• ETRI Journal
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• v.34 no.5
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• pp.649-654
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• 2012

This paper presents a novel 16-quadrature-amplitude-modulation (QAM) E-band communication system. The system can deliver 10 Gbps through eight channels with a bandwidth of 5 GHz (71-76 GHz/81-86 GHz). Each channel occupies 390 MHz and delivers 1.25 Gbps using a 16-QAM. Thus, this system can achieve a bandwidth efficiency of 3.2 bit/s/Hz. To implement the system, a driver amplifier and an RF up-/down-conversion mixer are implemented using a $0.1{\mu}m$ gallium arsenide pseudomorphic high-electron-mobility transistor (GaAs pHEMT) process. A single-IF architecture is chosen for the RF receiver. In the digital modem, 24 square root raised cosine filters and four (255, 239) Reed-Solomon forward error correction codecs are used in parallel. The modem can compensate for a carrier-frequency offset of up to 50 ppm and a symbol rate offset of up to 1 ppm. Experiment results show that the system can achieve a bit error rate of $10^{-5}$ at a signal-to-noise ratio of about 21.5 dB.

• Journal of KIISE:Computer Systems and Theory
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• v.30 no.12
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• pp.749-755
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• 2003

Digital signal processing hardware based in RNS is currently considered as an important method for high speed and low cost hardware realization. This research designs and implements the method for conversion from a specific residue number system with moduli of the from $(2^k-1, 2^k, 2^k+1)$ to a weighted number system. Then, it simulates the implementation using a overlapped multiple-bit scanning method in the process of CRT conversion. In conclusion, the simulation shows that the CRT method which is adopted in this research, performs arithmetic operations faster than the traditional approaches, due to advantages of parallel processing and carry-free arithmetic operation.

• Journal of Radiation Protection and Research
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• v.12 no.1
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• pp.12-25
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• 1987

A basic multichannel analyser (MCA) system have been designed and constructed with the successive approximation type ADC (Analog to Digital Converter). Linear Gate, window, and palse stretcher consist of mainly linear and logic IC's, and are properly combined together to achieve short dead time and good linearity of the system. ADC 1211 (analysing time: $120{\mu}sec$) and S-RAM (static random acess memory) 6264 are used in ADC module. Two 6264 memories are connected in parallel in order to-provide enough counting capacity ($2^{16}-1$). Interfaced microcomputer Apple II controls this system and analizes the counted data. The system is tested by input pulses between 0V to 10V from oscillator.

• Proceedings of the Korea Information Processing Society Conference
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• 2021.11a
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• pp.201-204
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• 2021

PIPO 경량 블록암호는 ICISC'20에서 발표된 암호이다. 본 논문에서는 PIPO의 단일 평문 최적화 구현과 4평문 병렬 구현을 제안한다. 단일 평문 최적화 구현은 Rlayer의 최적화와 키스케쥴을 포함하지 않은 구현을 진행하였다. 결과적으로 키스케쥴을 포함하는 기존 연구 대비 70%의 성능 향상을 확인하였다. 4평문의 경우 32-bit 레지스터를 최대한 활용하여, 레지스터 내부 정렬과 Rlayer의 최적화 구현을 진행하였다. 또한 Addroundkey 구현에서 메모리 최적화 구현과 속도 최적화 구현을 나누어 구현하였다. 메모리 사용을 줄인 메모리 최적화 구현은 단일 평문 구현 대비 80%의 성능 향상을 확인하였고, 암호화 속도를 빠르게 구현한 속도 최적화 구현은 단일 평문 구현 대비 157%의 성능 향상을 확인하였다.

• ETRI Journal
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• v.46 no.2
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• pp.323-332
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• 2024

Receiver and transmitter monolithic microwave integrated circuit (MMIC) multifunction chips (MFCs) for active phased-array antennas for Ka-band satellite communication (SATCOM) terminals have been designed and fabricated using a 0.15-㎛ GaAs pseudomorphic high-electron mobility transistor (pHEMT) process. The MFCs consist of four-channel radio frequency (RF) paths and a 4:1 combiner. Each channel provides several functions such as signal amplification, 6-bit phase shifting, and 5-bit attenuation with a 44-bit serial-to-parallel converter (SPC). RF pads are implemented on the bottom side of the chip to remove the parasitic inductance induced by wire bonding. The area of the fabricated chips is 5.2 mm × 4.2 mm. The receiver chip exhibits a gain of 18 dB and a noise figure of 2.0 dB over a frequency range from 17 GHz to 21 GHz with a low direct current (DC) power of 0.36 W. The transmitter chip provides a gain of 20 dB and a 1-dB gain compression point (P1dB) of 18.4 dBm over a frequency range from 28 GHz to 31 GHz with a low DC power of 0.85 W. The P1dB can be increased to 20.6 dBm at a higher bias of +4.5 V.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.3
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• pp.628-636
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• 2010

