• Title/Summary/Keyword: Board composition

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Genotype Profiles for the Quantitative Trait Related to Milk Composition in Bulls Used for Artificial Insemination in India

  • Mukhopadhyaya, P.N.;Mehta, H.H.
    • Asian-Australasian Journal of Animal Sciences
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    • v.15 no.3
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    • pp.326-329
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    • 2002
  • A population of exotic Holstein Friesian, Jersey, their crossbreds and the indigenous Murrah breed of buffalo bulls (n=486), used in artificial insemination breeding program were screened for the allelic distribution of the ${\kappa}$-casein and ${\beta}$-lactoglobulin genotypes. The preferred "B" allele frequency was highest in Murrah buffalo bulls followed by Jersey and Holstein Friesian. The increase in this particular allele frequency in the Holstein Friesian crossbred bulls was more when compared to their Jersey counterparts. Hardy-Weinberg's equilibrium was maintained albeit with some deviations, which was higher in crossbreds than in purebreds. The feasibility of using such large-scale molecular diagnostic tools in the field and their significance with regards to the dairy economy is discussed.

Developmetn of Integrated Monitoring System for Composition of CIM System's infrastructure(DLU & DAU) (l) (CIM 시스템의 Infrastructure(DLU & DAU) 구성을 위한 통합 모니터링 시스템의 개발(I))

  • Kang, H.W.;Lee, W.;Kim, S.B.
    • Journal of the Korean Society for Precision Engineering
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    • v.12 no.10
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    • pp.18-24
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    • 1995
  • This paper describes a multi-computer system developed for CIM(Computer Integrated Manufacturing) system, which combines single board computers and personal computers by using RS422/485 communication and LAN. The system adopts a concept of hot run back up system based on dual CUP system of host and supervisor structure. The dual CPU system and the single board computer are respectively developed using 32 bits microcomputer and 16 bits microprocessor. 8097BH. The multi communication between two types of system is done by using RS 422/485, and also data logging computers are linked with LAN.

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A Study on Physical and Mechanical Properties of Sawdustboards combined with Polypropylene Chip and Oriented Thread (폴리프로필렌사(絲)칩과 배향사(配向絲)를 결체(結締)한 톱밥보드의 물리적(物理的) 및 기계적(機械的) 성질(性質)에 관(關)한 연구(硏究))

