• 제목/요약/키워드: Barrier properties

검색결과 982건 처리시간 0.024초

열전 박막 $Bi_{0.5}Sb_{1.5}Te_3/Bi_2Te_{2.4}Se_{0.6} p/n$ 접합에서의 확산 장벽에 관한 연구 (A Study on the Diffusion Barrier at the p/n Junctions of $Bi_{0.5}Sb_{1.5}Te_3/Bi_2Te_{2.4}Se_{0.6} p/n$ Thermoelectric Thin Films)

  • 김일호;이동희
    • 한국재료학회지
    • /
    • 제6권7호
    • /
    • pp.678-683
    • /
    • 1996
  • In the fabrication processes of thin film thermoelectrics, a subsequent annealing treatment is inevitable to reduce the defects and residual stresses introduced during the film growth, and to make the uniform carrier concentration of the film. However, the diffusion-induced atomic redistribution and the broadening of p/n junction region are expected to affect the thermoelectric properties of thin film modules. The present study intends to investigate the diffusion at the p/n junctions of thermoelectric thin films and to relate it to the property changes. The film junctions of p-type(Bi0.5Sb1.5Te3)and n-type(Bi2Te2.4Se0.6)were prepared by the flash evaporation method. Aluminum thin layer was employed as a diffusion barrier between p-and n-type films of the junction. This was found to be an effective barrier by showing a negligible diffusion into both type films. After annealing treatment, the thermoelectric properties of p/n couples with aluminum barrier layer were accordingly retained their properties without any deterioration.

  • PDF

흡수성 치주조직 재생 차폐막에 대한 비교연구 (Comparative study on absorbable periodontal tissue regeneration barrier membranes)

  • 조영채;정다연;이득용
    • 한국결정성장학회지
    • /
    • 제33권2호
    • /
    • pp.71-77
    • /
    • 2023
  • 흡수성 치주조직 재생유도재(국내 4개, 국외 2개) 총 6개 제품을 비교 연구하였다. 이종소재 차폐막의 경우, 콜라겐 제품은 우수한 기계적 강도를 보였으나 연신율이 작았다. 돼지심막은 우수한 기계적 물성에도 불구하고 두꺼운 두께로 사용에 제약이 되었다. 전기방사법으로 제조한 독일 PLLA/콜라겐 하이브리드형 복합 차폐막은 강도값과 흡수도는 낮았지만, 합성 및 천연고분자를 적절히 혼합함으로써 원하는 특성의 기계적 물성과 생체적합성 구현이 가능하였다. 본 연구에서 DA02(PLLA/젤라틴) 하이브리드형 복합고분자 소재는 기계적 물성과 생체적합성이 적절하여 100 % 수입에 의존하는 하이브리드형 흡수성 치주조직 재생 차폐막에 적용이 가능하였다.

멤브레인 형 2차 방벽 이방성 복합재료의 섬유방향에 따른 기계적 성능 평가 (Evaluation of Mechanical Performance of Membrane Type Secondary Barrier Anisotropic Composites depending on Fiber Direction)

  • 정연제;김정대;황병관;김희태;오훈규;김용태;박성보;이제명
    • 대한조선학회논문집
    • /
    • 제57권3호
    • /
    • pp.168-174
    • /
    • 2020
  • Recently, the size of Liquified Natural Gas (LNG) carriers has been increasing, in turn increasing the load generated during operation. To handle this load, the thickness of LNG Cargo Containment Systems (CCSs) should be increased. Despite increasing the thickness of LNG CCSs, a secondary barrier is still used in conventional thickness. Therefore, the mechanical performance of the existing secondary barrier should be verified. In this study, tensile test of the secondary barrier was performed to evaluate mechanical properties under several low- and cryogenic-temperature conditions considering LNG environment, and in each fiber direction considering that the secondary barrier is composed of anisotropic composite materials depending on the glass fibers. Additionally, the coefficient of thermal expansion was measured by considering the degradation of the mechanical properties of the secondary barrier caused by the generated thermal stress during periodical unloading. As a result, the mechanical performance of secondary barrier in the Machine Direction (MD) was generally found to be superior than that in the Transverse Direction (TD) owing to the warp interlock structure of the glass fibers.

