• Title/Summary/Keyword: Board composition

Search Result 131, Processing Time 0.031 seconds

Prediction of Impact Life Time in Solder Balls of the Board Level Flip Chips by Drop Simulations (낙하해석을 통한 보드 레벨 플립칩에서의 솔더볼 충격수명에 관한 연구)

  • Jang, Chong Min;Kim, Seong Keol
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.23 no.3
    • /
    • pp.237-242
    • /
    • 2014
  • Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result. The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.

Low ionization state plasma in CMEs

  • Lee, Jin-Yi;Raymond, John C.
    • The Bulletin of The Korean Astronomical Society
    • /
    • v.37 no.2
    • /
    • pp.115.1-115.1
    • /
    • 2012
  • The Ultraviolet Coronagraph Spectrometer on board the Solar and Heliospheric Observatory (SOHO) observes low ionization state coronal mass ejection plasma at ultraviolet wavelengths. The CME plasmas are often detected in O VI ($3{\times}10^5K$), C III ($8{\times}10^4K$), $Ly{\alpha}$, and $Ly{\beta}$. Earlier in situ observations by the Solar Wind Ion Composition Spectrometer (SWICS) on board Advanced Composition Explorer (ACE) have shown mostly high ionization state plasmas in interplanetary coronal mass ejections (ICME) events, which implies that most CME plasma is strongly heated during its expansion in solar corona. In this analysis, we investigate whether the low ionization state CME plasmas observed by UVCS occupy small enough fractions of the CME volume to be consistent with the small fraction of ICMEs measured by ACE that show low ionization plasma, or whether the CME must be further ionized after passing the UVCS slit. To do this, we determine the covering factors of low ionization state plasma for 10 CME events. We find that the low ionization state plasmas in CMEs observed by UVCS show small covering factors. This result shows that the high ionization state ICME plasmas observed by the ACE results from a small filling factor of cool plasma. We also find that the low ionization state plasma volumes in faster CMEs are smaller than in slower CMEs. Most slow CMEs in this analysis are associated with a prominence eruption, while the faster CMEs are associated with X-class flares.

  • PDF

A Web-based Virtual Experiment Kit for Digital Logic Circuits Using Java Applets (자바 애플릿을 이용한 웹 기반 디지털 논리회로 가상실험키트)

  • Kim, Dong-Sik;Kim, Ki-Woon;Park, Sang-Yun;Seo, Sam-Jun
    • Proceedings of the KIEE Conference
    • /
    • 2003.07d
    • /
    • pp.2717-2719
    • /
    • 2003
  • In this paper, we developed an efficient virtual experiment kit with creative and interactive multimedia contents, which can be used to enhance the quality of education in the area of digital logic circuits. Since our virtual experiment kit is implemented to describe the on-campus laboratory, the learners can obtain similar experimental data through it. Also, our web-based virtual experiment kit is designed to enhance the efficiency of both the learners and the educators. The learners will be able to achieve high learning standard and the educators save time and labor. The virtual experiment is performed according to the following procedure: (1) Circuit Composition on the Bread Board (2) Applying Input Voltage (3) Output Measurements (4) Checkout of Experiment Results. Furthermore, the circuit composition on the bread board and its corresponding online schematic diagram are displayed together on the virtual experiment kit for the learner's convenience. Finally, we have obtained several affirmative effects such as reducing the total experimental hours and the damage rate for experimental equipments and increasing learning efficiencies as well as faculty productivity.

  • PDF

Development of Bamboo Zephyr Composite and the Physical and Mechanical Properties