  • Suh, Jin-Suk;Lee, Phil-Woo
    • Journal of the Korean Wood Science and Technology
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    • v.16 no.2
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    • pp.1-41
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    • 1988
  • For the purpose of utilizing the sawdust having poor combining properties as board raw material and resulting in dimensional instability of board, polypropylene chip (abbreviated below as PP chip) or oriented PP thread was combined with sawdust particle from white meranti(Shorea sp.). The PP chip was prepared from PP thread in length of 0.25, 0.5, 1.0 and 1.5 cm for conventional blending application. Thereafter, the PP chip cut as above was combined with the sawdust particle by 3, 6, 9, 12 and 15% on the weight basis of board. Oriented PP threads were aligned with spacing of 0.5, 1.0 and 1.5cm along transverse direction of board. The physical and mechanical properties on one, two and three layer boards manufactured with the above combining conditions were investigated. The conclusions obtained at this study were summarized as follows: 1. In thickness swelling, all one layer boards combined with PP chips showed lower values than control sawdustboard, and gradually clear decreasing tendendy with the increase of PP chip composition. Two layer board showed higher swelling value than one layer board, but the majority of boards lower values than control sawdustboard. All three layer boards showed lower swelling values than control sawdustboard. 2. In the PP chip and oriented thread combining board, the swelling values of boards combining 0.5cm spacing oriented thread with 1.0 or 1.5cm long PP chip in 12 and 15% by board weight were much lower than the lowest of one or three layer. 3. In specific gravity of 0.51, modulus of rupture of one layer board combined with 3% PP chip showed higher value than control sawdustboard. However, moduli of rupture of the boards with every PP chip composition did not exceed 80kgf/cm2, the low limit value of type 100 board, Korean Industrial Standard KS F 3104 Particleboards. Moduli of rupture of 6%, 1.5cm-long and 3% PP chip combined boards in specific gravity of 0.63 as well as PP chip combined board in specific gravity of 0.72 exceeded 80kgf/$cm^2$ on KS F 3104. Two layer boards combined with every PI' chip composition showed lower values than control sawdustboard and one layer board. Three layer boards combined with.1.5cm long PP chip in 3, 6 and 9% combination level showed higher values than control sawdustboard, and exceeded 80kgf/$cm^2$ on KS F 3104. 4. In modulus of rupture of PP thread oriented sawdustboard, 0.5cm spacing oriented board showed the highest value, and 1.0 and 1.5cm spacing oriented boards lower values than the 0.5cm. However, all PP thread oriented sawdustboards showed higher values than control saw-dustboard. 5. Moduli of rupture in the majority of PP chip and oriented thread combining boards were higher than 80kgf/$cm^2$ on KS F 3104. Moduli of rupture in the boards combining longer PP chip with narrower 0.5cm spacing oriented thread showed high values. In accordance with the spacing increase of oriented thread, moduli of rupture in the PP chip and oriented thread combining boards showed increasing tendency compared with oriented sawdustboard. 6. Moduli of elasticity in one, two and three layer boards were lower than those of control sawdustboard, however, moduli of elasticity of oriented sawdustboards with 0.5, 1.0 and 1.5cm spacing increased 20, 18 and 10% compared with control sawdustboard, respectively. 7. Moduli of elasticity in the majority of PP chip and oriented thread combining boards in 0.5, 1.0 and 1.5cm oriented spacing showed much higher values than control sawdustboard. On the whole, moduli of elasticity in the oriented boards combined with 9% or less combination level and 0.5cm or more length of PP chip showed higher values than oriented sawdustboard. The increasing effect on modulus of elasticity was shown by the PP chip composition in oriented board with narrow spacing. 8. Internal bond strengths of all one layer PP chip combined boards showed lower values than control sawdust board, however, the PP chip combined boards in specific gravity of 0.63 and 0.72 exceeded 1.5kgf/$cm^2$, the low limit value of type 100 board and 3kgf/$cm^2$, type 200 board on KS F 3104, respectively. And also most of all two, three layer-and oriented boards exceeded 3kgf/$cm^2$ on KS F. 9. In general, screw holding strength of one layer board combined with PP chip showed lower value than control sawdustboard, however, that of two or three layer board combined with PP chip did no decreased tendency, and even screw holding strength with the increase of PP chip composition. In the PP chip and oriented PP thread combining boards, most of the boards showed higher values than control sawdustboard in 9% or less PP chip composition.

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Effects of the Wire Net Composition on Flexural Properties of Sawdustboard (철강구성(鐵鋼構成)이 톱밥보오드의 휨성질(性質)에 미치는 영향(影響))

  • Lee, Phil-Woo;Suh, Jin-Suk
    • Journal of the Korean Wood Science and Technology
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    • v.13 no.4
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    • pp.67-72
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    • 1985
  • To improve the bending strength of sawdustboard, verious resin contents of 10, 13, 16, and 19% were applied to the thin shell (face layer) composed with wire net or not. The shell effect of sawdust and wire net composition formed with core sawdustboard were evaluated. Forcusing on the effects of wire net composition and noncomposition including a comparison with chipboard and veneer complyboard, bending properties (Modulus of rupture (MOR), Modulus of elasticity (MOE), Stress at proportional limit ($S_{pl}$). Work to maximum load ($W_{ml}$))were analyzed and discussed. 1. In modulus of rutpute, veneer comply was the highest (621.5 kg/$cm^2$), and next decreasing order was wire net composition (159.1 kg/$cm^2$), chipboard (81.75 kg/$cm^2$), and wire net noncomposition (76.21 kg/$cm^2$) as in modulus of elasticity, work to maximum load, except for stress at proportional limit. 2. The highly significant effects were shown in both wire net composition and noncomposition, at the same time wire net composition exceeded two times of noncomposition throughout resin contents in bending properties. Chipboard was similar to the mean or 16% resin content in noncomposirion. 3. Every board in wire net composition above 10% resin content was beyond 100 kg/$cm^2$ in MOR, minimum allowable strength for structural use according to KS F 3104. In conclusion, the feasibility for improving the bending strength of weak sawdustboard by wire net composed shell was offered.

