• The Journal of Korean Academy of Prosthodontics
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• v.46 no.5
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• pp.511-519
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• 2008

Statement of problem: An incompatibility between the initiator systems of self-curing composite resins and light-curing adhesives was supposed recently. Purpose: The purpose of the study was to evaluate the influence of activators for self/dual bonding on dentin shear bonding strengths. Material and methods: Fifty human molars were divided into 5 groups. A flat dentin surface was created for each tooth. A self-curing composite resin (Luxacore) was bonded with the following adhesives (n = 10); One-Step, Prime&Bond NT, AdheSE, Prime&Bond NT and AdheSE were also used in combination with activators. Shear bond strengths were measured after 24 hours of water storage. The specimens were loaded in shear in the Instron until failure at a 1 mm/min crosshead speed. Data were compared using one-way ANOVA and Tukey HSD test (${\alpha}$= 0.05). Results: The dentin adhesive systems in order of decreasing median bond strength were One-Step > Prime&Bond NT with activator, AdheSE with activator > Prime&Bond NT, AdheSE. Among adhesives, One-Step had the highest bond strength. Prime&Bond NT with activator had higher bond strengths than Prime&Bond NT that was used alone, and so was AdheSE. Conclusion: Shear bond strengths were increased in Prime&Bond NT and AdheSE when these were used with activators comparing used without activators. But using activators was not effective clinically comparing One-Step.

• Journal of the Korean Chemical Society
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• v.31 no.1
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• pp.14-24
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• 1987

The CNDO/2 method has been used to calculate the electronic structure of the zeolites and silicas, and to investigate the interaction of CO molecules with the OH groups or the exchanged cation in the zeolites. The interaction energies of CO molecules with OH groups in silica were ca. 12kcal/mol, the bond distance, R(O-H${\cdots}$C) was 2.6${\AA}$. The strength of bond between CO molecules and various types of cations in the zeolites was in the following order: $H^+ < Na^+ < Li^+$, i.e., this increased with increasing electrostatic field of cations. The bond orders of CO molecules interacting with the OH groups or the cations increased but for the OH-OC type interaction. The theoretical decationization energies of exchanged cations in the zeolites decreased in the order: $H^+ > Li^+ > Na^+$. And these energies depended on the amount of charge density transfered from the skeleton to the cations in order to compensate its negative charge.

• Journal of the Korean Chemical Society
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• v.18 no.4
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• pp.223-238
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• 1974

CNDO/2 MO theoretical studies and kinetic studies of halide exchange reactions for alkylchloroformates have been carried out in order to investigate structure-reactivity relationship of alkylchloroformates. From the result of energetics, it was concluded that the most stable configuration of alkylchloroformate is that in which alkyl group and chlorine are trans to each other, and that the hindered rotation about the bond between the carbonyl carbon and alkoxy-oxygen bond is attributed to the ${\pi}-$electron delocalization. It has been found that the large charge separation is due to -M effect of carbonyl and alkoxy oxygens and-I effect of chlorine. The order of rates in solvents studied was $(CH_3)_2 > CO > CH_3CN{\gg}MeOH.$$I^->Br^->Cl^-$ in protic solvent, and of Cl^->Br^- >I^-$ in dipolar aprotic solvents. Alkyl group contribution has the decreasing order of $CH_3-> C_2H-{\gg}i-C_3H_7-.$ The solvent effect has been interpreted on the basis of initial and final state contribution. A transition state model has been suggested, and it has been proposed that the most favorable mechanism is the addition-elimination. From the results of activation parameters and electronic properties, an energy profile has been proposed. Structural factors determining reactivities of alkylchloroformates have been shown to be charge, energy level of ${\alpha}^*LUMO$ to C-Cl bond and ${\alpha}^{\ast} $antibonding strength with respect to C-Cl bond in this MO. Charge and polarizability of nucleophile, and the interaction of these effects with solvent structures are also found to be important.

