNs-g-PMMA films were measured as a function of the $NH_2$-GN content using the contact angle method. It was revealed that the specific component of the surface free energy (${\gamma}s$) of the films was slightly increased as the $NH_2$-GN content increased. Also, the thermal and mechanical properties of the $NH_2$-GNs-g-PMMA films were enhanced with the addition of $NH_2$-GNs. This can be attributed to the chemical bonding caused by the graft reaction between the $NH_2$-GNs and the PMMA matrix.

• Structural Engineering and Mechanics
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• 제61권1호
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• pp.125-142
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• 2017

Extensive research work has been performed on shear strengthening of reinforced concrete (RC) beams retrofitted with externally bonded carbon fiber reinforced polymer (CFRP) in form of strips. However, most of this research work is experimental and very scarce studies are available on numerical modelling of such beams due to truly challenging nature of modelling concrete shear cracking and interfacial interaction between components of such beams. This paper presents an appropriate model for RC beam and to simulate its cracking without numerical computational difficulties, convergence and solution degradation problems. Modelling of steel and CFRP and their interfacial interaction with concrete are discussed. Finally, commercially available non-linear finite element software ABAQUS is used to validate the developed finite element model with key tests performed on full scale T-beams with and without CFRP retrofitting, taken from previous extensive research work. The modelling parameters for bonding behavior of CFRP with special anchors are also proposed. The results presented in this research work illustrate that appropriate modelling of bond behavior of all the three types of interfaces is important in order to correctly simulate the shear behavior of RC beams strengthened with CFRP.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.509-510
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• 2007

The Breakdown properties of epoxy composites are used for transformers and sensor, which has been studied. As a result, From the measurements of breakdown voltage, the more hardener is increased the stronger breakdown strength at low temperature because the ester of hardener is increased. Breakdown strength at the high temperature is decreased because the temperature at $110^{\circ}C$ is near at $T_g$. When the filler is added, between epoxy and silica is formed interface. Therefore the charge is accumulated in it, and the electric field is concentrated, and breakdown strength is decreased than non-filled specimens. In the case of specimens, the treated with silane, the breakdown strength becomes much higher since this is suggested that silane coupling agent has been improved chemical bonding in the interfaces and has been relaxed the electric filed concentration.