• Title/Summary/Keyword: Bonded material

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Interfacial stresses in RC beam bonded with a functionally graded material plate

  • Daouadji, Tahar Hassaine;Chedad, Abdebasset;Adim, Belkacem
    • Structural Engineering and Mechanics
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    • v.60 no.4
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    • pp.693-705
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    • 2016
  • Functionally graded material (FGM) plates can be bonded to the soffit of a beam as a means of retrofitting the RC beam. In such plated beams, tensile forces develop in the bonded plate and these have to be transferred to the original beam via interfacial shear and normal stresses. In this paper, an interfacial stress analysis is presented for simply supported concrete beam bonded with a functionally graded material FGM plate. This new solution is intended for application to beams made of all kinds of materials bonded with a thin plate, while all existing solutions have been developed focusing on the strengthening of reinforced concrete beams, which allowed the omission of certain terms. It is shown that both the normal and shear stresses at the interface are influenced by the material and geometry parameters of the composite beam. This research is helpful for the understanding on mechanical behavior of the interface and design of the FGM-RC hybrid structures.

Bond Strength Characteristics of Bonded Concrete Overlay (접착식 콘크리트 덧씌우기의 부착강도 특성 분석)

  • Park, Jong Won;Kim, Young Kyu;Lee, Seung Woo;Han, Seung Hwan
    • International Journal of Highway Engineering
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    • v.15 no.4
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    • pp.1-9
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    • 2013
  • PURPOSES : Bonded concrete overlay is a favorable maintenance method since the material properties are similar to existing concrete pavements. In addition, bonded concrete overlay has advantage of structural performance since the overlay layer and the existing pavement perform as a monolithic layer. It is important to have suitable bond strength criteria to secure the performance of bonded concrete overlay. This study aimed to investigate the factors influencing bond strength characteristics between existing concrete pavement and overlay material. METHODS: Bond strength between overlay and existing pavement are measured and analyzed for various conditions such as the type of overlay materials, compressive and flexure strength of overlay and existing pavement, and deterioration status of existing pavement. RESULTS: The strength of overlay material does not significantly influence the bond strength. The overlay of ultra-rapid hardening cement generally gives low bond strength. However, ultra rapid hardening polymer modified concrete gives robust bond strength. The deterioration of existing concrete significantly decrease the bond strength. CONCLUSIONS: Bond strength of bonded concrete overlay highly depends on condition of existing concrete pavement rather than overlay material.

The Mixing Ratio Effect of Insert Metal Powder and Insert Brazing Powder on Microstructure of the Region Brazed on DS Ni Base Super Alloy (일방향응고 Ni기 초내열합금 천이액상화산접합부의 미세조직에 미치는 모재와 삽입금속 분말 혼합비의 영향)

  • Ye Chang-Ho;Lee Bong-Keun;Song Woo-Young;Oh In-Seok;Kang Chung-Yun
    • Journal of Welding and Joining
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    • v.23 no.6
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    • pp.99-105
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    • 2005
  • The mixing ratio effect of the GTD-111(base metal) powder and the GNI-3 (Ni-l4Cr-9.5Co-3.5Al-2.5B) powder on TLP(Transient Liquid Phase) bonding phenomena and mechanism was investigated. At the mixing ratio of the base metal powder under $50wt\%$, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solid phases in the bonded interlayer grew epitaxially from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The number of grain boundaries farmed at the bonded interlayer corresponded with those of base metal. At the mixing ratio above $60wt\%$, the base metal powder melted only at the surface of the powder and the amount of the base metal dissolution was also less at the initial time. Nuclear of solids firmed not only from the base metal near the bonded interlayer but also from the remained base metal powder in the bonded interlayer. Finally, the polycrystal in the bonded interlayer was formed when the isothermal solidification finished. When the isothermal solidification was finished, the contents of the elements in the boned interlayer were approximately equal to those of the base metal. Cr-W borides and Cr-W-Ta-Ti borides formed in the base metal near the bonded interlayer. And these borides decreased with the increasing of holding time.

