• Title/Summary/Keyword: Board Design

Search Result 1,729, Processing Time 0.037 seconds

The analysis on the possibility of applying carbon board pattern design using the woodcut technique to Interior decorating materials (목판화 기법을 활용한 carbon board용 pattern design과 interior 장식재로서의 적용 가능성 분석)

  • Kim, Eun-Ju
    • Journal of the Korean Crystal Growth and Crystal Technology
    • /
    • v.21 no.1
    • /
    • pp.27-33
    • /
    • 2011
  • Carbon board, an electromagnetic shielding new material, is expected to be applied to the art wall by combining draft designs. When environment-friendly architecture materials are used as an interior wall, they are suitable as finishing materials. According to the increasing tendency of the application of carbon board, various styles could be made by decorating the whole or a part of a wall with tiles with module structure or by patterning the wall with panel-type woodcut or pictures or sculpture. And more graphic design based on diverse variation, and reconstruction and combination between other motif is being on the rise as a new expression. In this paper, make it possible to applying in MDF board and carbon board pattern design using the woodcut technique. The structural and physical properties were compared by usability of abrasion, toughness, stability. Samples are analyzed dependent on the hardness and relative density, change of detail pattern design and trimming technique. These results have shown that the possibility of applying of carbon board can be a high rank interior materials, capable of creating value of the living system, connects with MDF board, also can express humanism in a beautiful manner.

Development of a Optimum Inward Design Software for Corrugated Board (Corrugated Board의 최적내형설계 소프트웨어 개발)

  • Park, Jong-Min
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
    • /
    • v.10 no.1
    • /
    • pp.27-36
    • /
    • 2004
  • Software summarized packaging technology related is needed for low cost and high efficiency in production and packaging design of corrugated board, and in development of these softwares, distribution and packaging environment of one's country must be reflected, well. In domestic occasion, software related to corrugated board packaging dont's exist nearly, and in many industrial fields, the more higher role and importance of packaging in various industrial field is, the more higher necessity of that is. In this study, on the base of preceeding studies (Park, 2001; 2003; 2003), software to optimize board combination that is most importance and sensitivity in composition of cost elements in production and packaging design of corrugated board was developed. This software was composed of input module, output module, database and management module, and calculation module, and efficiency of this software was analyzed on the both sides of sensitivity in design result and effectiveness in a case analyse. In the inward design results having same strength, board combination balance, bursting strength, box weight, and cost were greatly different. Therefore, optimum inward design according to user's design specifications is possible, and in a case analysis for actual products, obtained the more profitable results than before design.

  • PDF

IO BOARD DESIGN OF NEXT GENERATION SATELLITE USING THE SPACE WIRE INTERFACE

  • Kwon Ki-Ho;Kim Day-Young;Choi Seung-Woon;Lee Jong-In
    • Bulletin of the Korean Space Science Society
    • /
    • 2004.10b
    • /
    • pp.223-226
    • /
    • 2004
  • This paper presents a feasibility study of an advanced IO board design for the next generation of low-earth orbit satellites. Advanced IO board design includes sensor interface, NO, D/A, Digital Module, Serial Module etc, and allows to process increasing data rates between IO board and CPU board. The higher data rate involved in modem IO board additionally introduce issues such as noise, fault tolerance, command and data handling, limited pin count and power consumption problems. The experience in KOMPSAT-l and 2 program with this kind of problems resulted in using SMCS chip set, a high speed serial link technology based on IEEE-1355 (Space Wire Protocol) (ESA-ESTEC 2003, Parkes 1999), as a standard for next generation of satellite IO board design.

  • PDF

A Prototyping Tool of Free-Coding-Type Microcontroller Board for Design Education

  • Nam, Wonsuk
    • International Journal of Advanced Culture Technology
    • /
    • v.6 no.3
    • /
    • pp.129-141
    • /
    • 2018
  • As the scope of social expectations and roles in the design field has expanded, the demand for education to cope with changes in the technology environment is increasing in design education. In response to this trend, microcontroller board-type design-prototyping tools have also been introduced into design education, and much educational content is being developed. However, there is the perception that students who are majoring in design without engineering knowledge are still barred from entry. A variety of educational content and tools have been developed to solve these difficulties, although there are several limitations to their practical application. Especially, in the design education courses in universities, the functional expectation level for prototyping is high, but most of the content developed for solving the difficulties has been developed for the lower education levels, and it could be said that a great deal of learning is necessary to solve the problem. In this study, students were asked about microcontroller board utilization and their satisfaction with their design through questionnaires and with the developed microcontroller board development direction via Focus Group Interviews. Based on this, we tested microcontroller boards that eliminate the coding process and which students can use to create and prototype their work as a suggestion to fulfil demand. After using the board, both the usability and improvement of the product were checked. Confirmation of the usefulness of the free- coding-type microcontroller was obtained through this study along with the possibility of responding to various educational demands by applying the application design related to this product.

Optimum Design of Packaging Container for Bulk Materials(I)-Algorithm Development (벌크화물용 포장용기의 최적 설계(I)-알고리즘 개발)

  • Park, Jong-Min;Kwon, Soon-Goo
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
    • /
    • v.6 no.1
    • /
    • pp.1-11
    • /
    • 2000
  • In optimum design of packaging container for bulk materials, minimum board area, compression performance and distribution efficiency must be considered. In this study, mathematical models for minimum board area (RMA), compression strength (CS) and maximum compression strength per unit board area (MCSA) of container as algorithm for optimum design of packaging conatiner for bulk materials were developed as follows : RMA=f(V,D), ${\alpha}_{RMA}=f(V,D)$, MCSA=f(V,D), and ${\alpha}_{MCSA}=f(V,D)$. In order to develop these models, compression test according to various dimensions of container and response surface analysis for minimum board area, compression strength, and maximum compression strength per unit board area of container were carried out. In developed models, volume and depth of container were principal independent variables. Through the verified results for these models, optimum design of packaging container on the design conditions and limit conditions was possible. These models might be used in developing optimum design software of packaging container for bulk materials.