Soda lime glass기판위의 barrier층$(SiO_2,\;Al_2O_3)$이 ITO박막특성에 미치는 영향 (Effect of ITO thin films characterization by barrier layers$(SiO_2\;and\;Al_2O_3)$ on soda lime glass substrate)

  • 이정민;최병현;지미정;안용태;주병권
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
    • /
    • pp.292-292
    • /
    • 2007
  • To apply PDP panel, Soda lime glass(SLG) is cheeper than Non-alkali glass and PD-200 glass but has problems such as low strain temperature and ion diffusion by alkali metal oxide. In this paper suggest the methode that prohibits ion diffusion by deposing barrier layer on SLG. Indium thin oxide(ITO) thin films and barrier layers were prepared on SLG substrate by Rf-magnetron sputtering. These films show a high electrical resistivity and rough uniformity as compared with PD-200 glass due to the alkali ion from the SLG on diffuse to the ITO film by the heat treatment. However these properties can be improved by introducing a barrier layer of $SiO_2\;or\;Al_2O_3$ between ITO film and SLG substrate. The characteristics of films were examined by the 4-point probe, SEM, UV-VIS spectrometer, and X-ray diffraction. GDS analysis confirmed that barrier layer inhibited Na and Ka ion diffusion from SLG. Especially ITO films deposited on the $Al_2O_3$ barrier layer had higher properties than those deposited on the $SiO_2$ barrier layer.

  • PDF

Effect of Thermal Treatment on AIOx/Co90Fe10 Interface of Magnetic Tunnel Junctions Prepared by Radical Oxidation

  • Lee, Don-Koun;In, Jang-Sik;Hong, Jong-Ill
    • Journal of Magnetics
    • /
    • 제10권4호
    • /
    • pp.137-141
    • /
    • 2005
  • We confirmed that the improvement in properties of magnetic tunnel junctions prepared by radical oxidation after thermal treatment was mostly resulted from the redistribution of oxygen at the $AIOx/Co_{90}Fe_{10}$ interface. The as-deposited Al oxide barrier was oxygen-deficient but most of it re-oxidized into $Al_2O_3$, the thermodynamically stable stoichiometric phase, through thermal treatment. As a result, the effective barrier height was increased from 1.52 eV to 2.27 eV. On the other hand, the effective barrier width was decreased from 8.2 ${\AA}$ to 7.5 ${\AA}$. X-ray absorption spectra of Fe and Co clearly showed that the oxygen in the CoFe layer diffused back into the Al barrier and thereby enriched the barrier to close to a stoichiometirc $Al_2O_3$ phase. The oxygen bonded with Co and Fe diffused back by 6.8 ${\AA}$ and 4.5 ${\AA}$ after thermal treatment, respectively. Our results confirm that controlling the chemical structures of the interface is important to improve the properties of magnetic tunnel junctions.

음향공명 방음벽 연구 (A Study on the Sound Resonating Barrier)

  • 이준신;김태룡
    • 한국소음진동공학회논문집
    • /
    • 제12권6호
    • /
    • pp.413-419
    • /
    • 2002
  • Noise barriers are widely used to reduce the sound level propagating from highways, railways or factories to residential areas. The reduced noise level at a receiver point is then determined by the diffracted waves around the edge of the barrier as well as by the transmitted waves through the barrier. 1'or proper usage, many studies either theoretical or experimental have been made with the objective of precisely Predicting the acoustic field and improving the noise attenuating properties of barriers. In this study. a simple scattering model. a line acoustic source scattered by an infinite cylinder, is introduced to simply Investigate the sound attenuation efficiency of a sound-resonating barrier. From this model study, it is observed that the sound-resonating harrier can be used as a good sound-shielding element especially for the pure-tone noise generated from the transformer. Large sound-attenuation is achieved by applying the sound-resonating barrier to the large transformers in a substation.

NiSi 접촉과 Cu 플러그/Ti 확산방지층의 동시 형성 연구 (Simultaneous Formation of NiSi Contact and Cu Plug/Ti Barrier)

  • 배규식
    • 한국재료학회지
    • /
    • 제20권6호
    • /
    • pp.338-343
    • /
    • 2010
  • As an alternative to the W plug used in MOSFETs, a Cu plug with a NiSi contact using Ta / TaN as a diffusion barrier is currently being considered. Conventionally, Ni was first deposited and then NiSi was formed, followed by the barrier and Cu deposition. In this study, Ti was employed as a barrier material and simultaneous formation of the NiSi contact and Cu plug / Ti barrier was attempted. Cu(100 nm) / Ti / Ni(20 nm) with varying Ti thicknesses were deposited on a Si substrate and annealed at $4000^{\circ}C$ for 30 min. For comparison, Cu/Ti/NiSi thin films were also formed by the conventional method. Optical Microscopy (OM), Scanning Probe Microscopy (SPM), X-Ray Diffractometry (XRD), and Auger Electron Microscopy (AES) analysis were performed to characterize the inter-diffusion properties. For a Ti interlayer thicker than 50 nm, the NiSi formation was incomplete, although Cu diffusion was inhibited by the Ti barrier. For a Ti thickness of 20 nm and less, an almost stoichiometric NiSi contact along with the Cu plug and Ti barrier layers was formed. The results were comparable to that formed by the conventional method and showed that this alternative process has potential as a formation process for the Cu plug/Ti barrier/NiSi contact system.

