• 제목/요약/키워드: Bonding Interface Property

검색결과 37건 처리시간 0.03초

삽입금속 Cu를 적용한 TiAl 합금과 SCM440의 마찰용접 계면의 나노역학물성 평가 (Evaluating Nanomechanical Properties on Interface of Friction-welded TiAl and SCM440 Alloys with Cu as an Insert Metal)

  • 김기영;오명훈;최인철
    • 열처리공학회지
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    • 제34권6호
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    • pp.309-314
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    • 2021
  • Due to the superior corrosion resistance and mechanical properties of TiAl alloy at high temperature, it has been utilized as a turbine wheel of a turbocharger. The dissimilar metallic bonding is usually applied to combine the TiAl turbine wheel with the SCM440 structural steel which is used as a driving shaft. In this study, the TiAl and SCM440 joint were fabricated by using a friction welding technique. During bonding process, to suppress the martensitic transformation and the formation of cracks, which might reduce a strength of the joints, Cu was used as an insert metal to relieve stress. As a result, the intermetallic compounds (IMCs) layer was observed at TiAl/Cu interface while no IMC formation was formed at SCM440/Cu interface. Since understanding of the IMCs effects on the mechanical performance of welded joint is also essential for ensuring the reliability and integrity of the turbocharger system, we estimated the nanohardness of welded joint region through nanoindentation. The relation between the microstructural feature and its mechanical property is discussed in detail.

Au 스터드 범프와 Sn-3.5Ag 솔더범프로 플립칩 본딩된 접합부의 미세조직 및 기계적 특성 (Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder)

  • 이영규;고용호;유세훈;이창우
    • Journal of Welding and Joining
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    • 제29권6호
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    • pp.65-70
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    • 2011
  • The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

A Meshfree procedure for the microscopic analysis of particle-reinforced rubber compounds

  • Wu, C.T.;Koishi, M.
    • Interaction and multiscale mechanics
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    • 제2권2호
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    • pp.129-151
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    • 2009
  • This paper presents a meshfree procedure using a convex generalized meshfree (GMF) approximation for the large deformation analysis of particle-reinforced rubber compounds on microscopic level. The convex GMF approximation possesses the weak-Kronecker-delta property that guarantees the continuity of displacement across the material interface in the rubber compounds. The convex approximation also ensures the positive mass in the discrete system and is less sensitive to the meshfree nodal support size and integration order effects. In this study, the convex approximation is generated in the GMF method by choosing the positive and monotonic increasing basis function. In order to impose the periodic boundary condition in the unit cell method for the microscopic analysis, a singular kernel is introduced on the periodic boundary nodes in the construction of GMF approximation. The periodic boundary condition is solved by the transformation method in both explicit and implicit analyses. To simulate the interface de-bonding phenomena in the rubber compound, the cohesive interface element method is employed in corporation with meshfree method in this study. Several numerical examples are presented to demonstrate the effectiveness of the proposed numerical procedure in the large deformation analysis.

온실기초의 구조물-지반 상호작용 해석을 위한 유한요소 모델링 (Finite element modeling for structure-soil interaction analysis of plastic greenhouse foundation)

  • 류희룡;조명환;유인호;문두경
    • 농업과학연구
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    • 제41권4호
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    • pp.455-460
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    • 2014
  • In this study, structural behavior of plastic greenhouse foundation was investigated using rational finite element modeling for structures which have different material properties each other. Because the concrete foundation of plastic greenhouse and soil which surround and support the concrete foundation have very different material property, the boundary between two structures were modeled by a interface element. The interface element was able to represent sliding, separation, uplift and re-bonding of the boundary between concrete foundation and soil. The results of static and dynamic analysis showed that horizontal and vertical displacement of concrete foundation displayed a decreasing tendency with increasing depth of foundation. The second frequency from modal analysis of structure including foundation and soil was estimate to closely related with wind load.

Ti/STS409L/Ti 냉연 클래드재의 접합계면특성에 미치는 후열처리의 영향 (Effect of Post Heat Treatment on Bonding Interfaces in Ti/STS409L/Ti Cold Rolled Clad Materials)

  • 배동수;김원중;엄성찬;박준형;이상필;김민중;강창룡
    • 소성∙가공
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    • 제20권2호
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    • pp.140-145
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    • 2011
  • The aim of the present study is to derive optimized post heat treatment temperatures to get a proper formability for Ti/STS409L/Ti clad materials. These clad materials were fabricated by cold rolling followed by a post heat treatment process for 10 minutes at temperatures ranging from $500^{\circ}C$ to $850^{\circ}C$. The microstructure of the interface was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersive X-ray Analyser(EDX) in order to investigate the effects of post heat treatment on the bonding properties of the Ti/STS409L/Ti clad materials. Diffusion bonding was observed at the interfaces with a diffusion layer thickness increasing with the post heat treatment temperature. The diffusion layer was composed of a type of(${\varepsilon}+{\zeta}$) intermetallic compound containing additional elements, namely, Fe, Ti and Ni. The micro Knoop hardness of the Ti/STS409L interfaces was found to increase with heat treatment up to $800^{\circ}C$ and then decrease for temperatures rising up to $850^{\circ}C$. The tensile strength was shown to decrease for heat treatment temperature increasing to $750^{\circ}C$ and then increase rapidly for temperature rising up to $850^{\circ}C$. A post heat treatment temperature range of $700{\sim}750^{\circ}C$ was found to optimize the formability of Ti/STS409L/Ti clad materials.