An Experimental Study on Electrical and Mechanical Characteristics of Al6061/Al6061 and Al6061/Sus304 by Using Thermal Bonding Technology (열처리 본딩 기술을 이용한 Al6061/Al6061 및 Al6061/Sus304의 기계적 및 전기적 특성에 관한 실험적 연구)

  • You, Chung-Jun;Jung, Won-Chae
    • Journal of the Korean institute of surface engineering
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    • v.41 no.6
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    • pp.325-330
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    • 2008
  • Al6061 and Sus304 materials are bonded by using thermal bonding technology. Al6061, Sus304 and thermal bonded Al6061/Al6061 and Al6061/Sus304 materials are characterized by using mechanical and electrical measurement. Especially the experimental characteristic data of thermal bonded Al6061/Al6061 and Al6061/Sus304 are not well known until today. We have investigated on Al6061, Sus304 and thermal bonded material. The thermal bonded material Al6061/Al6061 and Al6061/Sus304 can be used for the LCD frame and the other electrical products. For the future, we expect that the more various experiments should be needed to carry out for the data accumulation in the bonded new materials.

Study on the Formation and the Magnetic Properties of $Sm_2Fe_{17}N_x$-type Interstitial Material

  • Kwon, H.W.
    • Journal of Magnetics
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    • v.1 no.1
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    • pp.19-23
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    • 1996
  • In the present study, the $Sm_2Fe_{17}N_x$-type interstitial materials have been prepared by reaction between Nb-free or Nb-containing $Sm_2Fe_{17}$-type alloy and $N_2$ gas. Nitrogenation behaviour of the $Sm_2Fe_{17}N_x$-type material and disproportionation characteristics of the nitrogenated materials have been studied by means of differential thermal analysis (DTA) and thermopiezic analysis (TPA). Magnetic properties of the produced $Sm_2Fe_{17}N_x$-type interstitial materials were characterised in vibrating sample magnetometer (VSM) or thermomagnetic analyser (TMA). Epoxy-bonded or Zn-bonded $Sm_2Fe_{17}N_x$-type magnets were prepared, and their magnetic properties were investigated. It has been found that nitrogenation kinetics of the Sm2Fe17Nx-type alloy is improved significantly by the Nb-substitution for Fe in the alloy. The Nb-substitution is also found to enhance thermal stability of the $Sm_2Fe_{17}N_x$-type interstitial material. Hard magnetic properties of the interstitial materials produced from Nb-free orNb-containing alloy is high enough (intrinsic coercivity : over 7 kOe) for application as bonded permanent magnets. The good hard magnetic properties of the interstitial material are maintained in the epoxy-bonded magnet. Intrinsic coercivity of the Zn-bonded magnets is improved significantly as post-bonding annealing time increases.

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Fracture Characteristics and Stress Analysis of $Si_3N_4/SM45C$ Joint ($Si_3N_4/SM45C$ 접합부의 응력해석 및 파괴특성)

  • 김기성
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1998.10a
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    • pp.248-253
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    • 1998
  • Recently, the uses of Ceramic/metal bonded joints, resin/metal joints, adhesive joints, composite materials which are composed of dissimiliar materials have increased in various industry fields. Since the ceramic/metal bonded joints material is made at a high temperature, residual stress distributions due to differences in material properties were investigated by varying material parameters. The two dimensional finite element analysis was performed to study residual stress distribution in Si3N4/SM45C bonded joint with a copper interlayer between the silicon nitride(Si3N4) and the structural carbon steel(SM45C) and 4-point bending tests were carried out under room temperature. Fracture surface and crack propagation path were observed using scanning electron microscope and characteristics of its fracture was discussed.

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Double bonded Cooper-Naghdi micro sandwich cylindrical shells with porous core and CNTRC face sheets: Wave propagation solution

  • Yazdani, Raziye;Mohammadimehr, Mehdi
    • Computers and Concrete
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    • v.24 no.6
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    • pp.499-511
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    • 2019
  • In this paper, wave propagation of double-bonded Cooper-Naghdi micro sandwich cylindrical shells with porous core and carbon nanotube reinforced composite (CNTRC) face sheets are investigated subjected to multi-physical loadings with temperature dependent material properties. The governing equations of motion are derived by Hamilton's principle. Then, the influences of various parameters such as wave number, CNT volume fraction, temperature change, Skempton coefficient, material length scale parameter, porosity coefficient on the phase velocity of double-bonded micro sandwich shell are taken into account. It is seen that by increasing of Skempton coefficient, the phase velocity decreases for higher wave number and the results become approximately the constant. Also, by increasing of the material length scale parameter, the cut of frequency increases, because the stiffness of micro structure increases. The obtained results for this article can be used to detect, locate and quantify crack.