  • SUMARDI, Ihak;ALAMSYAH, Eka Mulya;SUHAYA, Yoyo;DUNGANI, Rudi;SULASTININGSIH, Ignasia Maria;PRAMESTIE, Syahdilla Risandra
    • Journal of the Korean Wood Science and Technology
    • /
    • v.50 no.2
    • /
    • pp.134-147
    • /
    • 2022
  • The objective of this study is to determine the effect of fiber direction arrangement and layer composition of hybrid bamboo laminate boards on the physical and mechanical properties. The raw material used was tali bamboo (Gigantochloa apus (J.A. & J.H. Schultes) Kurs) rope in the form of flat sheets (zephyr) and falcata veneer (Paraserianthes falcataria (L) Nielsen). Zephyr bamboo was arranged in three layers using water-based isocyanate polymer (WBPI) with a glue spread rate of 300 g/m2. There were variations in the substitution of the core layer with falcata veneers (hybrid) as much as two layers and using a glue spread rate of 170 g/m2. The laminated bamboo board was cold-pressed at a pressure of 22.2 kgf/cm2 for 1 h, and the physical and mechanical properties were evaluated. The results showed that the arrangement of the fiber direction significantly affected the dimensional stability, modulus of rupture, modulus of elasticity, shear strength, and screw withdrawal strength. However, the composition of the layers had no significant effect on the physical and mechanical properties. The bonding quality of bamboo laminate boards with WBPI was considered to be quite good, as shown by the absence of delamination in all test samples. The bamboo hybrid laminate board can be an alternative based on the physical and mechanical properties that can meet laminated board standards.

Composition of a Nonlinear Storytelling Board while Maintaining Vertical and Horizontal Context of Scenes (비선형 스토리텔링보드 구성과 종적 횡적 장면의 맥락 유지)

  • Hongsik Pak;Suhyeon Choi;Taegu Lee
    • The Journal of the Convergence on Culture Technology
    • /
    • v.9 no.4
    • /
    • pp.423-430
    • /
    • 2023
  • This dissertation discusses the formulation of a nonlinear storytelling board that preserves the contextual perspective of characters. Storytelling encompasses the director's creative intention by leveraging the interaction of various elements to construct a logical narrative that explores cause and effect. Its primary objective is to enhance viewers' empathy. Consequently, there is a pressing need for comprehensive research on differentiating storytelling from storyboarding. Moreover, the integrated approach to storytelling and storyboarding holds scholarly value in understanding the process of narrative composition and visualization. Thus, a study proposes a method for constructing nonlinear storytelling boards considering the discrete camera perspective and contextual scene continuity, ultimately contributing to visual complexity and correlation comprehension. This approach enables a careful and simultaneous consideration of the correlations that deepen cognition, including the physical, emotional, and event rhythms mentioned in Karen Perlman's theory.

The Effects of UBM and SnAgCu Solder on Drop Impact Reliability of Wafer Level Package

  • Kim, Hyun-Ho;Kim, Do-Hyung;Kim, Jong-Bin;Kim, Hee-Jin;Ahn, Jae-Ung;Kang, In-Soo;Lee, Jun-Kyu;Ahn, Hyo-Sok;Kim, Sung-Dong
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.17 no.3
    • /
    • pp.65-69
    • /
    • 2010
  • In this study, we investigated the effects of UBM(Under Bump Metallization) and solder composition on the drop impact reliability of wafer level packaging. Fan-in type WLP chips were prepared with different solder ball composition (Sn3.0Ag0.5Cu, and Sn1.0Ag0.5Cu) and UBM (Cu 10 ${\mu}m$, Cu 5 ${\mu}m$\Ni 3 ${\mu}m$). Drop test was performed up to 200 cycles with 1500G acceleration according to JESD22-B111. Cu\Ni UBM showed better drop performance than Cu UBM, which could be attributed to suppression of IMC formation by Ni diffusion barrier. SAC105 was slightly better than SAC305 in terms of MTTF. Drop failure occurred at board side for Cu UBM and chip side for Cu\Ni UBM, independent of solder composition. Corner and center chip position on the board were found to have the shortest drop lifetime due to stress waves generated from impact.

Difference of Potential Range Formed at the Anode Between Water Drop Test and Temperature Humidity Bias Test to Evaluate Electrochemical Migration of Solders for Printed Circuit Board

  • Young Ran Yoo;Young Sik Kim
    • Corrosion Science and Technology
    • /
    • v.22 no.3
    • /
    • pp.153-163
    • /
    • 2023
  • Two types of accelerated tests, Water Drop Test (WDT) and Temperature-Humidity-Bias Test (THBT), can be used to evaluate the susceptibility to electrochemical migration (ECM). In the WDT, liquid water is directly applied to a specimen, typically a patterned conductor like a printed circuit board. Time to failure in the WDT typically ranges from several seconds to several minutes. On the other hand, the THBT is conducted under elevated temperature and humidity conditions, allowing for assessment of design and life cycle factors on ECM. THBT is widely recognized as a more suitable method for reliability testing than WDT. In both test methods, localized corrosion can be observed on the anode. Composition of dendrites formed during the WDT is similar to that formed during THBT. However, there is a lack of correlation between the time to failure obtained from WDT and that obtained from THBT. In this study, we investigated the relationship between electrochemical parameters and time to failure obtained from both WDT and THBT. Differences in time to failure can be attributed to actual anode potential obtained in the two tests.