고온 프레스법에 의한 TiNi/Al2024 복합재료의 제조 및 기계적 특성평가 (Fabrication and Mechanical Properties of TiNi/Al2024 Composites by Hot-Press Method)

  • 손용규;배동수;박영철;이규창
    • 소성∙가공
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    • 제18권1호
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    • pp.45-51
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    • 2009
  • Shape memory alloy has been used to improve the tensile strength of composite by the occurrence of compressive residual stress in matrix using its shape memory effect. In order to fabricate shape memory alloy composite, TiNi alloy fiber and Al2024 sheets were used as reinforcing material and matrix, respectively. In this study, TiNi/Al2024 shape memory alloy composite was made by using hot press method. In order to investigate bonding condition between TiNi reinforcement and Al matrix, the micro-structure of interface was observed by using optical microscope and diffusion layer of interface was measured by using Electron Probe Micro Analyser. And the mechanical properties of composite with three parameters(volume fraction of fiber, cold rolling amount and test temperature) were obtained by tensile test. The most optimum bonding condition for fabrication the TiNi/Al2024 composite material was obtained as holding for 30min. under the pressure of 60MPa at 793K. The strength of composite material increased considerably with the volume fraction of fiber up to 7.0%. And the tensile strength of this composite increased with the reduction ratio and it also depends on the volume fraction of fiber.

폴리머 시멘트 몰탈의 철근 부착특성 평가 (Bond Properties of Polymer Cement Mortar to Reinforced Steel Bar)

  • 박동천;조규환
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2013년도 추계 학술논문 발표대회
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    • pp.106-107
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    • 2013
  • The purpose of this study is to characterize the bonding properties between reinforced bar and re-emulsion polymer cement mortar through the pull off test. The properties of polymer cement mortar before and after hardening were measured. Spiral reinforced steel bar was used to control the brittleness fracture of test specimens. In addition polymer content as experimental factors, the types of reinforced bar and corrosion were considered as well. Non linear FEM analysis was carried out to expect the behavior of bonding interface under the certain load.

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금속/세라믹 계면 물성 분석 (Metal/ceramic Interface Mechanical Property Analysis)

  • 김송희;강형석
    • 산업기술연구
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    • 제24권A호
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    • pp.9-15
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    • 2004
  • The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

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물-시멘트비 및 혼화재 혼입에 따른 철근콘크리트의 부착 특성에 관한 연구 (Experimental Study on Bonding Properties of Reinforced Concrete with Water-Cement Ratio and Blending of Mineral Admixture)

  • 최윤석;김명유;양은익;이성태
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2006년도 춘계 학술발표회 논문집(II)
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    • pp.225-228
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    • 2006
  • To clarify the one body behavior of reinforcing bar and concrete, it is important to investigate bond characteristics between two materials. Bond strength is decided by applied force and interface area between reinforcing bar and concrete. And, the resultant force of chemical adhesive force, frictional force, and mechanical interaction are to be main factors. Property of concrete influences on chemical adhesive force and frictional force; bond strength is decreased by corrosion of reinforcing bar, as the result, durability is also decreased. In this study, to confirm bond characteristics with property of concrete, w/c ratio and blending of mineral admixture were selected as the main test parameters. The results obtained from this study will be used as the basic data for bond characteristics with corrosion.

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압연 클래드된 Ti/Mild steel/Ti 재의 계면확산층과 접합력에 미치는 후열처리온도의 영향 (Effect of Post Heat Treatment Temperature on Interface Diffusion Layer and Bonding Force in Roll Cladded Ti/Mild steel/Ti Material)

  • 이상목;김수민;위세나;배동현;이근안;이종섭;김용배;배동수
    • 대한금속재료학회지
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    • 제50권4호
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    • pp.316-323
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    • 2012
  • The aim of this study is to investigate the effect of post heat treatment on bonding properties of roll cladded Ti/MS/Ti materials. First grade Ti sheets and SPCC mild steel sheets were prepared and then Ti/MS/Ti clad materials were fabricated by a cold rolling and post heat treatment process. Microstructure and point analysis of the Ti/MS interfaces were performed using the SEM and EDX Analyser. Diffusion bonding was observed at the interfaces of Ti/MS. The thickness of the diffusion layer increased with post heat treatment temperature and the diffusion layer was verified as having $({\epsilon}+{\zeta})+({\zeta}+{\beta}-Ti)$ intermetallic compounds at $700^{\circ}C$ and an $({\zeta}+{\beta}-Ti)$ intermetallic compound at $800^{\circ}C$, respectively. The micro Knoop hardness of mild steel decreased with post heat treatment temperature; however, those of Ti decreased at a range of $500{\sim}600^{\circ}C$ and showed a uniform value until $800^{\circ}C$ and then increased rapidly up to $900^{\circ}C$. The micro Knoop hardness value of the diffusion layer increased up to $700^{\circ}C$ and then saturated with post heat treatment. A T-type peel test was used to estimate the bonding forces of Ti/Mild steel interfaces. The bonding forces decreased up to $800^{\circ}C$ and then increased slightly with post heat treatment. The optimized temperature ranges for post heat treatment were $500{\sim}600^{\circ}C$ to obtain the proper formability for an additional plastic deformation process.