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The Physical, Mechanical, and Sound Absorption Properties of Sandwich Particleboard (SPb)

  • ISWANTO, Apri Heri;HAKIM, Arif Rahman;AZHAR, Irawati;WIRJOSENTONO, Basuki;PRABUNINGRUM, Dita Sari
    • Journal of the Korean Wood Science and Technology
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    • v.48 no.1
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    • pp.32-40
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    • 2020
  • While the utilization of wood as a raw material in related industries has been increasing with the population increasing, the availability of wood from natural forests has continued to decline. An alternative to this situation is the manufacture of particleboard from non-wood lignocellulose materials through the modification of sandwich particleboard (SPb) using bamboo strands as reinforcement. In this study, strandsof belangke bamboo (Gigantochloa pruriens W) and tali bamboo (Gigantochloa apus) were utilized. The non-wood particles included sugar palm fibers, cornstalk, and sugarcane bagasse. The board was made in a three-layer composition of the face, back, and core in a ratio of 1: 2: 1. The binder used was 8% isocyanate resin. The sheet was pressed at a temperature of 160℃ for 5 min under a pressure of 3.0 N/㎟. Testing included physical and mechanical properties based on the JIS A 5908 (2003) standard, while acoustic testing was based on ISO 11654 (1997) standards. The results showed that using bamboo strands as reinforcement has an effect on the mechanical and physical properties of SPb. Almost all the types of boards met the JIS A 5908 (2003) standards, with the exception of thickness swelling (TS) and internal bond (IB) parameters. Based on the thickness swelling parameter, the C-type board exhibited the best properties. Overall, the B-type board thatused a belangke bamboo strand for the surface and sugarcane bagasse as the core underwent the best treatment. Based on the acoustical parameter, boards using a tali bamboo strand for the surface and sugar palm fiber as the core (E-type board) exhibited good sound absorption properties.

Suggested Improvement Strategies for the Efficient Review and Rational Operation of Institutional Review Board (IRB) Based on the Analysis of IRB Review Results (Institutional Review Board 심의 결과 분석을 통한 효율적 심사 및 합리적 운영에 대한 개선안 모색)

  • Lee, Yoon Jin;Jang, Hye Yun;Jang, Jung-Hee
    • The Journal of KAIRB
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    • v.4 no.1
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    • pp.5-15
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    • 2022
  • To suggest future directions for the improvement in the Institutional Review Board (IRB) review process and efficient operation of IRB, we have analyzed the IRB review results from 460 new research proposals submitted to the Review by the Convened IRB of the Keimyung University Dongsan Hospital IRB from January 2019 to July 2021. IRB is an independently established institutional committee to protect the human subjects by reviewing the research protocol in ethical as well as scientific aspects, so it is necessary to continuously contemplate the ethical versus scientific dilemma of 'what is ethical or scientific and what can actually protect human subjects.' Particularly, in this process, it is necessary to consider diverse ways to strengthen self-supervision through continuous Internal Audit rather than simple reporting outcomes. In addition, if it does not directly affect the protection of the human subjects, the discussion with the committee members is needed so that the comments such as administrative and typographical errors can be reduced as much as possible. Furthermore, as statistical analysis methods can have a significant impact on the safety of human subjects, if a legal basis and/or support related to statistics is provided for the composition of IRB members, a more specialized IRB review will be achieved.

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A Study on the Development of a Dry P0SCO E&C Fire Board Method with High Fire Resistance (건식화 P0SCO E&C Fire Board 공법 개발에 관한 연구)