Physical and Mechanical Properties of Panels Fabricated with Particle and Fiber by Composition Types (구성형태(構成形態)에 따른 파티클과 파이버로 제조(製造)한 패널의 물리적 및 기계적 성질)

  • Yoon, Hyoung-Un;Lee, Phil-Woo
    • Journal of the Korean Wood Science and Technology
    • /
    • v.20 no.2
    • /
    • pp.9-22
    • /
    • 1992
  • The aim of this research was to investigate physical and mechanical properties of various composition panels, each fabricated with a ratio of fiber to particle of 2 to 10. Type A consisted of fiber-faces and particle-core in layered-mat system. Type B consisted of fiberboard-faces on particleboard-core. Type C consisted of fibers and particles in mixed-mat system. The results obtained from tests of bending strength, internal bond, screw holding strength and stability were as follows: 1. The bending strength and internal bonding of both the Type A panel and the Type B panel were higher than those of the Type C panel and three-layered particle board. 2. The mechanical properties of the Type C panel showed the lowest values of all composition methods. It seems that the different compression ratios of the particle and fiber interrupted the densification of the fibers when hot pressed. 3. The dimensional stability of layered-mat system panels consising of fiber-faces and particle-core was better the than control particleboard. 4. In composition methods of particle and fiber, layered-composition method was more resonable than mixed-composition. The Type B panel had the highest mechanical properties of all the composition types. 5. The Type A panel was considered the ideal composition method because of its resistance to delamination between the particle-layer and the fiber-layer and because of its lower adhesive content and more effective manufa cturing process.

  • PDF

Suggestions for the Improvement of Aviation and Railway Accident Investigation Board in Korean (항공사고조사위원회의 업무개선에 대한 제언)

  • Han, KyoungKeun;Choi, YounChul
    • Journal of the Korean Society for Aviation and Aeronautics
    • /
    • v.25 no.4
    • /
    • pp.187-194
    • /
    • 2017
  • ICAO Universal Safety Oversight Audit Programme is a comprehensive evaluation for aviation safety matters, including aircraft operation, licensing and aircraft incident/accident investigation. As this programme is measures aviation safety level of States, there is a need to meet international standards, especially in the field of aircraft incident/accident investigation. This research discusses points required to satisfy international standards, which are independence and autonomy of an accident investigation board, the lack of the enough number of investigators and efficient management of those personnel, the effective composition and use of an investigation report, an accident investigation itself to build big data and the creation of a cooperation system among States. This paper suggests various opinions in order to enhance aviation safety especially through aircraft accident investigations, using case studies from the US, UK and Japan.

Fabrication of LTCC Multi-layer Circuit Board made of Glass-Al2O3 Composites (Glass-Al2O3 복합소재를 원료로 한 LTCC 다층회로 기판의 제조)

  • Kwak, Hun;Jeon, Hyung-Do;Kim, Hwan;Lee, Won-Jae;Shin, Byoung-Chul;Kim, Il-Soo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.21 no.6
    • /
    • pp.509-516
    • /
    • 2008
  • Multi-layer circuit card for semiconductor inspection was fabricated by LTCC technology. After a proper impedance design without electrical interference, ceramic tapes with the composition of $CaO-Al_2O_3-SiO_2-B_2O_3$ glass and $Al_2O_3$ were prepared. The electrode with silver paste printed on the tape. Printed ceramic sheets were then laminated and sintered. Densities and dielectric properties were measured. The microstructure, fracture surface of the region of via and matching state of substrate-electrode were observed. The durability of plated outside electrode were examined by hardness and scratch test.