• Korean Journal of Materials Research
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• v.9 no.4
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• pp.373-377
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• 1999

The cure mechanicsm and cure kinetics of diglycidyl ether of bisphenol A(DGEBA)/4,4'-methylene dianiline(MDA)/nitrile(MN, SN, GN) systems were studied by FT-IR and DSC to develop new applications in the biomedical polymer fields. The network structure of the DGEBA/MDA system was changed to the chain-extended network structure by the addition of nitriles. The reactions contributed to the chain extension were the primary amine-nitrile and hydroxyl-nitrile reactions. The chain-extended network structure could be indirectly proved by the decrement of T\ulcorner and the increment of impact strength with the increasing nitrile content. The cure rate of DGEBA/MDA/nitrile system was lower than that of DGEBA/MDA system due to the disturbance of nitrile group in the reaction of primary amine and epoxide groups.

• Journal of Advanced Marine Engineering and Technology
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• v.8 no.2
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• pp.81-87
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• 1984

The effect of heat treatment and mechanical stress on the dielectic strength of epoxy resin film is studied. The film with 30-210 .mu.m thickness are casted at room temperature for 8 hours and post cured at the range of temperature 60-180 .deg. C, and the heat setting time are two kind, ie, 2 and 10 hours. The samples are made with Stycast 1266 that the primary compound is diglycidyl ether of bisphenol A, and the hardner is denaturated polyamines. Under no mechanical stresses, the maximum dielectric strength of the sample is obtained for the sample heat treated for 2 hours at 150 .deg. C. However, the best dielectric strength characteristics under compressive stress is obtained for the sample heat treated at 90 .deg. C and 120 .deg. C. The dielectric strength of the sample are also affected significantly by the cooling velocity of the sample after post heat setting at given temperature.

• Proceedings of the KIEE Conference
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• 1987.11a
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• pp.499-503
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• 1987

The electrical characteristics of Epoxy Robin vary with temperature. In this study, the variation of the electric characteristics of Epoxy Resin with various hardening temperature was studied. Epoxy Resin used as samples are Epotohto YD-128 of Diglycidyl Ether of Bisphenol A (DGEBA) series and hardener, Goodmide G-240. It's mixing rate is 3 to 1. Hardening temperature was varied from 25[$^{\circ}C$] to 50[$^{\circ}C$] by 5[$^{\circ}C$]. During the hardening progress, illumination, resistivity and the internal temperature of material which were dependet on the variety of hardening temperature were measured. The electrical properties of hardened samples were examined by means of X-ray diffraction, tan $\delta$ test, TG-DTA analysis and treeing test. On this basis, optimal hardening temperature in insulation characteristics was examined.

• The Korean Journal of Rheology
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• v.11 no.1
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• pp.50-56
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• 1999

Melt blends of polyamide 6 (PA 6) with polyester elastomer (PEL) were prepared in a corotating twin screw extruder using two types of coupling agent(CA), viz. diglycidyl ether of bisphenol A (DGEBA) and 1,4-phenylene bis(2-oxazoline) (PBO). Notched impact strength of PA 6 as well as PA 6/PEL blends increased with the addition of coupling agent, especially with DGEBA and the maximum impact toughening of the blend was obtained with 0.6%(by mol) DGEBA, where a minimum domain size was observed from SEM. Melt viscosities of the untreated blends were higher than those of base resins at low frequencies. Viscosities of base resins as well as blends increased with the addition of CA, and the effect was much more pronounced with DGEBA, especially for PA 6 and PA 6-rich blends.

• Journal of Adhesion and Interface
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• v.4 no.3
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• pp.33-40
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• 2003

In this work, diglycidyl ether of bisphenol A (DGEBA)/polyetherimide (PEI) blends were cured using 4,4-diaminodiphenyl methane (DDM). And the effects of addition of different PEI contents to neat DGEBA were investigated in the thermal properties and fracture toughness of the blends. The contents of contents of containing PEI were varied in 0, 2.5, 5, 7.5, and 10 phr. The cure activation energies ($E_a$) of the cured specimens were determined by Kissinger equation and the mechanical interfacial properties of the specimens were performed by critical stress intensity factor ($K_{IC}$). Also their surfaces were examined by using a scanning electron microscope (SEM) and the surface energetics of blends was determined by contact angles. As a result, $E_a$ and $K_{IC}$ showed maximum values in the 7.5 phr PEI. This result was interpreted in the increment of the network structure of DGEBA/PEI blends. Also, the surface energetics of the DGEBA/PEI blends showed a similar behavior with the results of $K_{IC}$. This was probably due to the improving of specific or polor component of the surface free energy of DGEBA/PEI blends, resulting in increasing the hydrogen bonding of the hydroxyl and imide groups of the blends.

• Polymer(Korea)
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• v.25 no.2
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• pp.199-207
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• 2001

In the present study the cure behavior of diglycidyl ether of bisphenol-A(DGEBA) using an anhydride-based hardener in the presence of N,N-dimethyl benzyl amine (BDMA) or 1-cyanoethyl-2-ethyl-4-methyl imidazole (2E4MZ-CN) as an accelerator has been monitored and interpreted from the viewpoint of photophysical properties by means of fluorescence spectroscopy. To do this, 1,3-bis-(1-pyrene)propane (BPP) was well incorporated in the epoxy resin system by mechanical blending. The BPP probe, which is very sensitive to conformational change of the molecule influenced by the surrounding medium, successfully formed intramolecular excimer fluorescence. It is susceptible to the micro-viscosity or local viscosity and molecular mobility according to the epoxy cure. The cure behavior was explained with monomer fluorescence intensity ($I_{M}$ ), excimer fluorescence intensity ($I_{E}$ ) and $I_{M}$ /$I_{E}$ ratio as a function of cure time, cure temperature and accelerator. The present work agreed with the previous report on the cure behavior of an epoxy-anhydride system studied using DSC or torsion pendulum method. This study also suggests that the use of fluorescence technique may provide information on cure behavior of a thermosetting resin in a low temperature region, which has not been well interpreted by other analytical methods.