Reaction Bonded Si3N4 from Si-Polysilazane Mixture (규소 고분자 복합체를 이용한 반응소결 질화규소)

  • Hong, Sung-Jin;Ahn, Hyo-Chang;Kim, Deug-Joong
    • Journal of the Korean Ceramic Society
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    • v.47 no.6
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    • pp.572-577
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    • 2010
  • Reaction-bonded $Si_3N_4$ has cost-reduction merit because inexpensive silicon powder was used as a start material. But its density was not so high enough to be used for structural materials. So the sintered reaction-bonded $Si_3N_4$techniques were developed to solve the low density problem. In this study the sintered reaction-bonded $Si_3N_4$ manufacturing method by using polymer precursor which recently attained significant interest owing to the good shaping and processing ability was proposed. The formations, properties of reaction-bonded $Si_3N_4$ from silicon and polysilazane mixture were investigated. High density reaction-bonded $Si_3N_4$ was manufactured from silicon and silicon-containing preceramic polymers and post-sintering technique. The mixtures of silicon powder and polysilazane were prepared and reaction sintered in $N_2$ atmosphere at $1350^{\circ}C$ and post-sintered at 1600~$1950^{\circ}C$. Density and phase were analyzed and correlated to the resulting material properties.

Effect of Bonding Temperature and Bonding Pressure on Deformation and Tensile Properties of Diffusion Bonded Joint of STS304 Compact Heat Exchanger (STS304 콤팩트 열교환기 고상확산접합부의 접합부 변형과 인장성질에 미치는 접합온도 및 접합압력의 영향)

  • Jeon, Ae-Jeong;Yoon, Tae-Jin;Kim, Sang-Ho;Kim, Hyeon-Jun;Kang, Chung-Yun
    • Journal of Welding and Joining
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    • v.32 no.4
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    • pp.46-54
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    • 2014
  • In this study, the effect of bonding temperature and bonding pressure on deformation and tensile properties of diffusion bonded joint of STS304 compact heat exchanger was investigated. The diffusion bonds were prepared at 700, 800 and $900^{\circ}C$ for 30, 60 and 90 min in pressure of 3, 5, and 7 MPa under high vacuum condition. The height deformation of joint decreased and the width deformation of joint increased with increasing bonding pressure at $900^{\circ}C$. The ratio of non-bonded layer and void observed in the joint decreased with increasing bonding temperature and bonding pressure. Three types of the fracture surface were observed after tensile test. The non-bonded layer was observed in diffusion bonded joint preformed at $700^{\circ}C$, the non-bonded layer and void were observed at $800^{\circ}C$. On the other hand, the ductile fracture occurred in diffusion bonded joint preformed at $900^{\circ}C$. Tensile load of joint bonded at $800^{\circ}C$ was proportional to length of bonded layer and tensile load of joint bonded at $900^{\circ}C$ was proportional to minimum width of pattern. The tensile strength of joint was same as base metal.

EFFECTS OF INTERFACE CRACKS EMANATING FROM A CIRCULAR HOLE ON STRESS INTENSITY FACTORS IN BONDED DISSIMILAR MATERIALS

  • CHUNG N.-Y.;SONG C.-H
    • International Journal of Automotive Technology
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    • v.6 no.3
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    • pp.293-303
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    • 2005
  • Bonded dissimilar materials are being increasingly used in automobiles, aircraft, rolling stocks, electronic devices and engineering structures. Bonded dissimilar materials have several material advantages over homogeneous materials such as high strength, high reliability, light weight and vibration reduction. Due to their increased use it is necessary to understand how these materials behave under stress conditions. One important area is the analysis of the stress intensity factors for interface cracks emanating from circular holes in bonded dissimilar materials. In this study, the bonded scarf joint is selected for analysis using a model which has comprehensive mixed-mode components. The stress intensity factors were determined by using the boundary element method (BEM) on the interface cracks. Variations of scarf angles and crack lengths emanating from a centered circular hole and an edged semicircular hole in the Al/Epoxy bonded scarf joints of dissimilar materials are computed. From these results, the stress intensity factor calculations are verified. In addition, the relationship between scarf angle variation and the effect by crack length and holes are discussed.