Curdlan 복합 가식성 필름의 제조와 물성 (Preparation and Physical Properties of Curdlan Composite Edible Films)

  • 한윤정;노희진;김석신
    • 한국식품과학회지
    • /
    • 제39권2호
    • /
    • pp.158-163
    • /
    • 2007
  • 본 연구는 curdlan 복합필름을 제조하고 물성을 비교하기 위해 수행되었다. 우선 low set 방식과 high set 방식 중 적절한 방식을 선정하였고, 순차적으로 AMG나 oleic acid 중에서 적절한 방습소재를 선정하였으며, PB와 PIB 중에서 적절한 물성개량제를 선정하고자 하였다. 그 결과 high set 필름이 low set 필름보다 신장율은 다소 작지만 인장강도가 높고 수증기 투과도가 낮기 때문에 curdlan 복합필름 제조에는 high set 방법이 더 적합하며 이때 PEG는 2.0g 첨가하는 것이 유리할 것으로 판단하였다. 또한 oleic acid 첨가군이 AMG 첨가군보다 인장강도와 신장율이 더 크고, 수증기투과도는 더 낮은 편이며 특히 oleic acid 0.3g 첨가한 경우 신장율과 수증기 차단성 면에서 유리하므로 방습소재로서 oleic acid를 0.3g 첨가하는 것이 적합할 것을 판단하였다. PIB 첨가군이나 PB 첨가군 모두 인장강도와 수증기투과도는 비슷하나 신장율의 경우는 PIB 첨가군이 PB 첨가군보다 더 큰 것으로 나타났으므로 유연성과 관련된 물성개량 측면에서는 PIB 첨가가 더 유리할 것으로 판단하였다. 종합적으로 curdlan에 가소제 PEG와 방습소재 oleic acid와 물성개량제 PIB를 첨가하는 것이 유연성과 관련된 물성 면에서 가장 유리할 것으로 판단하였다.

DLC 박막의 전기전도성, 투과율 및 가스베리어 특성에 관한 연구 (Study on Electrical Conductivity, Transmittance and Gas Barrier Properties of DLC Thin Films)

  • 박새봄;김치환;김태규
    • 열처리공학회지
    • /
    • 제31권4호
    • /
    • pp.187-193
    • /
    • 2018
  • In this study, the electrical conductivity, transmittance and gas barrier properties of diamond-like carbon (DLC) thin films were studied. DLC is an insulator, and has transmittance and oxygen gas barrier properties varying depending on the thickness of the thin film. Recently, many researchers have been trying to apply DLC properties to specific industrial conditions. The DLC thin films were deposited by PECVD (Plasma Enhanced Chemical Vapor Deposition) process. The doping gas was used for the DLC film to have electrical conductivity, and the optimum conditions of transmittance and gas barrier properties were established by adjusting the gas ratio and DLC thickness. In order to improve the electrical conductivity of the DLC thin film, $N_2$ doping gas was used for $CH_4$ or $C_2H_2$ gas. Then, a heat treatment process was performed for 30 minutes in a box furnace set at $200^{\circ}C$. The lowest sheet resistance value of the DLC film was found to be $18.11k{\Omega}/cm^2$. On the other hand, the maximum transmittance of the DLC film deposited on the PET substrate was 98.8%, and the minimum oxygen transmission rate (OTR) of the DLC film of $C_2H_2$ gas was 0.83.

차세대 Barrier 물질 개발 동향 (A Practical Engineering for Advanced Barrier Materials: A Brief Review)

  • 안희성;이종석
    • 멤브레인
    • /
    • 제25권2호
    • /
    • pp.85-98
    • /
    • 2015
  • 고분자의 용이한 가공성과 우수한 투명성, 그리고 합리적인 비용 효율로 인해 식품 포장 산업에서 금속이나 유리용기들을 고분자 기반의 포장 소재들로 대체하려는 경향이 전 세계적으로 널리 퍼지고 있다. Barrier 고분자들은 산소, 이산화탄소, 수증기 등 대기 가스에 대한 낮은 투과성을 나타내고 있어 식품 포장 산업 이용에 유용하다. 이러한 식품 포장 산업의 전반적인 추세와 함께, 산소에 민감한 주스, 착향 음료, 그리고 에너지 음료 등 새로운 식품 산업의 성장으로 인해 고성능의 barrier 특성, 특히 $O_2$$CO_2$에 대해 낮은 투과성을 지닌 고분자 포장 소재의 개발이 시급한 상황이다. 기존의 고분자에 기반한 barrier의 성능 향상은 새로운 식품 포장 산업에 급격한 변화를 줄 것이다. 본 총설에서는 (1) antiplasticization을 유도한 barrier 소재들, (2) antiplasticization과 crystallization을 사용한 barrier 성능 상승 효과, (3) 새로운 barrier 고분자들, (4) 나노합성 소재, (5) 혼합 고분자 등과 더불어, 차세대 포장 소재들의 특성 분석을 소개하고자 한다.