• 한국정밀공학회지
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• 제15권6호
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• pp.159-166
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• 1998

The problem of interface crack in the bonded structures has received a great deal of attention in recent years. In this paper the aluminum bonded single lap-joint containing the interface edge crack is investigated. The tensile load and the average shear stress of the adhesive joints which have different crack length are obtained from the static tensile tests. The critical value of crack length to provoke the interface fracture is determined to a/L=0.4, where a is the interface crack length and L is the adhesive lap-length. The fracture mechanical parameters are introduced to confirm the existence of the critical crack length. The compliance and the stress intensity factors are calculated using the displacement and the stress near the interface crack tip by the boundary element method. These numerical results support the experimental results that the critical value of a/L is 0.4. It is known that the compliance and the stress intensity factors are the efficient parameters to estimate the bonded single lap-joint containing the interface edge crack.

• 대한기계학회논문집A
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• 제25권6호
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• pp.907-915
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• 2001

Application of bonded dissimilar materials in many industries are increasing. When these materials are to be used in structures, it needs to evaluate the failure strength applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared, experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criteria of mixed mode crack were analyzed. From the results, the fracture criteria and the method of strength evaluation by the fracture toughness in Al/Epoxy bonded dissimilar materials were proposed.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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• pp.301-306
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• 1999

Application of bonded dissimilar materials in various industries are increasing. When these materials are used in structures, it needs to investigate strength evaluation applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared for the static tests so that experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criteria of mixed mode crack were analyzed. From the results, the fracture criteria and the method of strength evaluation by the fracture toughness in Al/ Epoxy bonded dissimilar materials were proposed.

• 한국생산제조학회지
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• 제4권4호
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• pp.50-60
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• 1995

Recently advantages joining dissimiliar materials and light weight material techniques have led to increasing use of structural adhesives in the various industries. Stress singulartiy occurs at the interface edges of adhesively bonded dissimilar materials. So it is required to analyze its stress singularity at the interface edges of adhesively bonded joints indissimilar materials. In this paper, the analysis method of stress singularity is studied in detail. Also, effects of the stress singularity at the interface edge of adhesively bonded scarf joints in combinations of dissimilar materials are investigated by using 2-dimensional elastic program of boundary element method. As the results, the strength evaluation method of adhesively bonded dissimilar materials using the stress singularity factor, $\Gamma$,is very useful. The fracture criterion, method of strength evaluation and prediction of fracture strength by the stress singularity factor on the adhesively bonded dissimilar materials are proposed.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 추계학술대회 논문집
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• pp.254-260
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• 1998

Application of bonded dissimilar materials in various industries are increasing. When these materials are used in structures, it needs to investigate strength evolution applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared for the static tests so that experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criterion of mixed mode crack were analyzed. From the results, the fracture criterion and the method of strength evolution by the fracture toughness in Al/Epoxy bonded dissimilar materials were proposed.

• 한국공작기계학회논문집
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• 제16권6호
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• pp.94-102
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• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.655-659
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• 1997

The analysis of cracks at the interface between dissimilar materilar has received a great deal of attention in recent years. In this paper we conducted the static tensile test for the aluminum bonded single lap-joint with the interface edge crack. Comparing this results, that is ultimate load and strain value of aluminum adherend by strain gauge with the fracture mechanics parameters, compliance and stress intensity factors acquied from the boundary element analysis, we concluded that there are critical value of crack length to provoke the interface fracture.

• 대한기계학회논문집A
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• 제20권10호
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• pp.3058-3067
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• 1996

With increasing use of ceramics/metal bonded joints, It is required to analyze the residual stress distribution and stress singularity at an interface edge for its bonded joints. In this paper, the residual stress distribution and stress singularity index of the ceramics/metal bonded joints were analyzed by using 2-dimensional elastic boundary element method. The variations of residual stress distribution and stress singularity index are studied with changes for the combinations of ceramics/metal bodned joints.

• 한국생산제조학회지
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• 제8권1호
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• pp.35-44
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• 1999

In a view point of earth environmental protection and social requirement, adhesively bonded structures of aluminum alloys have become to be employed for the purpose of decreasing fuel ratio by weight reduction and to improve performance in various engineering fields such as aircrafts, automobiles, rolling stocks and so on. In spite of such wide applications in adhesively bonded structures of aluminum alloys, the quantitative fracture criterion and evolution method of its bonded strength have not been established yet. The objective of this paper is to establish fracture criterion considering stress singularity at interface edges in adhesively bonded structures of aluminum alloys. Through the analyses of boundary element method and static fracture experiments with three different types of specimens in the adhesively bonded joints of aluminum alloys, its fracture criterion was proposed and discussed about strength evolution of adhesively bonded structures.

• 한국자동차공학회논문집
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• 제16권3호
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.