• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.4
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• pp.354-361
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• 2008

Cold rolled steel sheet for automotive was treated by Ar/$O_2$ atmospheric pressure plasma to improve the adhesive bonding strength. Through the contact angle test and calculation of surface free energy for cold rolled steel sheet, the changes of surface properties were investigated before and after plasma treatment. The contact angle was decreased and surface free energy was increased after plasma treatment. And the change of surface roughness and morphology were observed by AFM(Atomic Force Microscope). The surface roughness of steel sheet was slightly changed. Based on Taguchi method, single lap shear test was performed to investigate the effect of experimental parameter such as plasma power, treatment time and flow rate of $O_2$ gas. Results shows that the bonding strength of steel sheet treated in Ar/$O_2$ atmospheric pressure plasma was improved about 20% compared with untreated sheet.

• Design & Manufacturing
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• v.13 no.4
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.7-11
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• 2013

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during bonding. For advanced microchips the use of Cu based wire is risky because the ultrasonic stresses can cause chip damage. This risk needs to be managed by e.g. the use of ultrasound during the impact stage of the ball on the pad ("pre-bleed") as it can reduce the strain hardening effect, which leads to a softer deformed ball that can be bonded with less ultrasound. To find the best profiles of ultrasound during impact, a numerical model is reported for ultrasonic bonding with capillary dynamics combined with a geometrical model describing ball deformation based on volume conservation and stress balance. This leads to an efficient procedure of ball bond modelling bypassing plasticity and contact pairs. The ultrasonic force and average stress at the bond zone are extracted from the numerical experiments for a $50{\mu}m$ diameter free air ball deformed by a capillary with a hole diameter of $35{\mu}m$ at the tip, a chamfer diameter of $51{\mu}m$, a chamfer angle of $90^{\circ}$, and a face angle of $1^{\circ}$. An upper limit of the ultrasonic amplitude during impact is derived below which the ultrasonic shear stress at the interface is not higher than 120 MPa, which can be recommended for low stress bonding.

• Journal of Technologic Dentistry
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• v.38 no.3
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• pp.175-183
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• 2016

Purpose: Observation of Oxide Film Formation and Bonding Strength according to surface treatment of Co-Cr Alloy for porcelain fused to Metal. Methods: metal specimens $0.5mm{\times}25mm{\times}4mm$ in size were made using Co-Cr alloys for porcelain fused to metal crown (Heraenium P, Tae jung Medis). Dental porcelain $0.5mm{\times}25mm{\times}4mm$ in size was sintered on the metal specimens after changing the etching time, sandblasting condition, and heat treatment temperature. Subsequently, the bonding strength was compared by the three-point flexural strength test using a universal testing machine (UTM) to observe the fracture surface and oxidized layers. Results: With regard to the experimental group treated with acid-etching, Specimen 1 treated for 25 minutes (B-3) showed the highest bonding strength, and Specimen 2 treated only with sandblasting showed the most excellent bonding force at 3.5 bar (C-3). With regard to the experimental group treated with sandblasting at 3.5 bar after acid-etching for 25 minutes, Specimen 3 with heat treatment at $980^{\circ}C$ (D-3) showed the highest bonding strength. Conclusion: The specimen which went through both sandblasting and etching, showed an excellent ceramicmetal bond strength.

• Transactions on Electrical and Electronic Materials
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• v.10 no.5
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• pp.156-160
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• 2009

In an ultrasonic motor, a piezoelectric ceramic material forms the active element which vibrates the stator, thus initiating the rotational motion. In the operation of ultrasonic motors, many factors exist that can affect the resonance characteristics of the piezoelectric ceramic component. For examples, these factors are the bonding conditions with the piezoelectric element, the magnitude of the input voltage, the normal force in the frictional drive and the emission of heat due to vibration and friction etc. Therefore, it is important to research properly the inclination for variation of piezoelectric ceramics in the circumstance where complex elements are involved. In this paper, we focus on the analysis of the resonance characteristics of an ultrasonic motor as a function of the magnitude of the input voltage and the normal force.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.1
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• pp.105-112
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• 2013

This paper presents the structural design and finite element analysis of precision stage based on a double triangular parallel mechanism for precision positioning and large force generation. Recently, with the acceleration of miniaturization in mobile appliances, the demand for precision aligning and bonding has been increasing. Such processes require both high precision and large force generation, which are difficult to obtain simultaneously. This study aimed at constructing a precision stage that has high precision, long stroke, and large force generation. Actuators were tactically placed and flexure hinges were carefully designed by optimization process to constitute a parallel mechanism with a double triangular configuration. The three actuators in the inner triangle function as an in-plane positioner, whereas the three actuators in the outer triangle as an out-of-plane positioner. Finite element analysis is performed to validate load carrying performances of the developed precision stage.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.225-226
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• 2008

• Journal of Welding and Joining
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• v.15 no.4
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• pp.90-98
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• 1997

A copper-tungsten sintered alloy(Cu-W) has been friction welded to a tough pitch copper in order to investigate the effect of friction pressure on bonding strength and a charicteristic of fracture. The tensile strength of the friction welded joint was increased up to 90% of the Cu base metal under the condition of friction time 1.2 sec, friction pressure 4.5kgf/$\textrm{mm}^2$ and upset pressure 10kgf/$\textrm{mm}^2$. From the results of fracture surface analysis, the increase of friction pressure could remarkably decrease the force and the time to be normally acted on weld interface. The W particles which were included in the plastic zone of Cu side could induce fracture adjacent to the weld interface because their existance in Cu induces a decrease in available section area and an increase in notch effect. Therefore, the tensile strength was decreased at high friction pressure (6kgf/$\textrm{mm}^2$) because the destruction of W was increased by an increase in mechanical force and crack was formed at weld interface.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.8
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• pp.607-614
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• 2007

This paper investigated that the functional group and chemical structure of additives affect ice adhesion in aqueous solutions cooling with stirring. In order to compare the effect on the ice adhesion in aqueous solutions, the functional group like carboxyl (-COOH), hydroxyl(-OH) or amine($-NH_{2}$) one were compared each other. Among the functional group, the strength of the hydrogen bonding force order is amine, hydroxyl and carboxyl one. It supports that ethylene diamine 7 mass% solution including amine group was effective to suppress the ice adhesion, though it is corrosive. Also, the ice adhesion were effectively resisted and formed lots of ice slurries in cooling experiment of 7 mass% solution of 1, 2-and 1, 3-propanediol which is different molecular structure but equal molecular weight each other.

• Bulletin of the Korean Chemical Society
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• v.29 no.10
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• pp.1951-1959
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• 2008

Pentamer cluster of azodicarbonamide (ADA) based on the crystalline structure was investigated for the equilibrium structure, the stabilization energies, and the vibrational properties at various levels of the density functional theory. Stretching force constants of N${\cdot}{\cdot}{\cdot}$H or O${\cdot}{\cdot}{\cdot}$H, and angle-bending force constants of N-H${\cdot}{\cdot}{\cdot}$N or N-H${\cdot}{\cdot}{\cdot}$O for intermolecular hydrogen bonds in the pentamer cluster were obtained in 0.2-0.5 mdyn/$\AA$ and 1.6-2.0 mdyn$\AA$, respectively. The geometry of central ADA molecule fully hydrogen bonded with other four molecules shows good coincidence to the crystalline structure except the bond distances of N-H. Calculated Raman and infrared spectra of central ADA molecule in cluster represent well the experimental spectra of ADA obtained in the solid state compared to a single molecule. Detailed structural and vibrational properties of central ADA molecule in the pentamer cluster are presented.