• Title/Summary/Keyword: Bonded Interface Edge

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Boundary Element Analysis of Stress Singularity at the Interface Corner of Viscoelastic Adhesive Layer Bonded Between Rigid Adherends (강체모재들을 결합하고 있는 점탄성 접착재층의 계면모서리에서 발생하는 응력특이성의 경제요소해석)

  • 이상순;박준수
    • Computational Structural Engineering
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    • v.10 no.2
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    • pp.131-138
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    • 1997
  • This paper concerns the stress singularity at the interface corner of the viscoelastic adhesive layer bonded between rigid adherends, subjected to a uniform transverse tensile strain. The characteristic equation is derived in the Laplace transformed space, following Williams, and the transformed characteristic equation is inverted analytically into real time space for the viscoelastic model considered here. The order of the singularity is obtained numerically. The time-domain boundary element method is employed to investigate the nature of stresses along the interface. Numerical results show that the order of the singularity increases with time while the free-edge stress intensity factors are relaxed with time.

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Prediction of crack propagation path in IC package by BEM (경계요소법에 의한 반도체 패키지의 균열진전경로 예측)

  • Song, Chun-Ho;Chung, Nam-Yong
    • Proceedings of the KSME Conference
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    • 2001.06a
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    • pp.286-291
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    • 2001
  • Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

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Viscoelastic Analysis of an Interface Edge Crack in a Bonded Polymeric Film

  • Lee, Sang-Soon
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.3
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    • pp.35-39
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    • 2010
  • Interfacial stress singularity induced in an analysis model consisting of the polymeric thin film and the elastic substrate has been investigated using the boundary element method. The interfacial singular stresses between the viscoelastic thin film and the elastic substrate subjected to a uniform moisture ingression are investigated for the case of a small interfacial edge crack. It is assumed that moisture effects are assumed to be analogous to thermal effects. Then, the overall stress intensity factor for the case of a small interfacial edge crack is computed. The numerical procedure does not permit calculation of the limiting case for which the edge crack length vanishes.

Shear Strength of an Aluminum Alloy Bonded with a DP-460 Adhesive: Single Lap-shear Joints

  • Kim, Hyun-Bum;Nishida, Tomohisa;Oguma, Hiroyuki;Naito, Kimiyoshi
    • Journal of Adhesion and Interface
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    • v.21 no.1
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    • pp.20-26
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    • 2020
  • Single lap-shear joints (SLJ) specimens with and without partial round fillets were fabricated to measure the average shear strength of adhesives. The effects of the length of the adherend on the SLJ specimens were also investigated. An epoxy adhesive was used to bond aluminum alloy. Tensile tests were performed on the adhesive bulk specimens to measure the mechanical properties. The finite element analysis (FEA) method was used to measure the adhesive stress distributions, i.e., the peel and shear stresses, on the bonded part. The experimental results revealed that the specimen consisting short length of adherend and without the partial round fillets exhibited the smallest average shear strength of adhesive among the investigated specimens. FEA revealed that the low average shear strength for the specimen with a short adherend length was caused by high stress concentrations on the adhesive at the edge of the bonded part.

Direct Shear Test of Retrofit Anchors Using Deformed Reinforcement and Adhesive

  • Choi, Dong-Uk;Kim, Yong-Gon
    • KCI Concrete Journal
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    • v.12 no.1
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    • pp.91-99
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    • 2000
  • A new type of retrof=t anchor bolt that uses deformed reinforcing bars and a commercial adhesive was developed and then an experimental study was carried out to determine the behavior of the anchors in direct shear. The steel-to-concl몫ete interface was tested. Plain concrete slabs with about 20-MPa compressive strength were used for 23 direct shear tests performed Test variables were anchor diameters (D16, D22. and D29) and edge effect. Three different shear tests were completed: simple shear, edge shear where anchors were pulled against the concrete core, and edge shear where anchors were pushed against the concrete cover In the simple and the edge shear tests where the anchors were pulled against the core, the theoretical dowel strength determined by (equation omitted) was achieved but with relatively large displacements. The shear resistances increased with the increasing displacements. In the edge shear test where the anchors were pushrd against the cover, the peak shear strengths signif=cantly lower than the theoretical dowel strength were determined due to cracks developed in concrete when the edge distance was 80 mm. The peak strengths were about 50% of the dowel strength for Dl6 bar. and about 25% or less of the dowel strength for D22 and D29 bars. Test results revealed that the edge shear where the anchor was pushed against the cover controled.

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Analysis of Singular Stresses at the Bonding Interface of Semiconductor Chip Subjected to Shear Loading (전단하중하의 반도체 칩 접착계면의 특이응력 해석)

  • 이상순
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.4
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    • pp.31-35
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    • 2000
  • The stress state developed in a thin adhesive layer bonded between the semiconductor chip and the leadframe and subjected to a shear loading is investigated. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. Within the context of a linear elastic theory, a stress singularity of type $\gamma^{\lambda=1}$(0<1<1) exists at the point where the interface between one of the rigid adherends and the adhesive layer intersects the free surface. Such singularity might lead to edge crack or delamination.