In this paper, we present a new type high speed parallel multiplier for performing the multiplication of two polynomials using standard basis in the finite fields GF($2^m$). Prior to construct the multiplier circuits, we design the basic cell of vector code generator(VCG) to perform the parallel multiplication of a multiplicand polynomial with a irreducible polynomial and design the partial product result cell(PPC) to generate the result of bit-parallel multiplication with one coefficient of a multiplicative polynomial with VCG circuits. The presented multiplier performs high speed parallel multiplication to connect PPC with VCG. The basic cell of VCG and PPC consists of one AND gate and one XOR gate respectively. Extending this process, we show the design of the generalized circuits for degree m and a simple example of constructing the multiplier circuit over finite fields GF($2^4$). Also, the presented multiplier is simulated by PSpice. The multiplier presented in this paper uses the VCGs and PPCS repeatedly, and is easy to extend the multiplication of two polynomials in the finite fields with very large degree m, and is suitable to VLSL.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.3
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• pp.171-183
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• 2018

Herein, we show the design and fabrication of a serial-to-parallel converter (SPC) using the $0.25-{\mu}m$ GaAs pHEMT process. The serial-to-parallel converter is composed of four bits to control the four phase shifters used in the core chip. The SPC stores the received serial data signal to a register in the SPC and converts the stored data into the parallel data. Each converted output data can control four phase shifters. The size of the fabricated SPC is $1,200{\times}480{\mu}m^2$ and it uses two DC power supplies of 5 V and -3 V. The consumption current of each DC power supply is 7.1 mA for 5 V, and 2.1 mA for -3 V.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.9 no.4
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• pp.1457-1470
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• 2015

In wireless multimedia sensor networks (WMSN), the latency of transmission is an increasingly problem. With the improvement of resolution, the time cost in image and video compression is more and more, which seriously affects the real-time of WMSN. In JPEG system, the core of the system is DCT, but DCT-JPEG is not the best choice. Block-based DCT transform coding has serious blocking artifacts when the image is highly compressed at low bit rates. APBT is used in this paper to solve that problem, but APBT does not have a fast algorithm. In this paper, we analyze the structure in JPEG and propose a parallel framework to speed up the algorithm of JPEG on GPU. And we use all phase biorthogonal transform (APBT) to replace the discrete cosine transform (DCT) for the better performance of reconstructed image. Therefore, parallel APBT-JPEG is proposed to solve the real-time of WMSN and the blocking artifacts in DCT-JPEG in this paper. We use the CUDA toolkit based on GPU which is released by NVIDIA to design the parallel algorithm of APBT-JPEG. Experimental results show that the maximum speedup ratio of parallel algorithm of APBT-JPEG can reach more than 100 times with a very low version GPU, compared with conventional serial APBT-JPEG. And the reconstructed image using the proposed algorithm has better performance than the DCT-JPEG in terms of objective quality and subjective effect. The proposed parallel algorithm based on GPU of APBT also can be used in image compression, video compression, the edge detection and some other fields of image processing.

• Journal of KIISE:Computer Systems and Theory
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• v.30 no.10
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• pp.586-594
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• 2003

X-Match algorithm is a lossless compression algorithm suitable for hardware implementation owing to its simplicity. It can compress 32 bits per clock cycle and is suitable for real time compression. However, as the bus width increases 64-bit, the compression unit also need to increase. This paper proposes the cooperative parallel X-Match (X-MatchCP) algorithm, which improves the compression speed by performing the two X-Match algorithms in parallel. It searches the all dictionary for two words, combines the compression codes of two words generated by parallel X-Match compression and outputs the combined code while the previous parallel X-Match algorithm searches an individual dictionary. The compression ratio in X-MatchCP is almost the same as in X-Match. X-MatchCP algorithm is described and simulated by Verilog hardware description language.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.5
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• pp.737-748
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• 1995

In this paper, we studyed the variables in the design of multichip memory modules with 4M$\times$1bit DRAM chips to construct high capacity and high speed memory modules. The configuration of the module was 8 bit, 16 bit, and 32 bit DRAM modules with employing 0.6 W, 70 nsec 4M$\times$1 bit DRAM chips. We optimized routing area and wiring density by performing the routing experiment with the variables of the chip allocation, module I/O terminal, the number of wiring, and the number of mounting side of the chips. The multichip module was designed to be able to accept MCM-L techiques and low cost PCB materials. The module routing experiment showed that it was an efficient way to align chip I/O terminals and module I/O terminals in parallel when mounting bare chips, and in perpendicular when mounting packaged chips, to set module I/O terminals in two sides, to use double sided substrates, and to allocate chips in a row. The efficient number of wiring layer was 4 layers when designing single sided bare chip mounting modules and 6 layers when constructing double sided bare chip mounting modules whereas the number of wiring layer was 3 layers when using single sided packaged chip mounting substrates and 5 layers when constructing double sided packaged chip mounting substrates. The most efficient configuration was to mount bare chips on doubled substrates and also to increase the number of mounting chips. The fabrication of memory multichip module showed that the modules with bare chips can be reduced to a half in volume and one third in weight comparing to the module with packaged chips. The signal propagation delay time on module substrate was reduced to 0.5-1 nsec.