• Applied Chemistry for Engineering
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• v.8 no.6
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• pp.973-978
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• 1997

The toughness and morphology of epoxy resin based on diglycidyl ether of bisphenol A(DGEBA) cured with of tris (dimethylaminomethy]) phenol(DMP-30) and castor oil (CO) as a toughening modifier have been studied. Mixtures of CO and an epoxy resin showed a higher miscibility than the classical CTBN modified epoxy resin. The glass transition temperature($T_g$) was decreased with the CO content and the cure temperature. It is interpreted that the networks of epoxy matrix obtained at high temperature are apparently looser and more flexible due to the lower crosslinking density. The toughness was slightly increased with the CO content at $40^{\circ}C$ of curing temperature. The toughness increased with increasing the cure temperature and CO content.

• Polymer(Korea)
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• v.37 no.1
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• pp.41-46
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• 2013

The glass transition temperature ($T_g$) and conversion (${\alpha}$) were measured for a diglycidyl ether of bisphenol A (DGEBA) epoxy/aromatic amine system incorporated with an organic-inorganic hybrid molecule, polyhedral oligomeric silsesquioxane (POSS). Samples isothermally cured at varying cure temperatures and times were analyzed by differential scanning calorimetry (DSC). $T_g$ vs. ln (time) data at an arbitrary reference were superposed by time-temperature shifts for the kinetically controlled reaction, and the shift factors were used to calculate an Arrhenius activation energy. Influence of POSS was investigated from $T_g$ vs. ${\alpha}$ data, which in turn were fitted with DiBenedetto equation.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.667-672
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• 1995

Cure kinetics of DGEBA(diglycidyl ether of bisphenol A)/MDA(4, 4'-methylene dianiline)/SN(succinonitrile) system and DGEBA/MDA/SN/HQ(hydroquinone) system was studied by Kissinger equation and Fractional life method through DSC in the temperature range of 85∼150$^{\circ}C$. As cure temperature was increased, reaction rate increased and reaction order was almost constant. The reaction rate of the system with HQ as a catalyst was more higher and activation energy of that was lower about 20% than those of the system without HQ. Starting temperature of cure reaction for DGEBA/MDA/SN/HQ system decreased about 30$^{\circ}C$ than that of DGEBA/MDA/SN system.

• Macromolecular Research
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• v.10 no.6
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• pp.332-338
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• 2002

The effect of an electron beam and ${\gamma}$-ray irradiation on the curing of epoxy resins was investigated. Diglycidyl ether of bisphenol A (DGEBA) and diglycidyl ether of bisphenol F (DGEBF) as epoxy resin were used. The epoxy resins containing 1.0-3.() wt% of triarylsulphonium hexafluoroantimonate(TASHFA) and triarylsulphonium hexafluorophosphate(TASHFP) as initiator were irradiated under nitrogen at room temperature with different dosage of EB and ${\gamma}$-rays from a Co$^{60}$ u source. The chemical and mechanical characteristics of irradiated epoxy resins were compared after curing of EB and ${\gamma}$-ray irradiation. The thermal properties of cured epoxy were investigated using dynamic mechanical thermal analysis. The chemical structures of cured epoxy were characterized using near infrared spectroscopy. Mechanical properties such as flexural strength, modulus were measured. The gel fraction of DGEBA with ${\gamma}$-ray was higher than that of the epoxy with EB at the same dose. Young's modulus of the sample irradiated by ${\gamma}$-ray is higher than that of sample cured by EB. From the result of strain at yield, it was found that the epoxy cured by ${\gamma}$-ray had a higher stiff property compared with the irradiated by EB.