• Polymer(Korea)
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• v.27 no.3
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• pp.210-216
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• 2003

4-Vinyl-1-cyclohexene diepoxide (VCE)/diglycidyl ether of bisphenol-A (DGEBA) epoxy blends with benzylquinoxalinium hexafluoroanti-monate were cured using an electron-beam technique. The effect of DGEBA content to VCE on cure behavior, thermal stabilities, and mechanical properties was investigated. The composition of VCE/DGEBA blend system vaned within 100:0, 80:20, 60:40, 40:60, 20:80, and 0:100 wt%. The cure behavior and thermal stability of the cured specimens was monited by near-infrared spectroscopy and thermogravimetric analysis, respectively. Also, the critical stress intensity factor ($_{4}$) test of the cured specimens was performed to study the mechanical interfacial properties. As a result, the decreases of short side-chain structure and chain scission were observed in NIR measurements as the DGEBA content increases, resulting in varying the hydroxyl and carbonyl groups. And, the initial decomposition temperature (IDT), temperature of maximum weight loss (T$\_$max/), and decomposition activation energy (E$\_$d/) as thermal stability factors were increased with increasing the DGEBA content. These results could be explained by mean of decreasing viscosity, stable aromatic ring structure, and grafted interpenetrating polymer network with increasing of DGEBA content. Also, the maximum $_{4}$ value showed at mixing ratio of 40:60 wt% in this blend system. in this blend system.

• Clean Technology
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• v.23 no.4
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• pp.378-387
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• 2017

To obtain epoxy resin with permanently attached flame-retardant groups, phosphorus compound containing di-hydroxyl group [10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phospha phenanthrene-10-oxide, DOPO-HQ] and silicone compound containing di-hydroxyl group (polydimethylsiloxane, hydroxyl terminated, PDMS) were reacted with uncured epoxy prepolymer (diglycidyl ether of bisphenol A, DGEBA) and then cured using 4,4-diaminodiphenylmethane (DDM) as a crosslinking agent. The properties of the resulting epoxy materials were characterized using Fourier transform infrared (FTIR) spectrometer, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), limiting oxygen index (LOI) test/vertical burning test (UL 94-V test), tensile properties test and impact test. This study examined the effect of phosphorus/silicone compound contents on the thermal/mechanical properties and flame retardancy of cured epoxy resins containing phosphorus and silicone compounds. It was found that the thermal/mechanical properties of epoxy resins containing phosphorus and silicone components were higher than those of simple epoxy resin. The flame-retardancy (LOI: 29.9 ~ 31.8% and UL 94-V: V-0) of all samples containing phosphorus compound and phosphrous compound/silicone compound was found to be passed the flame-retardant requirements (LOI: > 30%, UL 94-V: V-0) of LOI and vertical burning tests. However, the flame-retardancy (LOI: 21.4% and UL 94-V: no rating) of simple epoxy resin was found to be failed the flame-retardant requirements.

• Polymer(Korea)
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• v.37 no.5
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• pp.557-562
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• 2013

The thermal expansion and mechanical properties of diglycidyl ether of bisphenol A (DGEBA) with mercaptan hardeners were studied by a comparative method with an amine-adduct type hardener. Thermal expansion and dynamic mechanical properties were measured by thermo mechanical analysis (TMA) and dynamic mechanical ananlysis (DMA), respectively. The $T_g$ and the coefficient of thermal expansion (CTE) of epoxy/amine-adduct type hardener system were $82.6^{\circ}C$ and 71.2 $ppm/^{\circ}C$, respectively. As the number of -SH functional group of mercaptan hardener increased, the $T_g$ rapidly decreased and gradually increased up to ca. $80^{\circ}C$ and the CTE under the $T_g$ rapidly increased to ca. 200 $ppm/^{\circ}C$ from 80 $ppm/^{\circ}C$ and decreased to ca. 100 $ppm/^{\circ}C$. The crosslinking density of epoxy with amine-adduct type hardener was ca.1.5 $mol/cm^3$, while that of epoxy with mercaptan hardeners increased from 1.0 to 1.7 $mol/cm^3$, as the number of -SH functional group increased. The storage modulus can increase up to 2700MPa at $30^{\circ}C$.

• Journal of Electrical Engineering and Technology
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• v.13 no.6
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• pp.2425-2433
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• 2018

This study investigates a new organic based material and its dielectric and mechanical properties. It is a comprehensive nanocomposite comprising a combination of various types of nanofillers with hydrophobic silica nanoparticles (AEROSIL R 974) as a matrix modifier and a polyamide nano nonwoven textile, Ultramid-Polyamide 6, pulped in the electrostatic field as a dielectric barrier. The polymer matrix is an epoxy network based on diglycidyl ether of bisphenol A (DGEBA) and cycloaliphatic diamine (Laromine C260). The designed nanocomposite material is an alternative to the conventional three-component composites containing fiberglass and mica with properties that exceed current electroinsulating systems (volume resistivity on the order of $10^{16}{\Omega}{\cdot}m$, dissipation factor tan ${\delta}=4.7{\cdot}10^{-3}$, dielectric strength 39 kV/mm).