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Analyses of Fracture Parameters and Prediction of Crack Propagation Path on Delamination in the LSI Package (반도체 패키지의 층간박리 파괴역학인자 해석 및 균열진전경로 예측)

  • Chung, Nam-Yong;Park, Cheol-Hee
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.18 no.4
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    • pp.401-409
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    • 2009
  • This paper presents a method of calculating the stress intensity factor (K) and crack propagation direction (${\theta}_0$) at the crack-tip that is associated with delamination in the large scale integration(LSI) package. To establish a reasonable strength evaluation method and life prediction, it is necessary to assess fracture parameters under various fracture conditions. Therefore, we conducted quantitative stress singularity analysis considering thermal stress simulating the changes of crack length (a), (h) and (v) in delamination using the 2-dimensional elastic boundary element method (BEM), and from these results predicted crack propagation direction and path.

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New technique for repairing circular steel beams by FRP plate

  • Daouadji, Tahar Hassaine;Abderezak, Rabahi;Rabia, Benferhat
    • Advances in materials Research
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    • v.11 no.3
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    • pp.171-190
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    • 2022
  • In this paper, the problem of interfacial stresses in steel cantilever beams strengthened with bonded composite laminates is analyzed using linear elastic theory. The analysis is based on the deformation compatibility approach, where both the shear and normal stresses are assumed to be invariant across the adhesive layer thickness. The original study in this paper carried out an analytical solution to estimate shear and peel-off stresses, as, interfacial stress analysis concentration under the uniformly distributed load and shear lag deformation. The theoretical prediction is compared with authors solutions from numerous researches. This phenomenon of deformation of the members, which gives probably approach on the study of interface of the reinforced structures, is called "shear lag effect". The resolution in this paper shows that the shear stress and the normal stress are significant and, are concentrated at the end of the composite plate of reinforcement, called "edge effect". A parametric study is carried out to show the effects of the variables of design and the physical properties of materials. This research is helpful for the understanding on mechanical behaviour of the interface and design of such structures.

Experimental and numerical disbond localization analyses of a notched plate repaired with a CFRP patch

  • Abderahmane, Sahli;Mokhtar, Bouziane M.;Smail, Benbarek;Wayne, Steven F.;Zhang, Liang;Belabbes, Bachir Bouiadjra;Boualem, Serier
    • Structural Engineering and Mechanics
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    • v.63 no.3
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    • pp.361-370
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    • 2017
  • Through the use of finite element analysis and acoustic emission techniques we have evaluated the interfacial failure of a carbon fiber reinforced polymer (CFRP) repair patch on a notched aluminum substrate. The repair of cracks is a very common and widely used practice in the aeronautics field to extend the life of cracked sheet metal panels. The process consists of adhesively bonding a patch that encompasses the notched site to provide additional strength, thereby increasing life and avoiding costly replacements. The mechanical strength of the bonded joint relies mainly on the bonding of the adhesive to the plate and patch stiffness. Stress concentrations at crack tips promote disbonding of the composite patch from the substrate, consequently reducing the bonded area, which makes this a critical aspect of repair effectiveness. In this paper we examine patch disbonding by calculating the influence of notch tip stress on disbond area and verify computational results with acoustic emission (AE) measurements obtained from specimens subjected to uniaxial tension. The FE results showed that disbonding first occurs between the patch and the substrate close to free edge of the patch followed by failure around the tip of the notch, both highest stress regions. Experimental results revealed that cement adhesion at the aluminum interface was the limiting factor in patch performance. The patch did not appear to strengthen the aluminum substrate when measured by stress-strain due to early stage disbonding. Analysis of the AE signals provided insight to the disbond locations and progression at the metal-adhesive interface. Crack growth from the notch in the aluminum was not observed until the stress reached a critical level, an instant before final fracture, which was unaffected by the patch due to early stage disbonding. The FE model was further utilized to study the effects of patch fiber orientation and increased adhesive strength. The model revealed that the effectiveness of patch repairs is strongly dependent upon the combined interactions of adhesive bond strength and fiber orientation.

Testing and Numerical Analysis on the Fracture Characteristics of Composite Adhesive Bonded Single-Lap Joints (복합재료 Single-Lap 본딩 조인트의 파괴 특성에 대한 실험 및 수치해석 연구)

  • 김광수;박재성;장영순;이영무
    • Composites Research
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    • v.16 no.5
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    • pp.45-53
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    • 2003
  • The experimental and numerical investigations on the failure characteristics of the secondary bonded composite single-lap joints were performed. The initiations and growths of cracks were observed using CCD camera and acoustic emission sensor during the tension tests of the joint specimens. The structural behaviors of the specimens were predicted by the geometric nonlinear two-dimensional finite element analysis. The three types of observed initial cracks were included in each finite element models and the strain energy release rates of each specimen models were calculated by VCCT(Virtual Crack Closure Technique) technique. The tension tests showed that the initial cracks occurred in the 60∼90% of final failure loads and the major failure modes of the specimens were adhesive failure and the delamination between the 1st and 2nd ply of laminate. The specimens with the thicker bondline had earlier crack initiation loads but higher crack propagation resistance and eventually better loading capability. The delaminations were mostly observed in the thicker bondline specimens. The mode I values of calculated strain energy release rates were higher than the mode II values in the all specimen models considering the three types of initial cracks. The mode I and total strain energy release rates were calculated as higher values in the order of initial crack in the edge interface, comer interface and delamination between the plies of laminate.