• Clean Technology
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• v.12 no.1
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• pp.27-35
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• 2006

Main compositions of powder paint based on thermoset type epoxy resin consist of epoxy resin for powder coating, curing agent, filler and pigment. The curing system used in this study was based on diglycidyl ether of bisphenol-A (DGEBA) and dicyan diamide (DICY). The curing behavior and rheological properties of powder coating material were investigated using DSC and rheometer, respectively. And the adhesion strength between steel and powder coating material was measured using lap shear geometry. The optimum formulation of epoxy powder paint obtained from this study was base resin of 100 phr, DICY of 6 phr, $CaCO_3$ of 20 phr, and $TiO_2$ of 10 phr.

• Korean Journal of Materials Research
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• v.9 no.5
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• pp.467-472
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• 1999

The isothermal cure behavior of diglycidyl ether of bisphenol A(DGEBA) 4,4'-methylene dianiline(MDA) system with various contents of neopentyl glycol(NPG) has been analyzed by differential scanning calorimetry(DSC). TO increase the cure rate of DGEBA/MDA system, NPG was introduced as an accelerator. Regardless of the NPG content, the shape of the conversion curves showed sigmoid indication that DGEBA/MDA/NPG system followed autocatalytic cure reaction. The cure reaction of DGEBA/MDA system increased with the increment of NPG content and it was due to the catalytic role of hydroxyl groups of NPG.

• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.200-204
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• 2008

The curing kinetics of diglycidyl ether of bisphenol F (DGEBF) with an asymmetric cycloaliphatic amine curing agent were examined by thermal analysis in both isothermal and dynamic curing conditions. From the residual curing of the samples partially cured in isothermal condition and from the dynamic curing with various heating rates, it was found that there exist two kinds of reactions such as at low temperature and at high temperature regions. It was thus also found that the cure parameters obtained from the isothermal curing kinetic model hardly estimate experimental results for a degree of cure larger than 0.6. The activation energies and frequency factors of these two kinds of reactions were obtained from the dynamic curing experiments with various heating rates. From the curing analysis, it was verified that the total cure kinetics for low degrees of cure is dominated by the cure reaction in the low temperature region.

• Elastomers and Composites
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• v.38 no.3
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• pp.213-226
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• 2003

The cure and rheological behavior of diglycidyl ether of bisphenol F/nadic methyl anhydride resin system with the kinds of imidazole were studied using a differential scanning calorimeter (DSC) and a rotational rheometer. The isothermal traces were employed to analyze cure reaction. The DGEBF/ anhydride conversion profiles showed autocatalyzed reaction characterized by maximum conversion rate at $20{\sim}40 %$ of the reaction. The rate constants ($k_1,\;k_2$) showed temperature dependance, but reaction order did not. The reaction order (m+n) was calculated to be close to 3. There are two reaction mechanisms with the kinds oi catalyst. The gel time was determined by using G'-G" crossover method, and the activation energy was obtained from this results. From measurement of rheological properties it was found that the logarithmic 1:elation time of fused silica filled DBEBF epoxy compounds linearly increased with the content of filler and decreased with temperature. The highly filled epoxy compounds showed typical pseudoplastic behavior, and the viscosity of those decreased with increasing maximum packing ratio.

• Transactions on Electrical and Electronic Materials
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• v.14 no.6
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• pp.317-320
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• 2013

Partial discharge resistance for the epoxy systems with two diluents was investigated in the rod-plane electrodes arrangement, and the effect of electric frequency on the partial discharge resistance was also studied. Diglycidyl ether of bisphenol A (DGEBA) type epoxy was used as a base resin, and 1,4-butanediol diglycidyl ether (BDGE) or polyglycol (PG) as a reactive diluent was introduced to the DGEBA system, in order to decrease the viscosity of the DGEBA epoxy system. BDGE was acted as a chain extender, and PG acted as a flexibilizer, after the curing reaction. To measure the partial discharge resistance, 5 kV alternating current (ac) with three different frequencies (60, 500 and 1,000 Hz) was applied to the specimen in a rod-plane electrode arrangement, at $30^{\circ}C$. PG had a good effect, while BDGE had a bad effect on the partial discharge resistance of the DGEBA system, regardless of the electric frequency.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.65-69
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• 2019

The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.