• Bulletin of the Korean Chemical Society
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• v.35 no.5
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• pp.1479-1484
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• 2014

Based on the full optimized molecular geometric structures at B3LYP/cc-pvtz method, a new designed compound, 4,6,8-trinitro-4,5,7,8-tetrahydro-6H-furazano[3,4-f ]-1,3,5-triazepine was investigated in order to look for high energy density compounds (HEDCs). The analysis of the molecular structure indicates that the seven-membered ring adopts chair conformation and there exist intramolecular hydrogen bond interactions. IR spectrum and heat of formation (HOF) were predicted. The detonation velocity and pressure were evaluated by using Kamlet-Jacobs equations based on the theoretical density and condensed HOF. The bond dissociation energies and bond orders for the weakest bonds were analyzed to investigate the thermal stability of the title compound. The results show that $N_1-N_6$ bond is the trigger bond. The crystal structure obtained by molecular mechanics belongs to $Pna2_1$ space group, with lattice parameters Z = 4, a = 15.3023 ${\AA}$, b = 5.7882 ${\AA}$, c = 11.0471 ${\AA}$, ${\rho}=2.06gcm^{-3}$. In addition, the analysis of frontier molecular orbital shows the title compound has good stability and high chemical hardness.

• The Journal of Korean Academy of Prosthodontics
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• v.36 no.1
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• pp.50-63
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• 1998

This study investigated the effects of resin surface primers for rebase resins on the surface texture of denture base resins by the use of scanning electron microscopy. This study also evaluated the bond strength of rebase resins to denture base resin. The denture base resin in this study was Vertex RS (Dentimex Co., Ltd., Holland). The rebase resins used were Tokuso Rebase (Tokuyama Co., Ltd., Japan), Metabase (Sun Medical Co., Ltd., Japan), New True Liner(Harry J, Bosworth Co., Ill.), and Reverse (Nissin Co., Ltd., Japan). The test samples were divided into four parts: Group 1 : Treated with primer with brush. Group 2 : Immersed in the primer for 5 seconds. Group 3 : Immersed in the primer for 10 seconds. Group 4 : Immersed in the primer for 30 seconds. Control group : not treated with primer The results were as follows; 1. The bond strength of rebase resins to denture base resin is increased by application of primers. 2. Regardless of the rebase resin type, there was no significant difference among the bond strength in groups G1, G2, G3, G4. There was a significant difference with the control. (P<0.05) 3. Regardless of each group, the bond strength according to the rebase resin type was decreased in the following order: Tokuso Rebase, New Tru Liner, Reverse and then Metabase. 4. Under the scanning electron microscope, brush application produced a softening of the denture base surface. After immersion, all primers produced a spongelike structure on the denture base resin surface. The results of this study suggest that primers produce a significant effect by means of brush application, therefore it is recommended as the most convenient and logical procedure for application of the primers.

• Journal of the Korea Institute of Building Construction
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• v.15 no.5
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• pp.465-471
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• 2015

This study proposed V-shaped tie bar method as an alternative of internal cross-tie for reinforced concrete columns in order to enhance the constructability and confinement effectiveness of the lateral tie bars. A total of 35 pull-out specimens were prepared with the parameters of concrete compressive strength and bending angle and embedment length of the V-shaped bar to examine the bond stress-slip relationship of the V-shaped tie bar. The bond strength of the V-shaped tie bars with the bending angle not exceeding $60^{\circ}$ was higher than the predictions obtained from the equations of CEB-FIP provision. Considering the constructability and bond behavior of the V-shpaed tie bar, the bending angle and embedment length of such bar can be optimally recommended as $45^{\circ}$ and 6db, respectively, where db is the diameter of the tie bar.

• Journal of the Korean Society for Nondestructive Testing
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• v.14 no.2
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• pp.112-121
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• 1994

This paper discusses the feasibility of ultrasonic C-scan technique for nondestructive evaluation of spot weld quality. Ultrasonic evaluation for spot weld quality was performed by immersion method with the mechanical and the electronic scanning of point-focussed ultrasonic beam(25 MHz). For the sake of the approach to the quantitative measurement of nugget diameter and the discrimination of the corona bond from nugget, preliminary infinitesimal gap experiment by newton ring is tried in order to set up the optimum ultrasonic test condition. Ultrasonic image data obtained were confirmed and compared by optical microscope and SAM(Scanning Acoustic Microscope) observation of the spot-weld cross section. The results show that the nugget diameter can be measured with the accuracy of 1.0mm, and voids included in nugget can be detected to $10{\mu}m$ extent with simplicity and accuracy. Finally, it was found that it is necessary to make a profound study of definite discrimination of corona bond from nugget and the approach of quantitative evaluation of nugget diameter by utilizing the various image processing techniques.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.53-58
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• 2013