  • Kim, Woo-Jae
    • Proceedings of the Korea Concrete Institute Conference
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    • 2008.11a
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    • pp.721-724
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    • 2008
  • The present study was to develop a dry PFB method similar to the existing gypsum board construction method in order to apply the existing wet PFB method that uses fire.resistant adhesive. It was found that the existing wet method can produce concrete compressive strength of 80MPa and fire resistance of 3 hours with 30mm PF boards. The goal of development in this study was fire resistance of 3 hours through dry construction of 15mm fire resistant boards. The results of fire resistance test showed an increase in thermal durability and thermal strain. It is believed that inorganic fiber reduces thermal strain, and lowers heat insulation performance by 15% or less. This suggests that heat insulation performance was improved by the change in the inner composition of PF board resulting from the adjustment of Al:Si mol ratio, high temperature molding, and dry curing. According to the results of fire resistance test, when the dry PF method was applied, the temperature of the main reinforcing bar was 116$^\circ$C in 15mm, 103.8$^\circ$C in 20mm, and 94$^\circ$C in 25mm, and these results satisfied the current standards for fire resistance control presented by the Ministry of Land, Transport and Maritime Affairs. When a 3 hour fire resistance test was performed and the external properties of the specimen were examined, the outermost gypsum board hardly remained and internal PF board maintained its form without thermal strain.

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Study on the Improvement of BGA Solderability in Electroless Nickel/Gold Deposit (무전해 Ni/Au 도금에서의 BGA Solderability 특성 개선에 관한 연구)

  • 민재상;황영호;조일제
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.3
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    • pp.55-62
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    • 2001
  • With a spread of BGA, CSP and fine pitch devices, the need of flatter surface finish in bare board is becoming more critical in solderability. The electroless Ni/Au plating has a solution of these needs and also has being spread to apply to surface finish for bare board in many electronic goods. But, the electroless Ni/Au plating had several issues such as Ni oxidation and phosphorous contents. Before this study, we studied on the effect of BGA solderability in electroless Ni/Au plating and chose some major factors such as the oxidation property of NiP plating and warpage of board. Firstly, we made test board with various plating conditions and improved the plating property through the improvement of NiP oxidation reducing P content. Also, we minimized the warpage of board with the improvement of inner layer structure and the analysis of warpage. For the evaluation of solderability, we analyzed the warpage of board and the plating property after mounting BGA on the board with optimizing conditions. The solder joint of BGA is investigated by SEM(Scanning Electronic Microscope) and OM(Optical Microscope). The composition of joint is used by EDS(Energy Dispersive Spectroscopy). We analyzed the fracture strength and mode by ball shear teser.

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A Study on the Wall Components of Sarang-taechong in the Upper Class houses of Chosun Dynasty (조선시대 상류주택 사랑대청의 실내입면구성요소에 관한 연구)

  • 오혜경;홍이경
    • Journal of Families and Better Life
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    • v.18 no.2
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    • pp.191-202
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    • 2000
  • The purpose of this study was to clarify the wall components of Sarang-taechong in the upper class houses of Chosun dynasty. Physical trace method was used for this study. The samples were taken from the Sarang-taechong of 6 traditional Korean houses; Yunkyungdang, the ancient Chusa estate, Sunkyojang, Chunghyodang, Yangjindant, Unjorn. The makor findings were summarized as follows; 1) The common components of each wall were pillars, sanginbangs(upper horizontal beams), hainbangs (lower horizontal beams), door and windows. Changbangs(wood eave pieces that suported decoration blocks), changyos(a pice of wood fitted between the tops of pillars and upper tori cross beams), and morums(the top wainscot board laid horizontally between the bottom beam and the bottom portion of a window frame) were additional. 2) The composition of every south wall was symmetrical and the other threes were mixed symmetrical and asymmetrical. 3) The image of wall was classified-fine, strong, and modera e, according to the symmetry or asymmetry of wall composition, the width of each components, the kind of window.

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Using NIR Spectrometry for Direct Control of Recovered Papers

  • Borel, Pascal;Sabater, Jacques;Tourtollet, Guy Eymin Petot;Cochaux, Alain;Veiga, Joseph
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.39 no.5
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    • pp.58-63
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    • 2007
  • This paper sums up all the different steps broached in this project : The NIR spectroscopy technique has been studied and implemented at CTP using a mobile spectrometer device and different optical materials. Methods, based on statistical data analysis (in particular PLS regressions), have been investigated. A laboratory "prototype" using these techniques and methods has been developed in order to control the recovered papers quality, in terms of humidity percentage and sample composition (paper, board, contaminants).