  • PDF

Implementation of PNP on the Control Board using Hardware/Software Co-design

  • Kim, Si-hwan;Lin, Chi-ho;Kim, Hi-seok
    • Proceedings of the IEEK Conference
    • /
    • 2002.07a
    • /
    • pp.305-308
    • /
    • 2002
  • This paper proposes a control board that includes PNP function with extensibility and effective allocation of allocation. The object of study is to overcome limited extensity of old systems and it is to reuse the system. The system recognizes automatic subsystem from application of main system with board level that is using hardware and software co-design method. The system has both function of main-board and sub-board. So one system can operate simultaneously such as module of alien system. This system has advantages that are fast execution, according as process functional partition to hardware/ software co-design and board size is reduced as well as offer extensity of development system. We obtained good result with control board for existent Z-80 training kit.

  • PDF

Structural Design and Analysis of Sandwich Composite Structure for Floor Board Structure (샌드위치 복합재 바닥 구조물의 구조 설계 및 해석)

  • Park, Hyunbum
    • Journal of Aerospace System Engineering
    • /
    • v.11 no.6
    • /
    • pp.64-67
    • /
    • 2017
  • This work dealt with structural safety analysis about sandwich composite structure of automotive floor board. In this work, structural design and analysis of sandwich composite structure for automobile floor board were performed. Firstly, structural design requirement of automobile floor board was investigated. After structural design, the structural analysis of the automobile floor board were performed by the finite element analysis method. It was performed that the stress and displacement analysis at the applied load condition. After structural test of target structure, structural test results were compared with analysis results. Through the structural analysis, it was confirmed that the designed floor board structure is safety.

Development of a Computer Program for Bulk-type Container Design using Optimum Design Parameter Analysis (산물형 포장상자의 최적설계 요인분석에 의한 설계 프로그램 개발)

  • 박종민
    • Journal of Biosystems Engineering
    • /
    • v.28 no.4
    • /
    • pp.315-324
    • /
    • 2003
  • If an optimum design technique is applied in the design of packaging container for bulk-type products, merits on the side of not only economic and compression performance but distribution efficiency are expected. Accordingly, minimum board area (mRBA), compression strength (CS) and compression strength per unit area (mCSPA) are important design parameters in optimum design of packaging container for bulk-type products. In this study, mathematical models for mRBA, CS and mCSPA of container as algorithm for optimum design program were developed. In order to develop these models, compression test by various dimensions of container and response surface analysis for mRBA, CS, and mCSPA of container were carried out. In the developed models, volume, W/L ratio and depth of container were principal independent variables. On the found of these models, optimum design program having faculties of outward and inward optimum design and information design was developed. Though the packaging specifications are same, required board area, board combination and cost of the corrugated board required container manufacture were greatly different by boundary conditions in outward design. Moreover, about 6.3∼10.1% in weight of container was lighter, and about 13.2∼25.6% in cost of container was reduced when the program was applied for 2 kinds of bulk-type products.

Evaluation of Physical, Mechanical Properties and Pollutant Emissions of Wood-Magnesium Laminated Board (WML Board) for Interior Finishing Materials

  • PARK, Hee-Jun;JO, Seok-Un
    • Journal of the Korean Wood Science and Technology
    • /
    • v.48 no.1
    • /
    • pp.86-94
    • /
    • 2020
  • This study serves as basic research for the development of a new wood-based building finishing material that improved the weakness of inorganic materials such as gypsum board and magnesium board widely used as interior finishing materials and brought out the strength of the wood. The results of evaluating the physical and mechanical properties and the environmental effect related to hazardous substance discharge having manufactured a wood-magnesium laminated composite are as follows. The thermal conductivity and thermal resistance of WML board was improved by about 28~109 percent over magnesium board due to the low thermal conductivity of wood. The adhesive strength of WML board showed a similar result to that of plywood as it exceeds 0.7N/㎟, the adhesive standard of wood veneer which is presented by KS F 3101. Bending strength and screw holding strength were more improved by manufacturing WML board than magnesium board. The WML board manufactured in this study satisfied the criteria for emissions of hazardous substances prescribed in the Indoor Air Quality Control Act, and confirmed the possibility of development as a new wood-based composite material that can replace existing inorganic materials.

Modularization Design of On-board Train control Software for EMU using MATLAB (MATLAB을 이용한 전동차용 저어 S/W 모듈화 설계 연구)

  • Han, Seong-Ho;Lee, Su-Gil;Kim, Su-Gon;Ahn, Tae-Ki;Lee, Woo-Dong
    • Proceedings of the KIEE Conference
    • /
    • 2001.07b
    • /
    • pp.1220-1222
    • /
    • 2001
  • We proposed a modularization design technique for implementing software of on-board train control system. We already proved the efficiency of CASE Tool(SCADE) for safety critical software design. The several functions of train are implemented on CASE tool each modules. We divided functions of train into modules based on the modularization design. We used MATLAB for design of on-board train control software. We proved that this technique is more useful for the software design of on-board train control for EMU.

  • PDF