An innovative packaging solution, Flip Chip with Copper (Cu) Column bond on lead (BOL) Enhanced Process (fcCuBE$^{(R)}$) delivers a cost effective, high performance packaging solution over typical bond on capture pad (BOC) technology. These advantages include improved routing efficiency on the substrate top layer thus allowing conversion functionality; furthermore, package cost is lowered by means of reduced substrate layer count and removal of solder on pad (SOP). On the other hand, as electronic packaging technology develops to meet the miniaturization trend from consumer demand, reliability testing will become an important issue in advanced technology area. In particular, electromigration (EM) of flip chip bumps is an increasing reliability concern in the manufacturing of integrated circuit (IC) components and electronic systems. This paper presents the results on EM characteristics on BOL and BOC structures under electrical current stressing in order to investigate the comparison between two different typed structures. EM data was collected for over 7000 hours under accelerated conditions (temperatures: $125^{\circ}C$, $135^{\circ}C$, and $150^{\circ}C$ and stress current: 300 mA, 400 mA, and 500 mA). All samples have been tested without any failures, however, we attempted to find morphologies induced by EM effects through cross-sectional analysis and investigated the interfacial reaction characteristics between BOL and BOC structures under current stressing. EM damage was observed at the solder joint of BOC structure but the BOL structure did not show any damage from the effects of EM. The EM data indicates that the fcCuBE$^{(R)}$ BOL Cu column bump provides a significantly better EM reliability.

• The Journal of Korean Academy of Prosthodontics
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• v.27 no.2
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• pp.101-121
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• 1989

This study investigated the effects of Silicoating procedure on the tensile bond strength of resin-bonded prostheses. The Rexillium III specimens were treated with electrochemical etching and Silicoating procedure, followed by thermocycling and the NNB, Pors-on 4, and Degudent-U specimens were treated with Silicoating procedure. The specimens were debonded in tension with a Tensilon machine. Also, all specimens were observed with SEM, concentration of Si elements was analyzed with EPMA, and the mode of failure was recorded. The results of this study were obtained as follows: 1. In the Rexillium III specimens, the tensile bond strength of the Silicoated specimens was higher than that of the electrochemically etched specimens, and significant differences were observed (P<0.05). 2. The tensile bond strength of electrochemically etched Rexillium III specimens, significant differences were observed between the thermocycled and nonthermocycled specimens (P<0.05), but no significant differences were observed in the Silicoated specimens (P>0.05). 3. The tensile bond strength of the Silicoated specimens decreased NNB, Pors-on 4, Rexillium III, and Degudent-U in that order named. 4. Unlike the electrochemically etched specimens, the Silicoated specimens showed gap-free metal-resin interfaces with SEM. 5. Compared to the electrochemically etched specimens, the Silicoated specimens showed higher concentration of Si elements at the metal-resin interfaces and resin cement. 6. Photographic evaluation (X2) of the fractured sites revealed mainly cohesive failures with the Silicoated specimens, and adhesive failures with the electrochemically etched specimens.

• Restorative Dentistry and Endodontics
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• v.26 no.2
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• pp.153-161
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• 2001

The purpose of this study was to evaluate microleakage of six current dentin bonding systems. In this in vitro study, class V cavities were prepared on buccal and lingual surfaces of thirty extracted human molars. Each margin was on enamel and dentin/cementum. Experimental teeth were randomly divided into six groups of 5 each. Group 1 : Scotchbond Multi-Purpose; Group 2 : Single Bond; Group 3 : Prime&Bond NT ; Group 4 : Clearfil Liner Bond 2 ; Group 5 : MAC Bond II ; Group 6 : One-up Bond F. The bonding agent and composite resin were applied to class V cavities according to manufacturer's directions. After thermocycling, the specimens were immersed in 0.5% basic fuchsin dye solution for 6 hours and sectioned longitudinally through the center of the restoration with a low speed diamond saw. The degree of microleakage was measured as the extent of dye penetration under the stereomicroscope at $\times$20. The data were analyzed using one way ANOVA. When significant differences found. multiple comparisons were made using Duncan's Multiple Range Test. The results of this study were as follows: 1. In all groups, leakage value seen at the enamel margin was significantly lower than that seen at the dentin margin(P<0.001). 2. At the enamel margin, none of the dentin bonding systems used in this study showed statistically significant difference in leakage values(P<0.05). 3. At the cementum margin, group 3 showed the highest leakage value, and others were decreased as group 5, 6, 4 in that order, and group 1, 2 showed the lowest leakage value. There was statistically significant difference between group 3 and the other groups except for group 5(P<0.05).